电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-R0202AS-02-3160-B

产品描述Resistor Networks & Arrays
产品类别无源元件    电阻器   
文件大小351KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
下载文档 详细参数 全文预览

WBC-R0202AS-02-3160-B在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-R0202AS-02-3160-B - - 点击查看 点击购买

WBC-R0202AS-02-3160-B概述

Resistor Networks & Arrays

WBC-R0202AS-02-3160-B规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称TT Electronics plc
Reach Compliance Codecompliant
构造Chip
制造商序列号WBC(DISCRETE)
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装长度0.508 mm
封装形式SMT
封装宽度0.508 mm
包装方法Tray
额定功率耗散 (P)0.25 W
电阻316 Ω
电阻器类型FIXED RESISTOR
系列WBC(DISCRETE)
尺寸代码0202
技术THIN FILM
温度系数-50,50 ppm/°C
容差0.1%
工作电压100 V

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
cc1101与MSP430G2553的程序调试
extern void Init_CC1101(void); extern void halRfSendPacket(INT8U *txBuffer, INT8U size); extern void POWER_UP_RESET_CC1100(void); extern void halRfWriteRfSettings(void); extern ......
易爆炸弹 无线连接
无私奉献各种电路图
电动自行车调速控制电路 推荐一种简单而实用的电动自行车调速控制电路。电路如下图所示,电路中使用运算放大器LM324或四比较器LM339作功能控制,调速原理采用了调频式电压反馈稳速方案。当电 ......
fish001 模拟电子
基于DSC的56F8257芯片SVPWM程序编写
在理论推导的时候,SVPWM管子的导通时间分别是 X=sqrt(3)Ubeta*TS/Ud; Y=(sqrt(3)Ubeta*TS/Ud+3Ualpha*Ts/Ud)/2; Z=(sqrt(3)Ubeta*TS/Ud-+3Ualpha*Ts/Ud)/2; ----------- ......
hc12345 DSP 与 ARM 处理器
cadence版图设计
关于cadence版图设计的使用手册...
YYF2008 PCB设计
F-ES500嵌入式交换机模块
F-ES500嵌入式交换机模块 简介: F-ES500以太网交换机提供5个10/100Mbps自适应端口,高集成度模块化设计,适用于家具布线、家庭智能化。采用存储转发技术,结合动态内存分配,确保有效的分配 ......
cclgyzx 嵌入式系统
SOPC Builder生成系统失败,原因可能是Global User Libraries的问题。
请教各位大虾、同仁: 在SOPC Builder生产system时显示为失败,结果显示: "One or more components could not be located(altera nios2) , check Global User Libraries under T ......
michaelcheng 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 654  2768  2787  471  1330  49  38  5  44  30 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved