NT
Features
n
Two resistance-matched PTCs in a
plastic housing
n
Narrow resistance tolerance
n
RoHS compliant*
Applications
Used as a secondary overcurrent protection
device in:
n
Customer Premise Equipment (CPE)
n
Central Office (CO)
n
Access equipment
*R
oH
S
C
OM
PL
IA
LE
AD
F
RE
E
CMF-SDP Series - Telecom CPTC Resettable Fuses
Typ. Time
to Trip @
Imax / 230
VAC
Seconds
0.45
3.8
3.8
0.2
0.3
0.06
0.2
0.13
0.2
0.12
Electrical Characteristics
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Model
CMF-SDP07
CMF-SDP10
CMF-SDP10A
CMF-SDP25
CMF-SDP25A
CMF-SDP35
CMF-SDP35A
CMF-SDP50
CMF-SDP50A
CMF-SDP75
Induction
Voltage
Withstand
VAC
250
250
250
250
250
600
600
600
600
600
Rated
Voltage
Volts
230
230
230
230
230
230
230
230
230
230
Rated
Resistance
(RN)
Ohms Tolerance
7
±20 %
10
±20 %
10
±20 %
25
±20 %
25
±20 %
35
+15/-20 %
35
+15/-20 %
50
±15 %
50
±15 %
75
±20 %
Resistance
Matching in
Housing
Ohms
<=1.0
<=1.0
<=1.0
<=1.0
<=1.0
<=1.0
<=1.0
<=1.0
<=1.0
<=2.0
Hold
Current
Amps @ 25 °C
0.080
0.180
0.150
0.130
0.130
0.110
0.110
0.090
0.090
0.070
Trip
Current
Amps @ 25 °C
0.200
0.360
0.360
0.260
0.260
0.230
0.230
0.190
0.190
0.150
Imax @
230 VAC
Amps
3.0
1.0
1.0
2.8
2.8
4.6
2.5
2.5
2.5
2.5
Operating Temperature Range: -40 °C to +125 °C.
Test Procedures And Requirements For Model CMF-SDP Series
Primary
Test
Protection
Test Condition
Requirements
Mains Power Contact - ITU-T K.20, K.21 .... None .............. 230 V rms, 10 ohms, 15 Min. ..................................................... (Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21............. None .............. 600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. ...... (Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21............. GDT ............... 600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ......... (Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21............. GDT ............... 600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ......... (Ri-Rf) / Ri < ±10 %
Lightning Surge - ITU-T K.20, K.21 ..................................... 10/700
μs,
25 ohms, 1.0 kV, 10 Tests, every 1 Min. ................ (Ri-Rf) / Ri < ±10 %
Lightning Surge ................................................................... 10/1000
μs,
60 ohms, 1.5 kV, 30 Tests, every 3 Min. ............... (Ri-Rf) / Ri < ±10 %
Ri = R initial
Rf = R final
Typical Part Marking
How to Order
Represents total content. Layout may vary.
PART
IDENTIFICATION:
07P = CMF-SDP07
10P = CMF-SDP10
10PA = CMF-SDP10A
25P = CMF-SDP25
25PA = CMF-SDP25A
35P = CMF-SDP35
35PA = CMF-SDP35A
50P = CMF-SDP50
50PA = CMF-SDP50A
75P = CMF-SDP75
MANUFACTURER'S
TRADEMARK
BI-WEEKLY
DATE CODE:
WEEK 13-14 = G
YEAR CODE:
8 = 2008
CMF - SD P 35 A -XX - 2
Product Designator
Style
SD = Surface Mount
Dual Pkg.
Housing
P = Plastic
Rated Resistance (RN)
7-75 (7-75 Ohms)
Footprint and Height Option
Blank = Standard Product
A = Reduced Footprint and Height
Resistance Tolerance Option
Blank = Standard
-XX = XX %; e.g. -10 = ±10 %
Packaging
- 2 = Tape & Reel
3 5P 8 G
Asia-Pacific:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CMF-SDP Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
300
250
200
150
100
50
0
160–220
10–20
Time (seconds)
120
Preheating
Soldering
Cooling
Solder reflow
•
•
•
•
•
•
Temperature (ϒ
C)
Devices are not designed to be wave soldered to the bottom side of the
board.
