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MAX19710ETN

产品描述Analog Front End - AFE 7.5Msps CODEC/AFE Full Duplex
产品类别无线/射频/通信    电信电路   
文件大小810KB,共37页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX19710ETN概述

Analog Front End - AFE 7.5Msps CODEC/AFE Full Duplex

MAX19710ETN规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码QFN
包装说明7 X 7 MM, 0.80 MM HEIGHT, EXPOSED PAD, MO-220, TQFN-48
针数48
Reach Compliance Codenot_compliant
ECCN代码EAR99
JESD-30 代码S-XQCC-N56
JESD-609代码e0
长度7 mm
湿度敏感等级1
功能数量1
端子数量56
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料UNSPECIFIED
封装代码HVQCCN
封装等效代码LCC56,.27SQ,16
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)240
电源3 V
认证状态Not Qualified
座面最大高度0.8 mm
最大压摆率0.012 mA
标称供电电压3 V
表面贴装YES
技术CMOS
电信集成电路类型TELECOM CIRCUIT
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式NO LEAD
端子节距0.4 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度7 mm

文档预览

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19-0526; Rev 0; 5/06
KIT
ATION
EVALU
BLE
AVAILA
10-Bit, 7.5Msps, Full-Duplex
Analog Front-End
General Description
Features
Dual 10-Bit, 7.5Msps Rx ADC and Dual 10-Bit,
7.5Msps Tx DAC
Ultra-Low Power
30mW at f
CLK
= 7.5MHz, FD Mode
21.3mW at f
CLK
= 7.5MHz, Slow Rx Mode
21.9mW at f
CLK
= 7.5MHz, Slow Tx Mode
Low-Current Standby and Shutdown Modes
Programmable Tx DAC Common-Mode DC Level
and I/Q Offset Trim
Excellent Dynamic Performance
SNR = 54.9dB at f
IN
= 3.3MHz (Rx ADC)
SFDR = 73.8dBc at f
OUT
= 620kHz (Tx DAC)
Three 12-Bit, 1μs Aux-DACs
10-Bit, 333ksps Aux-ADC with 4:1 Input Mux and
Data Averaging
Excellent Gain/Phase Match
±0.01° Phase, ±0.01dB Gain (Rx ADC) at
f
IN
= 1.8MHz
Multiplexed Parallel Digital I/O
Serial-Interface Control
Versatile Power-Control Circuits
Shutdown, Standby, Idle, Tx/Rx Disable
Miniature 56-Pin Thin QFN Package
(7mm x 7mm x 0.8mm)
MAX19710
The MAX19710 is an ultra-low-power, highly integrated
mixed-signal analog front-end (AFE) ideal for wideband
communication applications operating in full-duplex (FD)
mode. Optimized for high dynamic performance and
ultra-low power, the device integrates a dual 10-bit,
7.5Msps receive (Rx) ADC; dual 10-bit, 7.5Msps transmit
(Tx) DAC; three fast-settling 12-bit aux-DAC channels for
ancillary RF front-end control; and a 10-bit, 333ksps
housekeeping aux-ADC. The typical operating power in
FD mode is 30mW at a 7.5MHz clock frequency.
The Rx ADCs feature 54.8dB SINAD and 79.8dBc SFDR
at 3.3MHz input frequency with a 7.5MHz clock frequen-
cy. The analog I/Q input amplifiers are fully differential
and accept 1.024V
P-P
full-scale signals. Typical I/Q
channel matching is ±0.01° phase and ±0.01dB gain.
The Tx DACs feature 73.8dBc SFDR at f
OUT
= 620kHz
and f
CLK
= 7.5MHz. The analog I-Q full-scale output volt-
age range is ±400mV differential. The output DC com-
mon-mode voltage is from 0.89V to 1.36V. The I/Q
channel offset is adjustable to optimize radio lineup side-
band/carrier suppression. Typical I-Q channel matching
is ±0.01dB gain and ±0.15° phase.
Two independent 10-bit parallel, high-speed digital
buses used by the Rx ADC and Tx DAC allow full-
duplex operation for frequency-division duplex applica-
tions. The Rx ADC and Tx DAC can be disabled
independently to optimize power management. A 3-wire
serial interface controls power-management modes, the
aux-DAC channels, and the aux-ADC channels.
The MAX19710 operates on a single 2.7V to 3.3V analog
supply and 1.8V to 3.3V digital I/O supply. The
MAX19710 is specified for the extended (-40°C to
+85°C) temperature range and is available in a 56-pin,
thin QFN package. The
Selector Guide
at the end of the
data sheet lists other pin-compatible versions in this AFE
family. For time-division duplex (TDD) applications, refer
to the MAX19705–MAX19708 AFE family of products.
Pin Configuration
CS/WAKE
TOP VIEW
ADC2
GND
V
DD
V
DD
DOUT
SCLK
DA9
DA8
DA7
DA6
DA5
42 41 40 39 38 37 36 35 34 33 32 31 30 29
ADC1 43
DAC3 44
DAC2 45
DAC1 46
V
DD
47
IDN 48
IDP 49
GND 50
V
DD
51
28 DA3
27 DA2
26 DA1
25 DA0
24 OV
DD
23 OGND
22 AD9
Applications
Broadband Access
Radio
Private Mobile Radio
Portable Communication
Equipment
MAX19710
DA4
21 AD8
20 AD7
19 AD6
18 AD5
17 AD4
16 AD3
15 AD2
AD1
QDN 52
QDP 53
REFIN 54
COM 55
EXPOSED PADDLE (GND)
Ordering Information
PART*
MAX19710ETN
MAX19710ETN+
PIN-PACKAGE
56 Thin QFN-EP**
56 Thin QFN-EP**
PKG CODE
T5677-1
T5677-1
REFN 56
1
REFP
2
V
DD
3
IAP
4
IAN
5
GND
6
CLK
7
GND
8
V
DD
9
QAN
10 11 12 13 14
QAP
V
DD
GND
AD0
THIN QFN
NOTE:
THE PIN 1 INDICATOR IS “+” FOR LEAD-FREE DEVICES.
*All
devices are specified over the -40°C to +85°C operating range.
**EP
= Exposed paddle.
+Denotes
lead-free package.
Functional Diagram and Selector Guide appear at end of
data sheet.
1
________________________________________________________________
Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
DIN

MAX19710ETN相似产品对比

MAX19710ETN MAX19710ETN-T
描述 Analog Front End - AFE 7.5Msps CODEC/AFE Full Duplex Analog Front End - AFE
是否Rohs认证 不符合 不符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 QFN QFN
包装说明 7 X 7 MM, 0.80 MM HEIGHT, EXPOSED PAD, MO-220, TQFN-48 7 X 7 MM, 0.80 MM HEIGHT, EXPOSED PAD, MO-220, TQFN-48
针数 48 48
Reach Compliance Code not_compliant not_compliant
JESD-30 代码 S-XQCC-N56 S-XQCC-N56
长度 7 mm 7 mm
湿度敏感等级 1 1
功能数量 1 1
端子数量 56 56
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
封装主体材料 UNSPECIFIED UNSPECIFIED
封装代码 HVQCCN HVQCCN
封装等效代码 LCC56,.27SQ,16 LCC56,.27SQ,16
封装形状 SQUARE SQUARE
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度) 240 225
电源 3 V 3 V
认证状态 Not Qualified Not Qualified
座面最大高度 0.8 mm 0.8 mm
最大压摆率 0.012 mA 0.012 mA
标称供电电压 3 V 3 V
表面贴装 YES YES
技术 CMOS CMOS
电信集成电路类型 TELECOM CIRCUIT TELECOM CIRCUIT
温度等级 INDUSTRIAL INDUSTRIAL
端子形式 NO LEAD NO LEAD
端子节距 0.4 mm 0.4 mm
端子位置 QUAD QUAD
处于峰值回流温度下的最长时间 20 NOT SPECIFIED
宽度 7 mm 7 mm

 
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