The documentation and process conversion
measures necessary to comply with this
revision shall be completed by
28 September 1999
INCH-POUND
MIL-PRF-19500/436A
28 June 1999
SUPERSEDING
MIL-S-19500/436(USAF)
28 August 1970
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE-VARIABLE CAPACITOR
TYPES 1N5461B THROUGH 1N5476B, AND 1N5461C THROUGH 1N5476C
JAN, JANTX, AND JANTXV
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for a silicon, voltage-variable-capacitor diode. Three levels of
product assurance are provided for each device type as specified in MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (similar to D0-7)
1.3 Ratings and characteristics.
P
T
1/
v
RM(wkg)
BV
I
R
= 10
µA
dc
C
V
R
= 4 V dc
f = 1 MHz
Capacitance
ratio
Q
V
R
= 4 V dc
f = 50 MHz
mW
V(pk)
V dc
pF
(See table II)
(See table II)
(See table II)
---
(See table II)
---
Min
---
---
30
Max
400
30
---
1/ Derate linearly 2.67 mW/°C above 25°C.
OPERATING AMBIENT TEMPERATURE: -65°C TO +175°C
STORAGE TEMPERATURE: -65°C TO +200°C
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document
should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad St., Columbus, OH
43216-5000, by using the addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this
document or by letter.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
MIL-PRF-19500/436A
Ltr
LD
BD
BL
LL
LL1
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.018
.022
0.46
0.56
.078
.107
1.98
2.72
.195
.300
4.95
7.62
1.00
1.50
25.40
38.10
---
.050
---
1.27
Notes
3
3
4
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. Package contour optional within BD and length BL. Heat slugs, if any, shall be included within this cylinder but shall not
be subject to minimum limit of BD.
4. Within this zone lead, diameter may vary to allow for lead finishes and irregularities other than heat slugs.
FIGURE 1. Physical dimensions
2
MIL-PRF-19500/436A
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500, and as specified herein.
3.2 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-19500
and as follows:
Q....................Quality factor (ratio of reactance to effective resistance)
TC
C
..............Temperature coefficient of capacitance.
3.3 Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall be as specified in
MIL-PRF-19500, MIL-HDBK-6100, and herein.
3.3.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750 and MIL-PRF-19500, and herein. Lead finish may
be specified in the contract (see 6.2), without affecting the qualified product status of the device or applicable JAN marking.
3.4 Polarity. The polarity shall be indicated with a contrasting color band to denote the cathode end.
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in 1.3 and table I.
3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.
3.7 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing on
the applicable qualified products list before contract award (see 4.2 and 6.4 ).
3
MIL-PRF-19500/436A
4. VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.
4.2.1 Inspection lot. Inspection lot shall be defined in MIL-PRF-19500, except that the lot accumulation period requirements shall be 6
months in lieu of 6 weeks.
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with MIL-PRF-19500 (table IV), and as specified
herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein
shall not be acceptable.
Screen (see table IV
of MIL-PRF-19500)
2
3a
9
10
48 hrs, T
A
= 200°C
Temperature cycling
I
R
See 4.3.1
Measurement
JANTX and JANTXV levels
11
I
R
∆
I
R
= 100% of initial value or 10 nA dc, whichever
is greater.
4.3.1 High temperature reverse bias (HTRB). HTRB conditions are as follows: T
A
= 150°C, V
R
= 25 V dc, t = 96 hours.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as specified herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in
table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500, and as follows. Electrical measurements (endpoints) shall be in accordance
with the applicable footnotes and steps of table III herein.
Subgroup
B2
B3
B6
B7
Method
1051
1027
1032
----
Condition
t
high
= 175°C; 10 cycles
V
R
= 25 V dc, T
A
= 150°C, t = 500 hrs.
t = 1000 hrs.
T
A
= -65°C to +85°C, V
R
= 4 V dc, n = 22, c = 0; (see 4.4.4).
4
MIL-PRF-19500/436A
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in
table VII of MIL-PRF-19500, and as follows. Electrical measurements (endpoints) shall be in accordance with the applicable footnotes
and steps of table III herein.
Subgroup
C2
Method
2036
Condition
Terminal strength: test condition A; 4 lbs, t = 15 sec.
Lead fatigue, test cond. E.
V
R
= 25 V dc, T
A
= 150°C, t = 1000 hrs.
C6
1027
4.4.4 Temperature coefficient of capacitance. Throughout the temperature range specified the capacitance shall not change by more
than .04 %/°C relative to the capacitance value measured at T
A
= 25°C. The temperature coefficient of capacitance may be computed by
the following formula:
TC
C
=
C
T
(+85°C) - C
T
(-65°C)
---------------------------------
85 + 65
10
-------
C
T
(25°C)
2
X
(Accuracy is limited by the CT measurement to
±
0.1 pF.)
5
stm32/stm8
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