Gluing the devices is not recommended.
Recommended maximum paste thickness is 0.25 mm (.010 inch).
Recommended reflow methods: IR, vapor phase oven, hot air oven.
Note:
Devices can be cleaned using standard industry methods and solvents.
Rework
•
If reflow temperatures exceed the recommended profile, devices may not
meet the performance requirements.
A device should not be reworked.
Product Dimensions
CMF-SDP05, 07, 10, 25, 35, 50 & 75
CMF-SDP05, 07, 10, 25, 35, 50 & 75
CMF-SDP10A, 25A, 35A, 50A & 75A
CMF-SDP10A, 25A, 35A, 50A & 75A
8.75
(.344) MAX.
8.75
(.344) MAX.
11.5
(.453)
MAX.11.5
(.453)
MAX.
10.2
(402)
MAX.
10.2
(402)
MAX.
CMF-SDP05
CMF-SD
10.2
402)
MAX.
10.2
(402)
MAX.
9.0
MAX.
(.354)
9.0
MAX.
(.354)
2.6
(.102)
2.6
(.102)
5.0
(.197)
11.05.0
MAX.
(.433)
(.197)
11.0
MAX.
(.433)
9.0
(.354)
9.0
(.354)
11.0
(.433)
5.0
(.197)
7.6
(.299)
11.0
(.433)
MAX.
8.75
(.344)
MAX.
8.75
(.344)
2.4
(.094)
3.9 2.4
(.094)
(.154)
3.9
(.154)
0.5
(.020)
2 PLCS.
0.5
(.020)
2 PLCS.
7.2
MAX.
(.283)
7.2
MAX.
(.283)
7.2
(.283)
MAX.7.2
(.283)
MAX.
6.3
(.248)
6.3
(.248)
(.
Recommended Pad Layout
3
8)
3.9
(.154)
5.0
(.197)
3.2
(.126)
3.2
(.126)
2.0
(.079)
2.6
(.102)
7.6
(.299)
8.2
(.323)
3.2
(.126)
3.2
(.126)
2.0
(.079)
3.9
(.154)
2.4
(.094)
10.0
(.394)
10.0
(.394)
2.0
(.079)
2.6
(.102)
8.2
(.323)
2.0
(.079)
2.4
(.094)
10
(.39
Packaging - Tape and Reel: 350 pcs. per reel
Packaging - Tape and Reel: 350 pcs. per reel
DIMENSIONS:
MM
(INCHES)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CMF-SDP SERIES, REV. E, 07/16
CMF-SDP Series Tape and Reel Specifications
CMF-SDP10-2, CMF-SDP25-2,
CMF-SDP-35-2, CMF-SDP50-2,
CMF-SDP75-2
24.0 ±0.5
(0.945 ±0.020)
4.0
(0.157)
16.0
(0.630)
2.0
(0.079)
9.2 ± 0.2
(0.362 ± 0.008)
11.0 ± 0.2
(0.441 ± 0.008)
1.5
(0.059)
11.5
(0.453)
1.75
(0.069)
0.5 ± 0.15
(0.020 ± 0.006)
11.5 ± 0.2
(0.453 ± 0.008)
Tape Dimensions per EIA 481-2
CMF-SDP10A-2, CMF-SDP25A-2,
CMF-SDP35A-2, CMF-SDP50A-2
24.0 ±0.5
(0.945 ±0.020)
4.0
(0.157)
16.0
(0.630)
2.0
(0.079)
7.5 ± 0.2
(0.295 ± 0.008)
9.0 ± 0.2
(0.354 ± 0.008)
1.5
(0.059)
11.5
(0.453)
1.75
(0.069)
0.5 ± 0.15
(0.020 ± 0.006)
10.0 ± 0.2
(0.394 ± 0.008)
W
P0
P
P2
A0
B0
D
F
E
t
K0
D
P2
P0
E
T
-0.4
(-.016)
F
W
B0
P
A0
K0
DIMENSIONS:
MM
(INCHES)
330 -2/+0
(12.99 -.079/+0)
DIA.
24.4
(.961)
MIN.
30.4
(1.197)
MAX.
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
(3.94 ± .059)
DIA.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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