Multiplexer Switch ICs
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | S-XQCC-N16 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 负电源电压最大值(Vsup) | -18 V |
| 负电源电压最小值(Vsup) | -5 V |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 84 dB |
| 通态电阻匹配规范 | 30 Ω |
| 最大通态电阻 (Ron) | 3500 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.2SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 245 |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大信号电流 | 0.01 A |
| 最大供电电流 (Isup) | 0.2 mA |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 5 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 1000 ns |
| 最长接通时间 | 1500 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5 mm |

| MAX328ETE-T | MAX328CJE | MAX328ETE | MAX329ETE- | MAX328EJE | MAX329MJE | MAX328C/D | MAX328MJE | MAX329EJE | MAX329CJE | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Multiplexer Switch ICs | Multiplexer Switch ICs | Multiplexer Switch ICs | Multiplexer Switch ICs | Multiplexer Switch ICs | Multiplexer Switch ICs | Multiplexer Switch ICs | Multiplexer Switch ICs | Multiplexer Switch ICs | Multiplexer Switch ICs |
| 是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | DIP | QFN | - | DIP | DIP | DIE | DIP | DIP | DIP |
| 包装说明 | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-16 | DIP, DIP16,.3 | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-16 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIE-16 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| 针数 | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | - | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | - | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | S-XQCC-N16 | R-GDIP-T16 | S-XQCC-N16 | - | R-GDIP-T16 | R-GDIP-T16 | X-XUUC-N16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 负电源电压最大值(Vsup) | -18 V | -18 V | -18 V | - | -18 V | -18 V | -18 V | -18 V | -18 V | -18 V |
| 负电源电压最小值(Vsup) | -5 V | -5 V | -5 V | - | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | - | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | 8 | 8 | - | 8 | 4 | 8 | 8 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 84 dB | 84 dB | 84 dB | - | 84 dB | 84 dB | 84 dB | 84 dB | 84 dB | 84 dB |
| 通态电阻匹配规范 | 30 Ω | 30 Ω | 30 Ω | - | 30 Ω | 30 Ω | 30 Ω | 30 Ω | 30 Ω | 30 Ω |
| 最大通态电阻 (Ron) | 3500 Ω | 3500 Ω | 3500 Ω | - | 3500 Ω | 2500 Ω | 3500 Ω | 2500 Ω | 3500 Ω | 3500 Ω |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | - | 85 °C | 125 °C | 70 °C | 125 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -55 °C | - | -55 °C | -40 °C | - |
| 封装主体材料 | UNSPECIFIED | CERAMIC, GLASS-SEALED | UNSPECIFIED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | HVQCCN | DIP | HVQCCN | - | DIP | DIP | DIE | DIP | DIP | DIP |
| 封装等效代码 | LCC16,.2SQ,32 | DIP16,.3 | LCC16,.2SQ,32 | - | DIP16,.3 | DIP16,.3 | DIE OR CHIP | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | IN-LINE | IN-LINE | UNCASED CHIP | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度(摄氏度) | 245 | 240 | 245 | - | 240 | 240 | 240 | 240 | 240 | 240 |
| 电源 | +-15 V | +-15 V | +-15 V | - | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 5.08 mm | 0.8 mm | - | 5.08 mm | 5.08 mm | - | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大信号电流 | 0.01 A | 0.01 A | 0.01 A | - | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
| 最大供电电流 (Isup) | 0.2 mA | 0.2 mA | 0.2 mA | - | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V | - | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | - | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | NO | YES | - | NO | NO | YES | NO | NO | NO |
| 最长断开时间 | 1000 ns | 1000 ns | 1000 ns | - | 1000 ns | 700 ns | 1000 ns | 700 ns | 1000 ns | 1000 ns |
| 最长接通时间 | 1500 ns | 1500 ns | 1500 ns | - | 1500 ns | 1000 ns | 1500 ns | 1000 ns | 1500 ns | 1500 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | - | INDUSTRIAL | MILITARY | COMMERCIAL | MILITARY | INDUSTRIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 0.8 mm | 2.54 mm | 0.8 mm | - | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | QUAD | - | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | NOT SPECIFIED | - | 20 | 20 | NOT SPECIFIED | 20 | 20 | 20 |
| 宽度 | 5 mm | 7.62 mm | 5 mm | - | 7.62 mm | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm |
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