Logic Gates Qd 2-Input NOR Gate
参数名称 | 属性值 |
Brand Name | Fairchild Semiconductor |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Fairchild |
零件包装代码 | SOP |
包装说明 | SOP, SOP14,.3 |
针数 | 14 |
制造商包装代码 | 14LD,SOP,EIAJ TYPE II, 5.3MM WIDE |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
系列 | LVC/LCX/Z |
JESD-30 代码 | R-PDSO-G14 |
JESD-609代码 | e3 |
长度 | 10.2 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | NOR GATE |
最大I(ol) | 0.024 A |
湿度敏感等级 | 1 |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
包装方法 | RAIL |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
Prop。Delay @ Nom-Sup | 5.2 ns |
传播延迟(tpd) | 6.2 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
座面最大高度 | 2.1 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 5.3 mm |
Base Number Matches | 1 |
74LCX02SJ | 74LCX02M | 74LCX02MX | 74LCX02MTC | 74LCX02SJX | 74LCX02MTCX | |
---|---|---|---|---|---|---|
描述 | Logic Gates Qd 2-Input NOR Gate | Schottky Diodes u0026 Rectifiers 3rd Gen SiC Schottky Br. Diode 650V 6A | Digital Isolators Dual Channel 1/1 200Mbps Dig Iso | Digital Isolators Dual-CH Digital EH System-Level ESD | Logic Gates Qd 2-Input NOR Gate | Logic Gates Qd 2-Input NOR Gate |
Brand Name | Fairchild Semiconductor | Fairchild Semiconductor | Fairchild Semiconductor | Fairchild Semiconductor | Fairchild Semiconductor | Fairchild Semiconductor |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
零件包装代码 | SOP | SOIC | SOIC | TSSOP | SOP | TSSOP |
包装说明 | SOP, SOP14,.3 | 0.150 INCH, MS-012, SOIC-14 | 0.150 INCH, MS-012, SOIC-14 | 4.40 MM, MO-153AB, TSSOP-14 | 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 | 4.40 MM, MO-153AB, TSSOP-14 |
针数 | 14 | 14 | 14 | 14 | 14 | 14 |
制造商包装代码 | 14LD,SOP,EIAJ TYPE II, 5.3MM WIDE | 14LD,SOIC,JEDEC MS-012, .150\", NARROW BODY | 14LD,SOIC,JEDEC MS-012, .150\", NARROW BODY | 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE | 14LD,SOP,EIAJ TYPE II, 5.3MM WIDE | 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
JESD-609代码 | e3 | e3 | e3 | e4 | e3 | e4 |
长度 | 10.2 mm | 8.6235 mm | 8.6235 mm | 5 mm | 10.2 mm | 5 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | TSSOP | SOP | TSSOP |
封装等效代码 | SOP14,.3 | SOP14,.25 | SOP14,.25 | TSSOP14,.25 | SOP14,.3 | TSSOP14,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | RAIL | RAIL | TAPE AND REEL | RAIL | TAPE AND REEL | TAPE AND REEL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Prop。Delay @ Nom-Sup | 5.2 ns | 5.2 ns | 5.2 ns | 5.2 ns | 5.2 ns | 5.2 ns |
传播延迟(tpd) | 6.2 ns | 6.2 ns | 6.2 ns | 6.2 ns | 6.2 ns | 6.2 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | NO | NO | NO | NO | NO |
座面最大高度 | 2.1 mm | 1.753 mm | 1.753 mm | 1.2 mm | 2.1 mm | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 5.3 mm | 3.9 mm | 3.9 mm | 4.4 mm | 5.3 mm | 4.4 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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