EMI5204MU, EMI5206MU,
EMI5208MU
Four-Six-Eight-Channel EMI
Filter with Integrated ESD
Protection
The EMI520xMU Series are a 4, 6, 8−channel (C−R−C) Pi−style
EMI filter array with integrated ESD protection. Its typical component
values of R = 100
W
and C = 7 pF deliver a cutoff frequency of 250
MHz and stop band attenuation greater than 20 dB from 800 MHz to
5.0 GHz.
This performance makes the part ideal for parallel interfaces with
data rates up to 167 Mbps in applications where wireless interference
must be minimized. The specified attenuation range is very effective
in minimizing interference from 2G/3G, GPS, Bluetooth® and
WLAN signals.
The EMI520xMU Series is available in the low−profile 4, 6, 8−lead,
0.5mm thick UDFN packages with 0.4mm lead pitch.
Features/Benefits
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MARKING
DIAGRAMS
8
1
UDFN8
CASE 517BC
54 MG
G
1
12
1
UDFN12
CASE 517BD
1
56 MG
G
16
1
UDFN16
CASE 517BE
58 MG
G
•
±8.0
kV ESD Protection on each channel (IEC61000−4−2 Level 4,
Contact Discharge)
•
R/C Values of 100
W
and 7 pF deliver Exceptional S21 Performance
Characteristics of 250 MHz f
3dB
and 20 dB Stop Band Attenuation
from 800 MHz to 5.0 GHz
•
Integrated EMI/ESD System Solution in UDFN Package Offers
Exceptional Cost, System Reliability and Space Savings
•
This is a Pb−Free Device
Applications
XX
M
G
1
= Specific Device Code
= Date Code
= Pb−Free Package
(*Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
•
EMI Filtering for LCD and Camera Data Lines
•
EMI Filtering and Protection for I/O Ports and Keypads
0
−5
−10
Filter + ESD
n
Filter + ESD
n
S21 (dB)
R=100
W
C
d
= 7 pF
C
d
= 7 pF
−15
−20
−25
−30
−35
−40
1E+6
10E+6
100E+6
FREQUENCY (Hz)
1E+9
10E+9
See Table 1 for pin description
Figure 1. Electrical Schematic
Figure 2. Typical Insertion Loss Curve
©
Semiconductor Components Industries, LLC, 2011
July, 2011
−
Rev. 0
1
Publication Order Number:
EMI5204MU/D
EMI5204MU, EMI5206MU, EMI5208MU
1 2 3 4
GND
8 7 6 5
EMI5204MU
1 2 3 4 5 6
GND
12 1110 9 8 7
EMI5206MU
1 2 3 4 5 6 7 8
GND
1615141312 11 10 9
EMI5208MU
Figure 3. Pin Diagram
(Bottom View)
Table 1. FUNCTIONAL PIN DESCRIPTION
Filter
EMI5204MU
Filter 1
Filter 2
Filter 3
Filter 4
Filter 5
Filter 6
Filter 7
Filter 8
Ground Pad
GND
GND
1&8
2&7
3&6
4&5
Device Pins
EMI5206MU
1 & 12
2 & 11
3 & 10
4&9
5&8
6&7
EMI5208MU
1 & 16
2 & 15
3 & 14
4 & 13
5 & 12
6 & 11
7 & 10
8&9
GND
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
Filter + ESD Channel 5
Filter + ESD Channel 6
Filter + ESD Channel 7
Filter + ESD Channel 8
Ground
Description
MAXIMUM RATINGS
Parameter
ESD Discharge IEC61000−4−2
Operating Temperature Range
Storage Temperature Range
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Contact Discharge
Symbol
V
PP
T
OP
T
STG
T
L
Value
8.0
−40
to 85
−55
to 150
260
Unit
kV
°C
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted)
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Leakage Current
Resistance
Diode Capacitance
Line Capacitance
3 dB Cut−Off Frequency (Note 1)
1. 50
W
source and 50
W
load termination.
Symbol
V
RWM
V
BR
I
R
R
A
C
d
C
L
f
3dB
I
R
= 1.0 mA
V
RWM
= 3.3 V
I
R
= 10 mA
V
R
= 2.5 V, f = 1.0 MHz
V
R
= 2.5 V, f = 1.0 MHz
Above this frequency,
appreciable attenuation occurs
85
100
7.0
14
250
6.0
7.0
Test Conditions
Min
Typ
Max
5.0
8.0
100
115
11
22
Unit
V
V
nA
W
pF
pF
MHz
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2
EMI5204MU, EMI5206MU, EMI5208MU
Theory of Operation
The EMI520x combines ESD protection and EMI
filtering conveniently into a small package for today’s size
constrained applications. The capacitance inherent to a
typical protection diode is utilized to provide the
capacitance value necessary to create the desired frequency
response based upon the series resistance in the filter. By
combining this functionality into one device, a large number
of discrete components are integrated into one small
package saving valuable board space and reducing BOM
count and cost in the application.
Application Example
The accepted practice for specifying bandwidth in a filter
is to use the 3 dB cutoff frequency. Utilizing points such as
the 6 dB or 9 dB cutoff frequencies results in signal
degradation in an application. This can be illustrated in an
application example. A typical application would include
EMI filtering of data lines in a camera or display interface.
