PRELIMINARY
MX23L6414
64M-BIT MASK ROM
FEATURES
• Bit organization
- 8Mb x 8 (byte mode)
- 4Mb x 16 (word mode)
• Fast access time
- Random access:90/25ns(max.)
• Page Size
- 8 words per page
• Current
- Operating:20mA
- Standby:15uA(max.)
• Supply voltage
- VCC : 2.7 ~ 3.6V
- VCCQ : 2.7 ~ 3.6V
• Package
- 64 ball mini BGA (10.0mm X 13.0mm, ball pitch
1.0mm)
- 56 pin TSOP (14mm x 20mm)
• Temperature
- -25~85° C
PIN DESCRIPTION
Pin Function
Address Inputs, A0 not used in word
mode
D0~D15
Data Outputs
CE0#, CE1# Chip Enable Input
CE2#
OE#
Output Enable Input
BYTE#
Word/Byte mode Selection
VCC
Power Supply Pin
VCCQ
Output VCC Pin
GND
Ground Pin
NC
No Connection
Symbol
A0~A22
CHIP ENABLE TRUTH TABLE
CE2#
CE1#
CE0#
L
L
L
L
L
H
L
H
L
L
H
H
H
L
L
H
L
H
H
H
L
H
H
H
Note: for single-chip applications, CE2#,
strapped to GND.
Device
Enabled
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Disabled
CE1# can be
PIN CONFIGURATION
56 TSOP (Normal Type)
A22
CE1#
A21
A20
A19
A18
A17
A16
VCC
A15
A14
A13
A12
CE0#
NC
NC
A11
A10
A9
A8
GND
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
NC
NC
OE#
NC
D15
D7
D14
D6
GND
D13
D5
D12
D4
VCCQ
GND
D11
D3
D10
D2
VCC
D9
D1
D8
D0
A0
BYTE#
NC
CE2#
MX23L6414
P/N:PM0766
REV. 1.5, MAY. 26, 2005
1
MX23L6414
64 Mini BGA (Top View, Balls Facing Down)
A1
A1
B1
A2
C1
A3
D1
A4
E1
D8
F1
BYTE#
G1
NC
H1
CE2#
A2
A6
B2
GND
C2
A7
D2
A5
E2
D1
F2
D0
G2
A0
H2
NC
A3
A8
B3
A9
C3
A10
D3
A11
E3
D9
F3
D10
G3
D2
H3
VCC
A4
NC
B4
CE0#
C4
A12
D4
NC
E4
D3
F4
D11
G4
VCCQ
H4
GND
A5
A13
B5
A14
C5
A15
D5
NC
E5
D4
F5
D12
G5
D5
H5
D13
A6
VCC
B6
NC
C6
NC
D6
NC
E6
NC
F6
NC
G6
D6
H6
GND
A7
A18
B7
A19
C7
A20
D7
A16
E7
D15
F7
NC
G7
D14
H7
D7
A8
A22
B8
CE1#
C8
A21
D8
A17
E8
NC
F8
OE#
G8
NC
H8
NC
13.0 mm
10.0 mm
MODE SELECTION
CE#
Disabled
Enabled
Enabled
Enabled
OE#
X
H
L
L
Byte#
X
X
L
H
D0~D7
High Z
High Z
D0~D7
D0~D7
D8~D15
High Z
High Z
High Z
D8~D15
Power
Stand-by
Active
Active
Active
ORDER INFORMATION
Part No.
MX23L6414TI-90
MX23L6414TI-10
MX23L6414TI-12
MX23L6414XI-90
MX23L6414XI-10
MX23L6414XI-12
MX23L6414XI-12G
Speed
90ns
100ns
120ns
90ns
100ns
120ns
120ns
Package
56 pin TSOP
56 pin TSOP
56 pin TSOP
64 ball mini BGA
64 ball mini BGA
64 ball mini BGA
64 ball mini BGA
Grade
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
Remark
Pb-free
Note: Industrial grade temperature: -25 ~ 85° C
Commercial grade temperature: 0 ~ 70° C
P/N:PM0766
REV. 1.5, MAY. 26, 2005
2
MX23L6414
ABSOLUTE MAXIMUM RATINGS
Item
Voltage on any Pin Relative to VSS
Ambient Operating Temperature
Storage Temperature
Symbol
VIN
Topr
Tstg
Ratings
-0.3V to 3.9V
-25° C to 85° C
-65° C to 125° C
DC CHARACTERISTICS
(Ta = -25° C ~ 85° C, VCC = 2.7V~3.6V)
Item
Output High Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
Input Leakage Current
Output Leakage Current
Operating Current
Standby Current (CMOS)
Input Capacitance
Output Capacitance
Symbol
VOH
VOL
VIH
VIL
ILI
ILO
ICC
ISTB
CIN
COUT
MIN.
