EEPROM 1.8V to 5.5V 16K
| 参数名称 | 属性值 |
| Brand Name | STMicroelectronics |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 13 weeks |
| 最大时钟频率 (fCLK) | 5 MHz |
| 数据保留时间-最小值 | 40 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 4.4 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 2KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 5e-7 A |
| 最大压摆率 | 0.001 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE/SOFTWARE |
| M95160-RDW6TP | M95160-WMN6P | M95160-DFMC6TG | M95160-WDW6TP | M95160-RMB6TG | M95160-RMC6TG | M95160-RMN6P | M95160-DFMN6TP | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM 1.8V to 5.5V 16K | EEPROM 5.5V 16K (2Kx8) | EEPROM E-EPROM | EEPROM 16 Kbit and 8 Kbit Seril SPI bus EEPROM | EEPROM Serial SPI Bus EEPROM | EEPROM 16kB Serial BUS EE 1.8V to 5.5V ESD | EEPROM Serial SPI Bus EEPROM | EEPROM 16-Kb SPI Bus EEPROM w/ hi-spd clock |
| Brand Name | STMicroelectronics | STMicroelectronics | - | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | - |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - |
| 零件包装代码 | SOIC | SON | - | SOIC | BCC | - | SON | - |
| 包装说明 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | - | TSSOP, TSSOP8,.25 | VQCCN, SOLCC8,.11,20 | HVSON, | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SON-8 | - |
| 针数 | 8 | 8 | - | 8 | 8 | - | 8 | - |
| Reach Compliance Code | compliant | compliant | - | compliant | compliant | compliant | compliant | - |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | 13 weeks | 13 weeks | - | 13 weeks | - | 12 weeks | 16 weeks | - |
| 最大时钟频率 (fCLK) | 5 MHz | 5 MHz | - | 5 MHz | 5 MHz | 5 MHz | 5 MHz | - |
| 数据保留时间-最小值 | 40 | 40 | - | 40 | 40 | - | 40 | - |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | - |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | R-XBCC-N8 | R-PDSO-N8 | R-PDSO-G8 | - |
| JESD-609代码 | e4 | e4 | - | e4 | e4 | - | e4 | - |
| 长度 | 4.4 mm | 4.9 mm | - | 4.4 mm | 3 mm | 3 mm | 4.9 mm | - |
| 内存密度 | 16384 bit | 16384 bit | - | 16384 bit | 16384 bit | 16384 bit | 16384 bit | - |
| 内存集成电路类型 | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM | EEPROM | - |
| 内存宽度 | 8 | 8 | - | 8 | 8 | 8 | 8 | - |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | - |
| 端子数量 | 8 | 8 | - | 8 | 8 | 8 | 8 | - |
| 字数 | 2048 words | 2048 words | - | 2048 words | 2048 words | 2048 words | 2048 words | - |
| 字数代码 | 2000 | 2000 | - | 2000 | 2000 | 2000 | 2000 | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 组织 | 2KX8 | 2KX8 | - | 2KX8 | 2KX8 | 2KX8 | 2KX8 | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TSSOP | SOP | - | TSSOP | VQCCN | HVSON | SOP | - |
| 封装等效代码 | TSSOP8,.25 | SOP8,.25 | - | TSSOP8,.25 | SOLCC8,.11,20 | - | SOP8,.25 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | - |
| 并行/串行 | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | - |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | 260 | NOT SPECIFIED | 260 | - |
| 电源 | 2/5 V | 3/5 V | - | 3/5 V | 2/5 V | - | 2/5 V | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | 1.2 mm | 1.75 mm | - | 1.2 mm | 0.6 mm | 0.6 mm | 1.75 mm | - |
| 串行总线类型 | SPI | SPI | - | SPI | SPI | SPI | SPI | - |
| 最大待机电流 | 5e-7 A | 0.000001 A | - | 0.000001 A | 5e-7 A | - | 5e-7 A | - |
| 最大压摆率 | 0.001 mA | 0.002 mA | - | 0.002 mA | 0.001 mA | - | 0.001 mA | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 1.8 V | 2.5 V | - | 2.5 V | 1.8 V | 1.8 V | 1.8 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | - | 5 V | - |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | GULL WING | GULL WING | - | GULL WING | NO LEAD | NO LEAD | GULL WING | - |
| 端子节距 | 0.65 mm | 1.27 mm | - | 0.65 mm | 0.5 mm | 0.5 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | - | DUAL | BOTTOM | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | NOT SPECIFIED | 30 | - |
| 宽度 | 3 mm | 3.9 mm | - | 3 mm | 2 mm | 2 mm | 3.9 mm | - |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | - | 5 ms | 5 ms | 5 ms | 5 ms | - |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | - |
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