Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> FH8065801974816S-R267

FH8065801974816S-R267: 产品描述CPU - Central Processing Units 64BIT MPU; 产品类别半导体嵌入式处理器和控制器; 文件大小2MB，共135页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

下载文档详细参数选型对比全文预览

FH8065801974816S-R267在线购买

供应商	器件名称	价格	最低购买	库存
	FH8065801974816S-R267	-	-	点击查看	点击购买

FH8065801974816S-R267概述

CPU - Central Processing Units 64BIT MPU

FH8065801974816S-R267规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units
RoHS	Details
产品 Product	Mobile Processors
封装 / 箱体 Package / Case	FCBGA-1168
Family	Intel Core i7
Core	Intel Core i7
Code Name	Broadwell
Processor Series	i7-5650U
Embedded Options	Embedded
Number of Cores	2 Core
TDP - Max	15 W
Maximum Clock Frequency	2.2 GHz
Data Bus Width	64 bit
Memory Size	16 GB
Memory Type	DDR3L-1333, 1600, LPDDR3-1333, 1600
System Bus Type	DMI2
System Bus Speed	5 GT/s
Cache Memory	4 MB
系列 Packaging	Tray
Package / Case Size	40 mm x 24 mm
安装风格 Mounting Style	SMD/SMT
CPU Configuration - Max	1 Configuration
Intel Hyper-Threading Technology	With HT Technology
Intel Virtualization Technology - VT	With VT
Lithography - Process Technology	14 nm
Moisture Sensitive	Yes
Number of Displays Supported	3 Display
Number of Memory Channels	2 Channel
Number of PCI Express Lanes	12 Lane
Number of Threads	4 Thread
PCIe Configurations	4x1 + 2x4
PCIe Revision	Revision 2.0
工厂包装数量 Factory Pack Quantity	1
Turbo Frequency - Max	3.1 GHz

文档预览

下载PDF文档

全文
预览

5th Generation Intel

Core

™

Processor Family, Intel

Core

™

Processor Family, Mobile Intel

Pentium

Processor Family, and

Mobile Intel

Celeron

Processor

Family

Datasheet – Volume 1 of 2

June 2015

Order No.: 330834-005v1

Contents—Processor

Contents

Revision History..................................................................................................................9

1.0 Introduction................................................................................................................10

1.1

1.2

1.3

1.4

1.5

1.6

1.7

Supported Technologies.........................................................................................11

Power Management Support...................................................................................12

Thermal Management Support................................................................................12

Package Support...................................................................................................13

Processor Testability............................................................................................. 13

Terminology.........................................................................................................13

Related Documents............................................................................................... 16

2.0 Interfaces................................................................................................................... 18

2.1 System Memory Interface...................................................................................... 18

2.1.1 System Memory Technology Supported ......................................................18

2.1.2 System Memory Timing Support................................................................. 19

2.1.3 Intel

Fast Memory Access (Intel

FMA)..................................................... 20

2.1.4 System Memory Frequency........................................................................ 21

2.1.5 System Memory Organization Modes ......................................................... 21

2.1.6 Data Scrambling...................................................................................... 22

2.2 Processor Graphics................................................................................................22

2.3 Processor Graphics Controller (GT)..........................................................................23

2.3.1 3D and Video Engines for Graphics Processing.............................................. 23

2.4 Digital Display Interface (DDI)................................................................................25

2.5 Platform Environmental Control Interface (PECI)....................................................... 31

2.5.1 PECI Bus Architecture................................................................................31

3.0 Technologies............................................................................................................... 33

3.1 Intel

Virtualization Technology (Intel

VT)............................................................. 33

3.2 Intel

Trusted Execution Technology (Intel

TXT)..................................................... 37

3.3 Intel

Hyper-Threading Technology (Intel

HT Technology)....................................... 38

3.4 Intel

Turbo Boost Technology 2.0..........................................................................39

3.5 Intel

Advanced Vector Extensions 2.0 (Intel

AVX2)................................................39

3.6 Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI).......................39

3.7 Intel

64 Architecture x2APIC................................................................................ 40

3.8 Power Aware Interrupt Routing (PAIR).................................................................... 42

3.9 Execute Disable Bit............................................................................................... 42

3.10 Intel

Device Protection with Boot Guard............................................................... 42

