电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

73644-0205

产品描述High Speed / Modular Connectors 2MM HDM BP GP Polz P n AC 30 SAu GF 72Ckt
产品类别连接器    连接器   
文件大小22KB,共2页
制造商Molex
官网地址https://www.molex.com/molex/home
标准
下载文档 详细参数 全文预览

73644-0205在线购买

供应商 器件名称 价格 最低购买 库存  
73644-0205 - - 点击查看 点击购买

73644-0205概述

High Speed / Modular Connectors 2MM HDM BP GP Polz P n AC 30 SAu GF 72Ckt

73644-0205规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Molex
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys DescriptionHigh Speed / Modular Connectors 2MM HDM BP GP Polz P n AC 30 SAu GF 72Ckt
其他特性POLARIZED,HDM
板上安装选件COMPLIANT BOARDLOCK
主体宽度0.618 inch
主体深度0.461 inch
主体长度1.244 inch
主体/外壳类型RECEPTACLE
连接器类型BOARD CONNECTOR
联系完成配合GOLD (30)
联系完成终止Gold (Au)
触点性别MALE
触点材料STAINLESS STEEL
触点模式RECTANGULAR
触点电阻10 mΩ
触点样式SQ PIN-SKT
DIN 符合性NO
滤波功能NO
IEC 符合性NO
最大插入力.6116 N
绝缘电阻5000000000 Ω
绝缘体颜色BLACK
绝缘体材料GLASS FILLED LIQUID CRYSTAL POLYMER
JESD-609代码e4
MIL 符合性NO
插接触点节距0.079 inch
匹配触点行间距0.079 inch
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装选项1GUIDE PIN
安装选项2LOCKING
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数6
装载的行数6
最高工作温度105 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
PCB触点行间距2.0066 mm
电镀厚度30u inch
额定电流(信号)1 A
参考标准UL
可靠性COMMERCIAL
端子长度0.138 inch
端子节距2 mm
端接类型PRESS FIT
触点总数72
UL 易燃性代码94V-0
Base Number Matches1

文档预览

下载PDF文档
This document was generated on 11/28/2017
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
0736440205
Active
HDM® Backplane Connector System
HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location
A, Polarizing Key Position C, 72 Circuits
Documents:
3D Model
Drawing (PDF)
Agency Certification
CSA
UL
General
Product Family
Series
Application
Comments
Component Type
Overview
Product Name
UPC
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Flammability
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length
PCB Locator
PCB Retention
PCB Thickness - Recommended
Packaging Type
Pitch - Mating Interface
Pitch - Termination Interface
Plating min - Mating
Plating min - Termination
Polarized to PCB
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Electrical
Packaging Specification PK-70873-0818 (PDF)
RoHS Certificate of Compliance (PDF)
Series image - Reference only
LR19980
E29179
Backplane Connectors
73644
Backplane
Standard Press-Fit
PCB Header
HDM® Backplane Connector System
HDM
800754813556
72
72
Black, Natural
250
No
94V-0
Yes
Yes
Phosphor Bronze, Stainless Steel
Gold
Gold
High Temperature Thermoplastic
12
Open Pin Field
6
Vertical
3.50mm
No
Yes
2.50mm
Tube
2.00mm
2.00mm
0.762µm
0.051µm
No
Yes
Yes
-55°C to +105°C
Through Hole - Compliant Pin
EU ELV
Not Reviewed
EU RoHS
China RoHS
Not Reviewed
REACH SVHC
Not Reviewed
Halogen-Free
Status
Not Reviewed
Need more information on product
environmental compliance?
Email productcompliance@molex.com
Please visit the Contact Us section for any
non-product compliance questions.
China ROHS
ELV
RoHS Phthalates
Not Reviewed
Not Reviewed
Not Reviewed
Search Parts in this Series
73644 Series
Mates With
73632 HDM+ Board-to-Board Daughtercard
Receptacle. 73780 HDM Board-to-Board
Daughtercard Receptacle

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 241  224  1420  383  1090  5  29  8  22  44 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved