Operating Temperature Range ........................... -40°C to +85°C
Storage Temperature Range ............................ -65°C to +150°C
Junction Temperature ......................................................+150°C
Soldering Temperature (reflow) (Note 1) ......................... +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Note 1:
The WLP package is constructed using a unique set of package techniques that impose a limit on the thermal profile. The
device can be exposed during board-level solder attach and rework. This limit permits only the use of the solder profiles
recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
Package Thermal Characteristics
(Note 2)
WLP
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........30°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
IN
= 3.3V, V
OUT
= 1.5V, V
EN
= V
IN
, I
OUT
= 100mA, C
IN
= 2.2μF, C
OUT
= 22μF, T
A
= T
J
= -40°C to +85°C, typical values are at
T
A
= +25°C, unless otherwise noted.) (Note 3)
PARAMETER
IN
Input Voltage Range
Input Undervoltage Lockout
Input Undervoltage Lockout
Hysteresis
OUT
Output Voltage Range
Load Regulation
Line Regulation
Dropout Voltage
In-Regulation Current Limit
Short-Circuit Foldback Current
Limit
Output Shutdown Leakage
Line Transient
V
OUT
I
OUT
= 30mA to 1A
V
IN
= 1.7V to 5.5V, V
OUT
= 0.6V,
I
OUT
= 190mA
I
OUT
= 1A, V
FB
= 580mV (Note 4)
V
IN
= 5.5V, V
FB
= 500mV
V
IN
= 5.5V, V
OUT
= 0V, V
FB
< 100mV
V
IN
= 5.5V, V
OUT
= 0V, V
EN
= 0V
∆V
IN
= 0.5V, t
RISE
= t
FALL
= 5µs
2
-0.15
25
1.62
1
4
0.6
0.1
+0.15
100
5.2
V
%/A
%/V
mV
A
A
µA
%
V
IN
V
IN_UV
V
IN_UV_HYS
V
IN
rising
1.7
1.624
40
5.5
1.69
V
V
mV
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
www.maximintegrated.com
Maxim Integrated
│
2
MAX15101
Small 1A, Low-Dropout Linear Regulator
in a 2.7mm x 1.6mm Package
Electrical Characteristics (continued)
(V
IN
= 3.3V, V
OUT
= 1.5V, V
EN
= V
IN
, I
OUT
= 100mA, C
IN
= 2.2μF, C
OUT
= 22μF, T
A
= T
J
= -40°C to +85°C, typical values are at
T
A
= +25°C, unless otherwise noted.) (Note 3)
PARAMETER
Load Transient
Power-Supply Rejection
Output Voltage Noise
FB
I
OUT
= 190mA, V
OUT
= 1.5V to 5V,
V
IN
= (V
OUT
+ 0.3V) to 5.5V
I
OUT
= 3mA to 1A, V
OUT
= 1.5V to 5V,
V
IN
= (V
OUT
+ 0.3V) to 5.5V
V
FB
= 0.6V, V
IN
= 5.5V
1.8
V
IN
= 1.7V to 5.5V
V
FB
moving out of
regulation, V
HYS
= 15mV
I
PG
= 2mA (sink)
FB = high
FB = low
638
538
650
550
25
100
V
PG
= 5.5V
V
EN_HIGH
V
EN_LOW
V
EN
= 0 to 5.5V
V
SS_BYP
= 100mV
V
EN
= 0V, I
SS_BYP
= 2mA
-1
8
9.2
45
+160
Threshold falling
15
1.2
0.4
+1
12
100
1
593
590
600
606
mV
610
1
3.5
1
662
562
80
µA
mA
µA
SYMBOL
CONDITIONS
I
OUT
= 100mA to 1A to 100mA,
t
RISE
= t
FALL
= 1µs
Frequency = 100kHz, I
OUT
= 500mA
Frequency = 500Hz to 100kHz,
I
OUT
= 100mA
MIN
TYP
1.3
40
15
MAX
UNITS
%
dB
µV
RMS
FB Threshold Accuracy
FB Input Current
GND
Ground Supply Current
Ground Shutdown Current
POWER-GOOD OUTPUT
Power-Good (PG) Threshold
Power-Good (PG) Output-
Voltage Low
Power-Good (PG) Delay
Power-Good (PG) Leakage
ENABLE
Enable Input High Threshold
Enable Input Low Threshold
Enable Input Bias Current
SOFT-START
Soft-Start Charging Current
Soft-Start Pulldown Resistance
THERMAL SHUTDOWN
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
mV
mV
µs
µA
V
V
µA
µA
Ω
°C
°C
Note 3:
All devices 100% production tested at T
A
= +25°C. Limits over the temperature range are guaranteed by design.
“tensymetry”这个词在《韦伯斯特词典》中没有解释，但在医学界却广为人知。由Tensys Medical Systems公司开发的tensymetry是一种使用生物机械、电气、软件工程的专有组合技术。利用这三种强大的技术，你可在手术室内对病人的心跳血压进行精确、连续、实时和非侵入性测量。 该技术结出的果实就是该公司的T-line Tensymeter产品。该产品线的最新进展是去年...[详细]
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