Analog Switch ICs
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | DFN |
包装说明 | 3 X 3 MM, 0.8 MM HEIGHT, TDFN-10 |
针数 | 10 |
Reach Compliance Code | not_compliant |
模拟集成电路 - 其他类型 | SPDT |
JESD-30 代码 | S-PDSO-N10 |
JESD-609代码 | e0 |
长度 | 3 mm |
湿度敏感等级 | 1 |
正常位置 | NO/NC |
信道数量 | 1 |
功能数量 | 2 |
端子数量 | 10 |
标称断态隔离度 | 65 dB |
通态电阻匹配规范 | 0.05 Ω |
最大通态电阻 (Ron) | 0.85 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出 | SEPARATE OUTPUT |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVSON |
封装等效代码 | SOLCC10,.11,20 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 245 |
电源 | 3/5 V |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.8 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
最长断开时间 | 70 ns |
最长接通时间 | 80 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
Base Number Matches | 1 |
MAX4762ETB-T | MAX4763ETC-T | MAX4765ETC | MAX4764AEBC-T | MAX4764AEUB- | MAX4764AETB-T | MAX4765ETC-T | |
---|---|---|---|---|---|---|---|
描述 | Analog Switch ICs | Analog Switch ICs Low-Voltage Dual SPDT Audio Clickless Switches with Negative Rail Capability | Analog Switch ICs Low-Voltage Dual SPDT Audio Clickless Switches with Negative Rail Capability | Analog Switch ICs Dual SPDT Audio Clickless Switch | Analog Switch ICs Dual SPDT Audio Clickless Switch | Analog Switch ICs Dual SPDT Audio Clickless Switch | Analog Switch ICs Low-Voltage Dual SPDT Audio Clickless Switches with Negative Rail Capability |
是否无铅 | 含铅 | 含铅 | 含铅 | - | - | - | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | - | - | 不符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | - | - | Maxim(美信半导体) |
零件包装代码 | DFN | QFN | QFN | - | - | - | QFN |
包装说明 | 3 X 3 MM, 0.8 MM HEIGHT, TDFN-10 | 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 | 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 | - | - | - | 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 |
针数 | 10 | 12 | 12 | - | - | - | 12 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | - | - | - | not_compliant |
模拟集成电路 - 其他类型 | SPDT | SPDT | SPDT | - | - | - | SPDT |
JESD-30 代码 | S-PDSO-N10 | S-XQCC-N12 | S-XQCC-N12 | - | - | - | S-XQCC-N12 |
JESD-609代码 | e0 | e0 | e0 | - | - | - | e0 |
长度 | 3 mm | 4 mm | 4 mm | - | - | - | 4 mm |
正常位置 | NO/NC | NO/NC | NO/NC | - | - | - | NO/NC |
信道数量 | 1 | 1 | 1 | - | - | - | 1 |
功能数量 | 2 | 2 | 2 | - | - | - | 2 |
端子数量 | 10 | 12 | 12 | - | - | - | 12 |
标称断态隔离度 | 65 dB | 65 dB | 65 dB | - | - | - | 65 dB |
通态电阻匹配规范 | 0.05 Ω | 0.05 Ω | 0.05 Ω | - | - | - | 0.05 Ω |
最大通态电阻 (Ron) | 0.85 Ω | 0.85 Ω | 0.85 Ω | - | - | - | 0.85 Ω |
最高工作温度 | 85 °C | 85 °C | 85 °C | - | - | - | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | - | - | -40 °C |
输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - | - | - | SEPARATE OUTPUT |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | - | - | - | UNSPECIFIED |
封装代码 | HVSON | VQCCN | VQCCN | - | - | - | VQCCN |
封装等效代码 | SOLCC10,.11,20 | LCC12,.16SQ,32 | LCC12,.16SQ,32 | - | - | - | LCC12,.16SQ,32 |
封装形状 | SQUARE | SQUARE | SQUARE | - | - | - | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | - | - | - | CHIP CARRIER, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 245 | 245 | 240 | - | - | - | NOT SPECIFIED |
电源 | 3/5 V | 3/5 V | 3/5 V | - | - | - | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | - | Not Qualified |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | - | - | - | 0.8 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | - | - | 5.5 V |
最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | - | - | - | 1.8 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | - | - | - | 3 V |
表面贴装 | YES | YES | YES | - | - | - | YES |
最长断开时间 | 70 ns | 70 ns | 70 ns | - | - | - | 70 ns |
最长接通时间 | 80 ns | 80 ns | 80 ns | - | - | - | 80 ns |
切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | - | - | BREAK-BEFORE-MAKE |
技术 | BICMOS | BICMOS | BICMOS | - | - | - | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | - | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | - | - | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | - | - | - | NO LEAD |
端子节距 | 0.5 mm | 0.8 mm | 0.8 mm | - | - | - | 0.8 mm |
端子位置 | DUAL | QUAD | QUAD | - | - | - | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 20 | - | - | - | NOT SPECIFIED |
宽度 | 3 mm | 4 mm | 4 mm | - | - | - | 4 mm |
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