19-4715; Rev 6; 7/11
KIT
ATION
EVALU
E
BL
AVAILA
16-Bit Microcontroller with Infrared Module
General Description
The MAXQ610 is a low-power, 16-bit MAXQ
®
micro-
controller designed for low-power applications includ-
ing universal remote controls, consumer electronics,
and white goods. The MAXQ610 combines a powerful
16-bit RISC microcontroller and integrated peripherals
including two USARTs and an SPI™ master/slave com-
munications port, along with an IR module with carrier
frequency generation and flexible port I/O capable of
multiplexed keypad control.
The MAXQ610 includes 64KB of flash memory and 2KB
of data SRAM. Intellectual property (IP) protection is
provided by a secure MMU that supports multiple
application privilege levels and protects code against
copying and reverse engineering. Privilege levels
enable vendors to provide libraries and applications to
execute on the MAXQ610, while limiting access to only
data and code allowed by their privilege level.
For the ultimate in low-power battery-operated perfor-
mance, the MAXQ610 includes an ultra-low-power stop
mode (0.2µA, typ). In this mode, the minimum amount
of circuitry is powered. Wake-up sources include exter-
nal interrupts, the power-fail interrupt, and a timer inter-
rupt. The microcontroller runs from a wide 1.70V to 3.6V
operating voltage.
♦
16-Bit Instruction Word, 16-Bit Data Bus
♦
16 x 16-Bit General-Purpose Working Registers
♦
Secure MMU for Application Partitioning and IP
Protection
♦
Memory Features
64KB Flash:
512 Byte Sectors
20,000 Erase/Write Cycles per Sector
Masked ROM Available
2KB Data SRAM
♦
Additional Peripherals
Power-Fail Warning
Power-On Reset/Brownout Reset
Automatic IR Carrier Frequency Generation and
Modulation
Two 16-Bit, Programmable Timers/Counters with
Prescaler and Capture/Compare
SPI and Two USART Communication Ports
Programmable Watchdog Timer
8kHz Nanopower Ring Oscillator Wake-Up Timer
Up to 24 (MAXQ610A) or 32 (MAXQ610B)
General-Purpose I/Os
♦
Low-Power Consumption
0.2µA (typ), 2.0µA (max) in Stop Mode
T
A
= +25°C, Power-Fail Monitor Disabled
3.75mA (typ) at 12MHz in Active Mode
MAXQ610
Applications
Remote Controls
Battery-Powered Portable Equipment
Consumer Electronics
Home Appliances
White Goods
Ordering Information
PART
MAXQ610A-0000+
TEMP RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
PIN-PACKAGE
32 TQFN-EP
†
40 TQFN-EP
†
44 TQFN-EP
†
Bare die
Features
♦
High-Performance, Low-Power 16-Bit RISC Core
♦
DC to 12MHz Operation Across Entire Operating
Range
♦
1.70V to 3.6V Operating Voltage Range
♦
33 Total Instructions for Simplified Programming
♦
Three Independent Data Pointers Accelerate Data
Movement with Automatic Increment/Decrement
♦
Dedicated Pointer for Direct Read from Code Space
MAXQ is a registered trademark of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
MAXQ610B-0000+
MAXQ610J-0000+
MAXQ610X-0000+*
Note:
The 4-digit suffix “-0000” indicates a microcontroller in the
default state with the flash memory unprogrammed. Any value
other than 0000 indicates a device preprogrammed at Maxim
with proprietary customer-supplied software. For more information
on factory preprogramming of these devices, contact Maxim at
https://support.maxim-ic.com/micro.
Information on masked
ROM devices and tape and reel versions are also available.
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*Contact
factory for ordering requirements.
†
EP = Exposed pad.