3.11 Supervisor Mode Execution Protection (SMEP)........................................................42

3.12 Supervisor Mode Access Protection (SMAP) ........................................................... 43

3.13 Intel

Transactional Synchronization Extensions - New Instructions (Intel

TSX-NI)... 43

4.0 Power Management.................................................................................................... 44

4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................... 45

4.2 Processor Core Power Management......................................................................... 46

4.2.1 Enhanced Intel SpeedStep

Technology Key Features....................................46

4.2.2 Low-Power Idle States............................................................................... 47

4.2.3 Requesting Low-Power Idle States...............................................................48

4.2.4 Core C-State Rules....................................................................................48

5th Generation Intel

Core

™

Processor Family, Intel

Core

™

M Processor Family, Mobile Intel

Pentium

Processor Family, and

Mobile Intel

Celeron

Processor Family

June 2015

Datasheet – Volume 1 of 2

Order No.: 330834-005v1

Processor—Contents

4.2.5 Package C-States......................................................................................50

4.2.6 Package C-States and Display Resolutions.................................................... 53

4.3 Integrated Memory Controller (IMC) Power Management............................................54

4.3.1 Disabling Unused System Memory Outputs................................................... 55

4.3.2 DRAM Power Management and Initialization..................................................55

4.3.3 DDR Electrical Power Gating (EPG).............................................................. 57

4.4 Graphics Power Management..................................................................................58

4.4.1 Intel

Rapid Memory Power Management (Intel

RMPM)................................58

4.4.2 Graphics Render C-State............................................................................58

4.4.3 Intel

Smart 2D Display Technology (Intel

S2DDT)..................................... 58

4.4.4 Intel

Graphics Dynamic Frequency............................................................ 58

4.4.5 Intel

Display Power Saving Technology (Intel

DPST)................................. 59

4.4.6 Intel

Automatic Display Brightness ........................................................... 59

4.4.7 Intel

Seamless Display Refresh Rate Technology (Intel

SDRRS

Technology)............................................................................................ 59

5.0 Thermal Management................................................................................................. 60

5.1 Thermal Considerations......................................................................................... 60

5.2 Intel

Turbo Boost Technology 2.0 Power Monitoring.................................................61

5.3 Intel

Turbo Boost Technology 2.0 Power Control..................................................... 61

5.3.1 Package Power Control.............................................................................. 61

5.3.2 Turbo Time Parameter............................................................................... 62

5.4 Configurable TDP (cTDP) and Low-Power Mode......................................................... 62

5.4.1 Configurable TDP...................................................................................... 63

5.4.2 Low-Power Mode.......................................................................................63

5.5 Thermal and Power Specifications........................................................................... 64

5.6 Thermal Management Features............................................................................... 66

5.6.1 Adaptive Thermal Monitor.......................................................................... 66

5.6.2 Digital Thermal Sensor.............................................................................. 68

5.6.3 PROCHOT# Signal.....................................................................................69

5.6.4 On-Demand Mode..................................................................................... 70

5.6.5 Intel

Memory Thermal Management.......................................................... 71

6.0 Signal Description....................................................................................................... 72

6.1 System Memory Interface Signals........................................................................... 72

6.2 Memory Compensation and Miscellaneous Signals..................................................... 74

6.3 Reset and Miscellaneous Signals............................................................................. 74

6.4 embedded DisplayPort* (eDP*) Signals....................................................................75

6.5 Display Interface Signals....................................................................................... 75

6.6 Testability Signals.................................................................................................75

6.7 Error and Thermal Protection Signals....................................................................... 76

6.8 Power Sequencing Signals......................................................................................77

6.9 Processor Power Signals........................................................................................ 77

6.10 Sense Signals..................................................................................................... 78

6.11 Ground and Non-Critical to Function (NCTF) Signals.................................................78

6.12 Processor Internal Pull-Up / Pull-Down Terminations................................................ 79

7.0 Electrical Specifications.............................................................................................. 80

7.1

7.2

7.3

7.4

Integrated Voltage Regulator..................................................................................80

Power and Ground Pins..........................................................................................80

Voltage Identification (VID).............................................................................. 80

Reserved or Unused Signals................................................................................... 85

