Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Ground Sense
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ROHM(罗姆半导体) |
| 包装说明 | SOP, |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 9 weeks |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 标称共模抑制比 | 60 dB |
| 最大输入失调电压 | 9500 µV |
| JESD-30 代码 | R-PDSO-G14 |
| 长度 | 8.7 mm |
| 功能数量 | 4 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 座面最大高度 | 1.71 mm |
| 标称压摆率 | 10 V/us |
| 供电电压上限 | 7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| BU7487F-E2 | BU7487FV-E2 | BU7486FVM-TR | BU7486SFV-E2 | BU7485G-TR | BU7486SFVM-TR | BU7486FV-E2 | BU7485SG-TR | BU7487SFV-E2 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Ground Sense | Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Ground Sense | Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Ground Sense | Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Ground Sense | Operational Amplifiers - Op Amps OP Amp Sgl GP 5.5V | Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Ground Sense | Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Ground Sense | High Speed Operational Amplifiers LOW VOLT CMOS OP AMP | Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Ground Sense |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
| 包装说明 | SOP, | LSSOP, | VSSOP, | LSSOP, | LSSOP, TSOP5/6,.11,37 | VSSOP, | LSSOP, | LSSOP, TSOP5/6,.11,37 | LSSOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 9 weeks | 9 weeks | 9 weeks | 9 weeks | 9 weeks | 9 weeks | 9 weeks | 9 weeks | 9 weeks |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 标称共模抑制比 | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB |
| 最大输入失调电压 | 9500 µV | 9500 µV | 9500 µV | 9500 µV | 9500 µV | 9500 µV | 9500 µV | 9500 µV | 9500 µV |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G5 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G5 | R-PDSO-G14 |
| 长度 | 8.7 mm | 5 mm | 2.9 mm | 4.4 mm | 2.9 mm | 2.9 mm | 4.4 mm | 2.9 mm | 5 mm |
| 功能数量 | 4 | 4 | 2 | 2 | 1 | 2 | 2 | 1 | 4 |
| 端子数量 | 14 | 14 | 8 | 8 | 5 | 8 | 8 | 5 | 14 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 105 °C | 85 °C | 105 °C | 85 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | LSSOP | VSSOP | LSSOP | LSSOP | VSSOP | LSSOP | LSSOP | LSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 1.71 mm | 1.35 mm | 0.9 mm | 1.35 mm | 1.25 mm | 0.9 mm | 1.35 mm | 1.25 mm | 1.35 mm |
| 标称压摆率 | 10 V/us | 10 V/us | 10 V/us | 10 V/us | 10 V/us | 10 V/us | 10 V/us | 10 V/us | 10 V/us |
| 供电电压上限 | 7 V | 7 V | 7 V | 7 V | 7 V | 7 V | 7 V | 7 V | 7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.95 mm | 0.65 mm | 0.65 mm | 0.95 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.4 mm | 4.4 mm | 2.8 mm | 3 mm | 1.6 mm | 2.8 mm | 3 mm | 1.6 mm | 4.4 mm |
| Base Number Matches | 1 | 1 | 1 | - | 1 | - | 1 | 1 | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
