NSR0140P2T5G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
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•
•
•
•
•
Extremely Fast Switching Speed
Extremely Low Forward Voltage
−
0.28 V (Typ) @ I
F
= 1.0 mA
Low Reverse Current
Lead−Free Plating
This is a Pb−Free Device
40 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
MAXIMUM RATINGS
Rating
Repetitive Peak Reverse Voltage
Continuous Reverse Voltage (DC)
Continuous Forward Current (DC)
Non−Repetitive Peak Forward Surge Current
ESD Rating: Class 1C per Human Body Model
Class A per Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Symbol
V
RM
V
R
I
F
I
FSM
Value
40
30
70
500
Unit
V
V
mA
mA
2
1
SOD−923
CASE 514AA
PLASTIC
1
MARKING
DIAGRAM
M MG
G
2
M = Specific Device Code*
(Character is rotated 270° clockwise)
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NSR0140P2T5G
Package
SOD−923
(Pb−Free)
Shipping†
8000/Tape & Reel
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage
Temperature Range
1. FR−5 Minimum Pad.
Symbol
P
D
Max
100
1.0
R
qJA
T
J
, T
stg
1000
−55
to +125
Unit
mW
mW/°C
°C/W
°C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2009
May, 2009
−
Rev. 3
1
Publication Order Number:
NSR0140P2/D
NSR0140P2T5G
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Reverse Breakdown Voltage
(I
R
= 10
mA)
Total Capacitance
(V
R
= 1.0 V, f = 1.0 MHz)
Reverse Leakage
(V
R
= 30 V)
Forward Voltage
(I
F
= 1.0 mA)
Symbol
V
(BR)R
C
T
I
R
V
F
Min
30
−
−
−
Typ
−
2.0
300
0.28
Max
−
2.5
500
0.35
Unit
V
pF
nA
V
10
IR , REVERSE CURRENT (μA)
IF, FORWARD CURRENT (mA)
1000
100
10
85°C
1.0
0.1
25°C
0.01
1 25°C
85°C
0.1
0.15
0.2
25°C
0.25
- 40°C
0.3
0.35
- 55°C
0.001
0
0.05
0.4
0.45
0.5
0
5
V
F
, FORWARD VOLTAGE (VOLTS)
10
15
20
25
V
R
, REVERSE VOLTAGE (VOLTS)
30
35
T
A
= 150°C
125°C
1.0
1 50°C
0.1
Figure 1. Typical Forward Voltage
Figure 2. Reverse Current versus Reverse
Voltage
3.0
2.5
C T, CAPACITANCE (pF)
2.0
1.5
1.0
0.5
0
0
2.0
4.0
6.0
8.0
10
12
14
16
18
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
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2
NSR0140P2T5G
PACKAGE DIMENSIONS
SOD−923
CASE 514AA−01
ISSUE D
D
−X−
−Y−
E
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM
A
b
c
D
E
H
E
L
MILLIMETERS
MIN
NOM MAX
0.34
0.39
0.43
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.05
0.10
0.15
MIN
0.013
0.006
0.003
0.030
0.022
0.037
0.002
INCHES
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.017
0.010
0.007
0.033
0.026
0.041
0.006
b
2X
0.08 (0.0032) X Y
A
c
L
H
E
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
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USA/Canada
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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Order Literature:
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For additional information, please contact your local
Sales Representative
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NSR0140P2/D
FPGA/CPLD
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