电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-T0303AS-00-1051-B

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
下载文档 详细参数 全文预览

WBC-T0303AS-00-1051-B在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-T0303AS-00-1051-B - - 点击查看 点击购买

WBC-T0303AS-00-1051-B概述

Resistor Networks & Arrays

WBC-T0303AS-00-1051-B规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics plc
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
新驱动科技MM32F031开发板测评之(2)工程搭建与点灯实现
本帖最后由 footis 于 2018-10-21 23:14 编辑 测评(1)传送门:https://bbs.eeworld.com.cn/forum. ... 4750&highlight=MM32 在测评(1)中,已经创建了工程,并选好了Device。 本期测评 ......
footis 电机控制
Windows CE6.0键盘驱动源码中的一个问题
大家好,我最近在看MS的PS2键盘鼠标驱动,发现存在一个问题,在\WINCE600\PUBLIC\COMMON\OAK\DRIVERS\KEYBD\PS2_8042目录中有ps2port.cpp,这个文件是关于PS2接口操作的实现。其中有两个成员函数 ......
winkingsun 嵌入式系统
如何提高运放的共模抑制比
最近在做一个功率运算放大器,但是共模抑制比有些不达标,想请教各位大侠,共模抑制比跟哪些因素有关,该如何提高呢?...
像疯 模拟电子
如何配置wince与winxp之间的直接电缆连接?
配置winxp为主机,wince为客户机(通过rs232串口连接),从wince连接winxp主机始终不成功,提示端口波特率不匹配。 望不吝赐教!...
urmysuperstar 嵌入式系统
PCB电路版图设计的常见问题
本帖最后由 paulhyde 于 2014-9-15 08:57 编辑 问题1:什么是零件封装,它和零件有什么区别?   答:(1)零件封装是指实际零件焊接到电路板时所指示的外观和焊点位置。   (2)零件封装只是 ......
open82977352 电子竞赛
MSP430FR2311 微控制器 IR 反射感测参考设计
设计展示了基于 MSP430™ FRAM 微处理器 (MCU) 且具有可配置模拟的红外反射感应解决方案,适用于感应和测量应用。它展示了 MCU 的超低功耗特性以及 FRAM 技术和集成式互阻抗放大器 (TIA) ......
灞波儿奔 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 820  2468  2511  501  823  33  58  24  13  57 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved