EMIF06-USD14F3
6-line low capacitance IPAD™ for micro-SD card
with EMI filtering and ESD protection
Datasheet
production data
Applications
Consumer and computer electronics with
micro-SD card such as:
– Tablet and smartphone
– HD set-top boxes
– Camera
– Notebook
– Game console
– Mother boards
Flip Chip (15 bumps)
Features
EMI low-pass filter
ESD protection ±8 kV (IEC 61000-4-2)
208 MHz clock frequency compatible with
SDR104 mode (SD3.0)
Optimized PINOUT for easy PCB layout
Lead-free package
Description
The EMIF06-USD14F3 is a 6-line EMI filter
dedicated to SD, mini-SD and micro-SD card
applications.
This filter includes ESD protection circuitry, which
prevents damage to the protected device when
inserting the card. Pull-up resistors are not
integrated inside the chip, hence the
EMIF06-USD14F3 gives the flexibility to
customers to use controllers with embedded
resistance. This 6-line IPAD ™ is packaged into a
flip-chip solution, saving PCB space
.
Figure 1. Pin configuration (bump side)
Benefits
Low power consumption
Easy pins access (no tracks between bumps)
for easy PCB layout
16 Bumps WLCSP package (with 400 µm
pitch) featuring natural PCB routing, cost
optimization and saving space on the board
High reliability offered by monolithic integration
Reduction of parasitic elements thanks to CSP
integration
Complies with the following standards:
IEC 61000-4-2 level 4:
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
TM:
IPAD is a trademark of STMicroelectronics
December 2015
This is information on a product in full production.
DocID028200 Rev 1
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www.st.com
Characteristics
EMIF06-USD14F3
1
Characteristics
Table 1. Absolute maximum ratings (T
amb
= 25 °C)
Symbol
Parameter
ESD discharge IEC 61000-4-2, level 4
(on pins Vcc, SDclk, SDcmd, SDdat0, SDdat1, SDdat2, SDdat3
Air discharge, external pins
Contact discharge, external pins
ESD discharge IEC 61000-4-2, level 1
(on pins dat0, dat1, clk, cmd,dat3, dat2)
Air discharge, internal pins
Contact discharge, internal pins
Maximum junction temperature
Operating temperature range
Storage temperature range
Value
Unit
V
PP
15
8
kV
2
2
125
-30 to +85
-55 to +150
°C
°C
°C
T
j
T
op
T
stg
Figure 2. EMIF06-USD14F3 schematic
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DocID028200 Rev 1
EMIF06-USD14F3
Table 2. Pin configuration
Pin
A1
A2
A3
A4
B1
B2
B3
B4
Signal
dat0
dat1
SDdat1
SDdat0
clk
V
cc
GND
SDclk
C3
C4
D1
D2
D3
D4
Pin
C1
Characteristics
Signal
Cmd
GND
SDcmd
dat3
dat2
SDdat2
SDdat3
Table 3. Electrical characteristics (values, T
amb
= 25 °C)
Symbol
V
BR
I
RM
R
Parameter
Breakdown voltage
Leakage current
Serial resistance
Test conditions
I
R
= 1 mA
V
RM
= 3 V
T
olerance ±10%, matching ±2%
V
BIAS
= 0V, F = 10 MHz,
V
OSC
= 30mV
RMS
V
BIAS
= 1.8V, F = 10 MHz,
V
OSC
= 30 mV
RMS
40
10
7.5
12
pF
10
Min.
14
Typ.
Max.
20
100
Unit
V
nA
Ω
C
line
Data line capacitance
Figure 3. Electrical characteristics (definitions)
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8
Characteristics
EMIF06-USD14F3
Figure 4. Attenuation versus frequency
Figure 5. Analog crosstalk versus frequency
Figure 6. ESD response to IEC 61000-4-2
(+8 kV contact discharge)
Figure 7. ESD response to IEC 61000-4-2
(-8 kV contact discharge)
Figure 8. Line capacitance versus frequency and bias voltage (typical values)
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EMIF06-USD14F3
Package information
2
Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
2.1
Flip-Chip package information
Figure 9. Flip-Chip package outline
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8
stm32/stm8
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