5th Generation Intel

Core

™

Processor Family, Intel

Core

™

M Processor Family, Mobile Intel

Pentium

Processor Family, and

Mobile Intel

Celeron

Processor Family

Datasheet – Volume 1 of 2

June 2015

Order No.: 330834-005v1

FH8065801974816S-R267相似产品对比

	FH8065801974816S-R267	FH8065801620407S-R240	FH8065801620005S R2NT	FH8065801620705S R24B	FH8065801620406S R23Z	FH8065801620803S R242
描述	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU 8065801620005 2.400G 4MB FCBG	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units CELERON 3765U 64BIT MPU FCBGA1168
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value
制造商 Manufacturer	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units
RoHS	Details	Details	Details	Details	Details	Details
Family	Intel Core i7	Intel Core i3	Intel Core i7	Intel Pentium	Intel Core i3	Intel Celeron
Core	Intel Core i7	Intel Core i3	Intel Core i7	Intel Pentium	Intel Core i3	Intel Celeron
Maximum Clock Frequency	2.2 GHz	2.2 GHz	2.4 GHz	1.9 GHz	2.1 GHz	1.9 GHz
Data Bus Width	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit
Cache Memory	4 MB	3 MB	4 MB	2 MB	3 MB	2 MB
系列 Packaging	Tray	Tray	Tray	Tray	Tray	Tray
工厂包装数量 Factory Pack Quantity	1	1	1	1	1	1
产品 Product	Mobile Processors	Mobile Processors	-	Mobile Processors	Mobile Processors	Mobile Processors
封装 / 箱体 Package / Case	FCBGA-1168	FCBGA-1168	-	FCBGA-1168	FCBGA-1168	FCBGA-1168
Code Name	Broadwell	Broadwell	-	Broadwell	Broadwell	Broadwell
Processor Series	i7-5650U	i3-5020U	i7-5500DU	3825U	i3-5010U	-
Embedded Options	Embedded	Non-Embedded	-	Non-Embedded	Embedded	Embedded
Number of Cores	2 Core	2 Core	-	2 Core	2 Core	2 Core
TDP - Max	15 W	15 W	-	15 W	15 W	15 W
Memory Size	16 GB	16 GB	-	16 GB	16 GB	16 GB
Memory Type	DDR3L-1333, 1600, LPDDR3-1333, 1600	DDR3L-1333/1600, LPDDR-1333/1600	-	DDR3L-1333/1600, LPDDR3-1333/1600	DDR3L-1333, 1600, LPDDR3-1333, 1600	DDR3L-1333/1600, LPDDR3-1333/1600
System Bus Type	DMI2	DMI2	-	DMI2	DMI2	DMI2
System Bus Speed	5 GT/s	5 GT/s	-	5 GT/s	5 GT/s	5 GT/s
Package / Case Size	40 mm x 24 mm	40 mm x 24 mm x 1.3 mm	-	40 mm x 24 mm x 1.3 mm	40 mm x 24 mm	40 mm x 24 mm x 1.3 mm
安装风格 Mounting Style	SMD/SMT	SMD/SMT	-	SMD/SMT	SMD/SMT	SMD/SMT
CPU Configuration - Max	1 Configuration	1 Configuration	-	1 Configuration	1 Configuration	1 Configuration
Intel Hyper-Threading Technology	With HT Technology	With HT Technology	-	With HT Technology	With HT Technology	Without HT Technology
Intel Virtualization Technology - VT	With VT	With VT	-	With VT	With VT	With VT
Lithography - Process Technology	14 nm	14 nm	-	14 nm	14 nm	14 nm
Moisture Sensitive	Yes	Yes	-	Yes	Yes	Yes
Number of Displays Supported	3 Display	3 Display	-	3 Display	3 Display	3 Display
Number of Memory Channels	2 Channel	2 Channel	-	2 Channel	2 Channel	2 Channel
Number of PCI Express Lanes	12 Lane	12 Lane	-	12 Lane	12 Lane	12 Lane
Number of Threads	4 Thread	4 Thread	-	4 Thread	4 Thread	2 Thread
PCIe Configurations	4x1 + 2x4	4x1 + 2x4	-	4x1 + 2x4	4x1 + 2x4	4x1 + 2x4
PCIe Revision	Revision 2.0	Revision 2.0	-	Revision 2.0	Revision 2.0	Revision 2.0

FH8065801974816S-R267

FH8065801974816S-R267在线购买

FH8065801974816S-R267概述

FH8065801974816S-R267规格参数

文档预览

FH8065801974816S-R267相似产品对比

推荐资源