In such an example it is important to first understand the
signal and its spectral content. By understanding these
things, an appropriate filter can be selected for the desired
application. A typical data signal is pattern of 1’s and 0’s
transmitted over a line in a form similar to a square wave.
The maximum frequency of such a signal would be the
pattern 1−0−1−0 such that for a signal with a data rate of
100 Mbps, the maximum frequency component would be
50 MHz. The next item to consider is the spectral content of
the signal, which can be understood with the Fourier series
approximation of a square wave, shown below in
Equations 1 and 2 in the Fourier series approximation.
From this it can be seen that a square wave consists of odd
order harmonics and to fully construct a square wave n must
go to infinity. However, to retain an acceptable portion of the
waveform, the first two terms are generally sufficient. These
two terms contain about 85% of the signal amplitude and
allow a reasonable square wave to be reconstructed.
Therefore, to reasonably pass a square wave of frequency x
the minimum filter bandwidth necessary is 3x. All
ON Semiconductor EMI filters are rated according to this
principle. Attempting to violate this principle will result in
significant rounding of the waveform and cause problems in
transmitting the correct data. For example, take the filter
with the response shown in Figure 4 and apply three
different data waveforms. To calculate these three different
frequencies, the 3 dB, 6 dB, and 9 dB bandwidths will be
used.
Equation 1:
a
1 2
1
x(t)
+ )
sin (2n
*
1)
w
0
t
2
p
n
+
1 2n
*
1
S
(eq. 1)
Equation 2 (Simplified form of Equation 1):
x(t)
+
1
)
2
2 sin
w
0
t
p
1
(eq. 2)
)
p20
sin 3w
0
t
3
)
p20
sin 5w
0
t
5
)AAA
−3
dB
−6
dB
−9
dB
MAGNITUDE
(dB)
f
1
f
2
f
3
100k
1M
10M
100M
1G
10G
FREQUENCY
(Hz)
Figure 4. Filter Bandwidth
From the above paragraphs it is shown that the maximum
supported frequency of a waveform that can be passed
through the filter can be found by dividing the bandwidth by
a factor of three (to obtain the corresponding data rate
multiply the result by two). The following table gives the
bandwidth values and the corresponding maximum
supported frequencies and the third harmonic frequencies.
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3
EMI5204MU, EMI5206MU, EMI5208MU
Table 2. FREQUENCY CHART
Maximum
Supported
Frequency
33.33 MHz (f
1
)
66.67 MHz (f
2
)
100 MHz (f
3
)
Third
Harmonic
Frequency
100 MHz
200 MHz
300 MHz
Bandwidth
3 dB
−
100 MHz
6 dB
−
200 MHz
9 dB
−
300 MHz
Considering that 85% of the amplitude of the square is in
the first two terms of the Fourier series approximation most
of the signal content is at the fundamental (maximum
supported) frequency and the third harmonic frequency. If a
signal with a frequency of 33.33 MHz is input to this filter,
the first two terms are sufficiently passed such that the signal
is only mildly affected, as is shown in Figure 5a. If a signal
with a frequency of 66.67 MHz is input to this same filter,
the third harmonic term is significantly attenuated. This
serves to round the signal edges and skew the waveform, as
is shown in Figure 5b. In the case that a 100 MHz signal is
input to this filter, the third harmonic term is attenuated even
further and results in even more rounding of the signal edges
as is shown in Figure 5c. The result is the degradation of the
data being transmitted making the digital data (1’s and 0’s)
more difficult to discern. This does not include effects of
other components such as interconnect and other path losses
which could further serve to degrade the signal integrity.
While some filter products may specify the 6 dB or 9 dB
bandwidths, actually using these to calculate supported
frequencies (and corresponding data rates) results in
significant signal degradation. To ensure the best signal
integrity possible, it is best to use the 3 dB bandwidth to
calculate the achievable data rate.
Input Waveform
a) Frequency = f
1
Output Waveform
Input Waveform
b) Frequency = f
2
Output Waveform
Input Waveform
c) Frequency = f
3
Output Waveform
Figure 5. Input and Output Waveforms of Filter
ORDERING INFORMATION
Device
EMI5204MUTAG
EMI5206MUTAG
EMI5208MUTAG
Package
UDFN8
(Pb−Free)
UDFN12
(Pb−Free)
UDFN16
(Pb−Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
EMI5204MU, EMI5206MU, EMI5208MU
PACKAGE DIMENSIONS
UDFN8, 1.7x1.35, 0.4P
CASE 517BC−01
ISSUE O
2X
0.10 C
PIN ONE
REFERENCE
2X
E
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.10 C
TOP VIEW
DETAIL B
A
0.05 C
8X
(A3)
L1
DETAIL A
0.05 C
NOTE 4
SIDE VIEW
DETAIL A
A1
C
SEATING
PLANE
ALTERNATE TERMINAL
CONSTRUCTIONS
8X
L
D2
1
E2
8X
K
e
e/2
8
8X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
0.50
0.25
8X
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5
ÉÉ
ÇÇ
ÇÇ
D
A
B
EXPOSED Cu
MOLD CMPD
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.70 BSC
1.10
1.30
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
ÉÉÉ
ÉÉÉ
L
L
RECOMMENDED
SOLDERING FOOTPRINT*
1.40
PACKAGE
OUTLINE
8X
0.40
1.55
1
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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