2.4V
-
2.2V
-0.5V
-
-10
-
-
-
-
MAX.
-
0.4V
VCCQ+0.5V
0.8V
10uA
10uA
20mA
15uA
10pF
10pF
0V, VCC
0V, VCC
f=5MHz, CE#=VIL, OE#=VIH
all output open
CE#>VCC-0.2V
Ta = 25° C, f = 1MHZ
Ta = 25° C, f = 1MHZ
Conditions
IOH = -400uA
IOL = 1.6mA
AC CHARACTERISTICS
(Ta = -25° C ~ 85° C, VCC = 2.7V~3.6V)
Item
Read Cycle Time
Address Access Time
Chip Enable Access Time
Page Mode Access Time
Output Enable Time
Output Hold After Address
Output High Z Delay
Symbol
tRC
tAA
tACE
tPA
tOE
tOH
tHZ
23L6414-90
MIN.
90ns
-
-
-
-
0ns
-
MAX.
-
90ns
90ns
25ns
25ns
-
20ns
23L6414-10
MIN.
100ns
-
-
-
-
0ns
-
MAX.
-
100ns
100ns
25ns
25ns
-
20ns
23L6414-12
MIN.
120ns
-
-
-
-
0ns
-
MAX.
-
120ns
120ns
25ns
25ns
-
20ns
Note:Output high-impedance delay (tHZ) is measured
from OE# or CE# going high, and this parameter guar-
anteed by design over the full voltage and temperature
operating range - not tested.
P/N:PM0766
REV. 1.5, MAY. 26, 2005
3
MX23L6414
AC Test Conditions
Input Pulse Levels
Input Rise and Fall Times
Input Timing Level
Output Timing Level
Output Load
0.4V~2.4V
5ns
1.5V
1.5V
See Figure
100pF output load
capacitance
IOH (load)=-400uA
DOUT
IOL (load)=1.6mA
C<100pF
Note:No output loading is present in tester load board.
Active loading is used and under software programming control.
TIMING DIAGRAM
RANDOM READ
Output loading capacitance includes load board's and all stray capacitance.
ADD
ADD
tACE
ADD
tRC
ADD
CE#
tOE
OE#
tAA
tOH
tHZ
DATA
VALID
VALID
VALID
PAGE READ
A4-A22
VALID ADD
A0,A1,A2,A3
1'st ADD
tAA
2'nd ADD
tPA
VALID
VALID
3'rd ADD
DATA
VALID
Note: CE#, OE# are enable.
Page size is 8 words in 16-bit mode, 16 bytes in 8-bit mode.
P/N:PM0766
REV. 1.5, MAY. 26, 2005
4
MX23L6414
REVISION HISTORY
Revision
1.0
Description
Page
1. Random access:90/35(max.)-->80/25(max.)
P1,3
2. Add page size -- 8 words per page
P1
3. Package:64 ball mini BGA(8.0mmx10.0mm)-->64ball mini BGA
P1
(10.0x13.0mm)
4. Add Order Information
P2
5. Modify Standby Current:10uA-->15uA
P1,3
6. Change heading as "RELIMINARY ”
P1
1. Modify DC Characteristics--VOH:VCCQ-0.2V-->2.4V, IOH=-100uA--> P3
-400uA, VOL:0.2V-->0.4V, IOL:100uA-->1.6mA, VIH:2.0-->2.2V
2. Modify AC Test Conditions--Input Pulse Levels:0~VCCQ-->0.4V~2.4V, P4
Input/Output Timing Level:VCCQx0.5-->1.5V, Output Load:30pF-->
100pF output load capacitance
Add CE#=VIL, OE#=VIH in DC Characteristics's ICC
P3
1. Modify fast access time:80ns-->90ns
P1~3
1. Modify Operating Current : 40 --> 20mA
P1,3
1. Added Pb-free package
P2
Date
AUG/29/2001
1.1
SEP/10/2001
1.2
1.3
1.4
1.5
OCT/02/2001
MAY/07/2002
DEC/31/2002
MAY/26/2005
P/N:PM0766
REV. 1.5, MAY. 26, 2005
5
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