MMBTA55L Series,
MMBTA56L Series,
SMMBTA56L Series
Driver Transistors
PNP Silicon
Features
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•
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SOT−23
CASE 318
STYLE 6
COLLECTOR
3
MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
MMBTA55
MMBTA56, SMMBTA56
Collector
−Base
Voltage
MMBTA55
MMBTA56, SMMBTA56
Emitter
−Base
Voltage
Collector Current
−
Continuous
Symbol
V
CEO
Value
−60
−80
−60
−80
−4.0
−500
Unit
Vdc
1
BASE
V
CBO
Vdc
2
EMITTER
V
EBO
I
C
Vdc
mAdc
MARKING DIAGRAM
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR− 5 Board
(Note 1) T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation Alumina
Substrate, (Note 2) T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
Symbol
P
D
Max
225
1.8
556
300
2.4
417
−55
to +150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
1
2xx M
G
G
R
qJA
P
D
2xx = Device Code
x = H for MMBTA55LT1G
xx = GM for MMBTA56LT1G,
SMMBTA56LT1G
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
R
qJA
T
J
, T
stg
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR− 5 = 1.0
0.75
0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 1994
October, 2016
−
Rev. 8
1
Publication Order Number:
MMBTA55LT1/D
MMBTA55L Series, MMBTA56L Series, SMMBTA56L Series
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector
−Emitter
Breakdown Voltage (Note 3)
(I
C
=
−1.0
mAdc, I
B
= 0)
MMBTA55
MMBTA56, SMMBTA56
Emitter
−Base
Breakdown Voltage
(I
E
=
−100
mAdc,
I
C
= 0)
Collector Cutoff Current
(V
CE
=
−60
Vdc, I
B
= 0)
Collector Cutoff Current
(V
CB
=
−60
Vdc, I
E
= 0)
MMBTA55
(V
CB
=
−80
Vdc, I
E
= 0)
MMBTA56, SMMBTA56
ON CHARACTERISTICS
DC Current Gain
(I
C
=
−10
mAdc, V
CE
=
−1.0
Vdc)
(I
C
=
−100
mAdc, V
CE
=
−1.0
Vdc)
Collector
−Emitter
Saturation Voltage
(I
C
=
−100
mAdc, I
B
=
−10
mAdc)
Base
−Emitter
On Voltage
(I
C
=
−100
mAdc, V
CE
=
−1.0
Vdc)
SMALL− SIGNAL CHARACTERISTICS
Current
−Gain −
Bandwidth Product (Note 4)
(I
C
=
−100
mAdc, V
CE
=
−1.0
Vdc, f = 100 MHz)
f
T
50
−
MHz
h
FE
100
100
−
−
−
−
−0.25
−1.2
−
V
(BR)CEO
−60
−80
V
(BR)EBO
I
CES
I
CBO
−
−
−0.1
−0.1
−4.0
−
−
−
−
−0.1
Vdc
mAdc
mAdc
Vdc
Symbol
Min
Max
Unit
V
CE(sat)
V
BE(on)
Vdc
Vdc
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width
v
300
ms,
Duty Cycle
v
2.0%.
4. f
T
is defined as the frequency at which |h
fe
| extrapolates to unity.
TURN-ON TIME
-1.0 V
V
CC
+40 V
TURN-OFF TIME
+V
BB
V
CC
+40 V
5.0
ms
+10 V
V
in
0
t
r
= 3.0 ns
5.0
mF
100
R
B
R
L
OUTPUT
V
in
* C
S
t
6.0 pF
5.0
mF
100
R
B
R
L
OUTPUT
* C
S
t
6.0 pF
100
100
5.0
ms
t
r
= 3.0 ns
*Total Shunt Capacitance of Test Jig and Connectors For PNP Test Circuits, Reverse All Voltage Polarities
Figure 1. Switching Time Test Circuits
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2
MMBTA55L Series, MMBTA56L Series, SMMBTA56L Series
V
BE(on)
, BASE−EMITTER VOLTAGE (V)
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
150°C
−55°C
25°C
V
CE
= 1 V
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
-1.0
T
J
= 25°C
-0.8
I
C
=
-50 mA
-0.6
I
C
=
-100 mA
I
C
=
-250 mA
I
C
=
-500 mA
-0.4
I
C
=
-10 mA
-0.2
0.0001
0.001
0.01
0.1
1
0
-0.05 -0.1 -0.2
-0.5
-1.0
-2.0
-5.0
-10
-20
-50
I
C
, COLLECTOR CURRENT (A)
I
B
, BASE CURRENT (mA)
Figure 8. Base Emitter Voltage vs. Collector
Current
-0.8
I
C
, COLLECTOR CURRENT (A)
1
Figure 9. Collector Saturation Region
R
q
VB , TEMPERATURE COEFFICIENT (mV/
°
C)
1S
100 mS
0.1
10 mS
1 mS
-1.2
-1.6
R
qVB
for V
BE
-2.0
Thermal Limit
0.01
-2.4
-2.8
-0.5 -1.0 -2.0
0.001
-5.0
-10
-20
-50
-100 -200
-500
I
C
, COLLECTOR CURRENT (mA)
0.1
1
10
100
V
CE
, COLLECTOR EMITTER VOLTAGE (V)
Figure 10. Base−Emitter Temperature
Coefficient
Figure 11. Safe Operating Area
ORDERING INFORMATION
Device Order Number
MMBTA55LT1G
MMBTA55LT3G
MMBTA56LT1G
SMMBTA56LT1G
MMBTA56LT3G
SMMBTA56LT3G
Package Type
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
†
3,000 / Tape & Reel
10,000 / Tape & Reel
3,000 / Tape & Reel
3,000 / Tape & Reel
10,000 / Tape & Reel
10,000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MMBTA55L Series, MMBTA56L Series, SMMBTA56L Series
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AR
D
0.25
3
E
1
2
HE
L
3X
b
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
DIM
A
A1
b
c
D
E
e
L
L1
H
E
T
MIN
0.89
0.01
0.37
0.08
2.80
1.20
1.78
0.30
0.35
2.10
0
_
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.14
0.20
2.90
3.04
1.30
1.40
1.90
2.04
0.43
0.55
0.54
0.69
2.40
2.64
−−−
10
_
MIN
0.035
0.000
0.015
0.003
0.110
0.047
0.070
0.012
0.014
0.083
0
_
INCHES
NOM
MAX
0.039
0.044
0.002
0.004
0.017
0.020
0.006
0.008
0.114
0.120
0.051
0.055
0.075
0.080
0.017
0.022
0.021
0.027
0.094
0.104
−−−
10
_
e
TOP VIEW
L1
VIEW C
A
A1
SIDE VIEW
SEE VIEW C
c
END VIEW
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
RECOMMENDED
SOLDERING FOOTPRINT*
2.90
0.90
3X
3X
0.80
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MMBTA55LT1/D
嵌入式系统
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