Pin Configurations and Selector Guide appear at end of
data sheet.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be
simultaneously available through various sales channels. For information about device errata, go to:
www.maxim-ic.com/errata.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
16-Bit Microcontroller with Infrared Module
MAXQ610
TABLE OF CONTENTS
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
SPI Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Memory Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Stack Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Utility ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
IR Carrier Generation and Modulation Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Carrier Generation Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
IR Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
IR Transmit—Independent External Carrier and Modulator Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
IR Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Carrier Burst-Count Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
16-Bit Timers/Counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
General-Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
On-Chip Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
ROM Loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Loading Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
In-Application Flash Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
In-Circuit Debug and JTAG Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Power-Fail Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Applications Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Grounds and Bypassing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Differences for ROM Versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Development and Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
2
_______________________________________________________________________________________
16-Bit Microcontroller with Infrared Module
MAXQ610
LIST OF FIGURES
Figure 1. IR Transmit Frequency Shifting Example (IRCFME = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Figure 2. IR Transmit Carrier Generation and Carrier Modulator Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Figure 3. IR Transmission Waveform (IRCFME = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 4. External IRTXM (Modulator) Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Figure 5. IR Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Figure 6. Receive Burst-Count Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Figure 7. SPI Master Communication Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Figure 8. SPI Slave Communication Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Figure 9. On-Chip Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Figure 10. In-Circuit Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Figure 11. Power-Fail Detection During Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Figure 12. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled . . . . . . . . . . . . . . . . . . . . . . . . .24
Figure 13. Stop Mode Power-Fail Detection with Power-Fail Monitor Disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
LIST OF TABLES
Table 1. Memory Areas and Associated Maximum Privilege Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Table 2. Watchdog Interrupt Timeout (Sysclk = 12MHz, CD[1:0] = 00) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Table 3. USART Mode Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Table 4. Power-Fail Detection States During Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Table 5. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled . . . . . . . . . . . . . . . . . . . . . . . . . .24
Table 6. Stop Mode Power-Fail Detection States with Power-Fail Monitor Disabled . . . . . . . . . . . . . . . . . . . . . . . . . .25
_______________________________________________________________________________________
3
16-Bit Microcontroller with Infrared Module
MAXQ610
ABSOLUTE MAXIMUM RATINGS
Voltage Range on V
DD
with Respect to GND .......-0.3V to +3.6V
Voltage Range on Any Lead with Respect
to GND except V
DD ......................................
-0.3V to (V
DD
+ 0.5V)
Continuous Power Dissipation (Multilayer Board, T
A
= +70°C)
32 TQFN (derate 34.5mW/°C above +70°C) ...........2758.6mW
40 TQFN (derate 35.7mW/°C above +70°C) ..............2963mW
44 TQFN (derate 37mW/°C above +70°C) ..............2758.6mW
Operating Temperature Range...............................0°C to +70°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(V
DD
= V
RST
to 3.6V, T
A
= 0°C to +70°C.) (Note 1)
PARAMETER
Supply Voltage
1.8V Internal Regulator
Power-Fail Warning Voltage for
Supply (Notes 2, 3)
Power-Fail Reset Voltage
(Note 4)
Power-On Reset Voltage
RAM Data-Retention Voltage
Active Current (Note 6)
SYMBOL
V
DD
V
REG18
V
PFW
V
RST
V
POR
V
DRV
I
DD_1
I
S1
Stop-Mode Current
I
S2
Current Consumption During
Power-Fail
Power Consumption During
Power-On Reset
Stop-Mode Resume Time
Power-Fail Monitor Startup Time
Power-Fail Warning Detection
Time
Input Low Voltage for IRTX,
IRRX,
RESET,
and All Port Pins
Input High Voltage for IRTX,
IRRX,
RESET,
and All Port Pins
Input Hysteresis (Schmitt)
Input Low Voltage for HFXIN
I
PFR
I
POR
t
ON
t
PRM_ON
t
PFW
V
IL
V
IH
V
IHYS
V
IL_HFXIN
V
GND
(Note 5)
(Notes 5, 9)
10
V
GND
0.7 x
V
DD
300
0.3 x
V
DD
0.3 x
V
DD
V
DD
Power-Fail On
(Notes 5, 7)
(Note 8)
Monitors V
DD
Monitors V
DD
Monitors V
DD
(Note 5)
Sysclk = 12MHz
Power-Fail Off
T
A
= +25°C
T
A
= 0°C to +70°C
T
A
= +25°C
T
A
= 0°C to +70°C
CONDITIONS
MIN
V
RST
1.62
1.75
1.64
1.0
1.0
3.75
0.2
0.2
22
27.6
5.1
2.0
12
29.5
42
μA
nA
μs
μs
μs
V
V
mV
V
μA
1.8
1.8
1.67
TYP
MAX
3.6
1.98
1.85
1.70
1.42
UNITS
V
V
V
V
V
V
mA
[(3 x I
S2
) + ((PCI - 3) x
(I
S1
+ I
NANO
))]/PCI
100
375 + 8192t
HFXIN
150
4
_______________________________________________________________________________________
16-Bit Microcontroller with Infrared Module
RECOMMENDED DC OPERATING CONDITIONS (continued)
(V
DD
= V
RST
to 3.6V, T
A
= 0°C to +70°C.) (Note 1)
PARAMETER
Input High Voltage for HFXIN
IRRX Input Filter Pulse-Width
Reject
IRRX Input Filter Pulse-Width
Accept
Output Low Voltage for IRTX
SYMBOL
V
IH_HFXIN
t
IRRX_R
t
IRRX_A
V
DD
= 3.6V, I
OL
= 25mA (Note 5)
V
OL_IRTX
V
DD
= 2.35V, I
OL
= 10mA (Note 5)
V
DD
= 1.85V, I
OL
= 4.5mA
V
DD
= 3.6V, I
OL
= 11mA (Note 5)
V
OL
V
DD
= 2.35V, I
OL
= 8mA (Note 5)
V
DD
= 1.85V, I
OL
= 4.5mA
I
OH
= -2mA
(Note 5)
Internal pullup disabled
V
DD
= 3.0V, V
OL
= 0.4V (Note 5)
V
DD
= 2.0V, V
OL
= 0.4V
-100
16
17
1
1/f
HFXIN
From initial oscillation
(Note 5)
8192 x t
HFXIN
0.5
1.0
1.5
DC
1/f
XCLK
45
f
HFIN
HFXOUT = GND
f
XCLK
1/f
CK
T
A
= +25°C
T
A
= +25°C, V
DD
= POR voltage (Note 5)
(Note 5)
Typical at V
DD
= 1.64V, T
A
= +25°C
(Note 5)
3.0
1.7
40
40
8.0
2.4
60
400
20.0
55
12
28
30
V
DD
-
0.5
0.4
0.4
0.4
300
1.0
1.0
1.0
0.5
0.5
0.5
V
DD
15
+100
39
41
12
V
pF
nA
k
V
V
CONDITIONS
MIN
0.7 x
V
DD
TYP
MAX
V
DD
50
UNITS
V
ns
ns
MAXQ610
Output Low Voltage for
RESET
and All Port Pins (Note 10)
Output High Voltage for IRTX and
All Port Pins
Input/Output Pin Capacitance for
All Port Pins
Input Leakage Current
Input Pullup Resistor for
RESET,
IRTX, IRRX, and All Port Pins
EXTERNAL CRYSTAL/RESONATOR
Crystal/Resonator
Crystal/Resonator Period
Crystal/Resonator Warmup Time
Oscillator Feedback Resistor
EXTERNAL CLOCK INPUT
External Clock Frequency
External Clock Period
External Clock Duty Cycle
System Clock Frequency
System Clock Period
NANOPOWER RING OSCILLATOR
Nanopower Ring Oscillator
Frequency
Nanopower Ring Oscillator Duty
Cycle
Nanopower Ring Oscillator
Current
V
OH
C
IO
I
L
R
PU
f
HFXIN
t
HFXIN
t
XTAL_RDY
R
OSCF
f
XCLK
t
XCLK
t
XCLK_DUTY
f
CK
t
CK
MHz
ns
ms
M
MHz
ns
%
MHz
MHz
f
NANO
t
NANO
I
NANO
kHz
%
nA
_______________________________________________________________________________________
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
