SemiWell
Semiconductor
TN1215R
STANDARD TYPE
Silicon Controlled Rectifiers
Features
◆
◆
◆
Symbol
3. Gate
○
○
▼
1
2
3
○
2. Anode
1. Cathode
Repetitive Peak Off-State Voltage : 600V
R.M.S On-State Current ( I
T(RMS)
= 12 A )
Low On-State Voltage (1.3V(Typ.) @ I
TM
)
D-PAK
General Description
2
Standard gate triggering SCR is suitable for the application
where requiring high bidirectional blocking voltage capability and
also suitable for over voltage protection ,motor control circuit in
power tool,inrush current limit circuit and heating control system.
Absolute Maximum Ratings
Symbol
V
DRM
I
T(AV)
I
T(RMS)
I
TSM
I
2
t
di/dt
P
GM
P
G(AV)
I
FGM
V
RGM
T
J
T
STG
( T
J
= 25°C unless otherwise specified )
Condition
Ratings
600
Half Sine Wave : T
C
=108 °C
180° Conduction Angle
1/2 Cycle, 60Hz, Sine Wave
Non-Repetitive
t = 8.3ms
7.6
12
132
87
50
5
0.5
2
5.0
- 40 ~ 125
- 40 ~ 150
Parameter
Repetitive Peak Off-State Voltage
Average On-State Current
R.M.S On-State Current
Surge On-State Current
I
2
t
for Fusing
Critical rate of rise of on-state current
Forward Peak Gate Power Dissipation
Forward Average Gate Power Dissipation
Forward Peak Gate Current
Reverse Peak Gate Voltage
Operating Junction Temperature
Storage Temperature
Units
V
A
A
A
A
2
s
A/
㎲
W
W
A
V
°C
°C
Aug, 2003. Rev. 0
1/5
Copyright@SemiWell Semiconductor Co., Ltd., All rights are reserved.
TN1215R
Electrical Characteristics
Symbol
Items
V
AK
= V
DRM
T
C
= 25 °C
T
C
= 125 °C
I
TM
= 24 A
V
AK
= 6 V(DC), R
L
=10
Ω
I
GT
Gate Trigger Current (2)
T
C
= 25 °C
─
─
15
mA
tp = 380
㎲
─
─
─
─
─
─
10
200
1.6
( T
C
= 25 °C unless otherwise noted )
Conditions
Ratings
Min.
Typ.
Max.
Unit
I
DRM
Repetitive Peak Off-State
Current
Peak On-State Voltage (1)
㎂
V
TM
V
V
D
=6 V(DC), R
L
=10
Ω
V
GT
Gate Trigger Voltage (2)
T
C
= 25 °C
─
─
1.5
V
V
GD
dv/dt
Non-Trigger Gate Voltage (1)
Critical Rate of Rise Off-State
Voltage
V
AK
= 12 V, R
L
=100
Ω
T
C
= 125 °C
Linear slope up to V
D
= V
DRM
67%
Gate open
T
C
= 125 °C
I
T
= 100mA , Gate Open
0.2
200
─
─
─
─
V
V/㎲
I
H
Holding Current
T
C
= 25 °C
─
─
20
mA
R
th(j-c)
R
th(j-a)
Thermal Impedance
Thermal Impedance
Junction to case
Junction to Ambient
─
─
─
─
1.3
70
°C/W
°C/W
※
Notes :
1. Pulse Width
≤
1.0 ms , Duty cycle
≤
1%
2. R
GK
Current not Included in measurement.
2/5
TN1215R
Fig 1. Gate Characteristics
Fig 2. Maximum Case Temperature
140
V
GM
(5V)
P
GM
(5W)
o
10
1
Max. Allowable Case Temperature [ C]
120
θ
= 180
o
Gate Voltage [V]
100
I
GM
(2A)
10
0
P
G(AV)
(0.5W)
25 C
o
80
π
θ
360°
2
π
60
θ
40
0
: Conduction Angl e
V
GD
(0.2V)
10
-1
10
-1
10
0
10
1
10
2
10
3
10
4
1
2
3
4
5
6
7
8
9
Gate Current [mA]
Average On-State Current [A]
Fig 3. Typical Forward Voltage
10
2
Fig 4. Thermal Response
10
1
Transient Thermal Impedance [ C/W]
o
10
0
On-State Current [A]
125 C
10
1
o
10
-1
25 C
o
10
-2
10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
10
-3
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
On-State Voltage [V]
Time (sec)
Fig 5. Typical Gate Trigger Voltage vs.
Junction Temperature
10
10
Fig 6. Typical Gate Trigger Current vs.
Junction Temperature
V
GT
(25
o
C)
V
GT
(t
o
C)
I
GT
(25 C)
I
GT
(t C)
o
o
1
1
0.1
-50
0
50
100
o
150
0.1
-50
0
50
100
o
150
Junction Temperature[ C]
Junction Temperature[ C]
3/5
TN1215R
Fig 7. Typical Holding Current
10
10
θ
= 180
o
Fig 8. Power Dissipation
Max. Average Power Dissipation [W]
8
θ
= 30
6
o
θ
= 120
θ
= 60
o
o
θ
= 90
o
I
H
(25 C)
I
H
(t C)
o
o
1
4
2
0.1
-50
0
50
100
o
150
0
0
1
2
3
4
5
6
7
Junction Temperature[ C]
Average On-State Current [A]
4/5