). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 74953
S-80436-Rev. B, 03-Mar-08
www.vishay.com
1
Symbol
R
thJA
R
thJC
Typical
52
12.5
Maximum
65
16
Unit
New Product
SiA912DJ
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
V
DS
= 6 V, V
GS
= 8 V, I
D
= 5.5 A
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 4.4 A, di/dt = 100 A/µs, T
J
= 25 °C
I
S
= 4.4 A, V
GS
=
0 V
0.8
15
8
8.5
6.5
V
DD
= 6 V, R
L
= 1.6
Ω
I
D
≅
4.4 A, V
GEN
= 8 V, R
g
= 1
Ω
V
DD
= 6 V, R
L
= 1.4
Ω
I
D
≅
4.4 A, V
GEN
= 4.5 V, R
g
= 1
Ω
f = 1 MHz
V
DS
= 6 V, V
GS
= 4.5 V, I
D
= 5.5 A
V
DS
= 6 V, V
GS
= 0 V, f = 1 MHz
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 8 V
V
DS
= 12 V, V
GS
= 0 V
V
DS
= 12 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≤
5 V, V
GS
= 4.5 V
V
GS
=
4.5 V, I
D
= 4.2 A
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
T
C
= 25 °C
4.5
20
1.2
30
20
A
V
ns
nC
ns
400
120
70
7.5
4.5
0.6
0.8
2.5
5
15
35
15
5
10
15
10
10
25
55
25
10
15
25
15
ns
Ω
11.5
6.8
nC
pF
V
GS
=
2.5 V, I
D
= 3.8 A
V
GS
=
1.8 V, I
D
= 1.6 A
V
DS
= 6 V, I
D
= 4.2 A
- 20
0.033
0.039
0.051
13
0.040
0.048
0.063
S
Ω
0.4
12
12
- 2.8
1.0
± 100
-1
- 10
V
mV/°C
V
ns
µA
A
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 74953
S-80436-Rev. B, 03-Mar-08
New Product
SiA912DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
20
V
GS
= 5 thru 2.5 V
16
I
D
- Drain Current (A)
V
GS
= 2 V
I
D
- Drain Current (A)
8
10
12
6
8
V
GS
= 1.5 V
4
T
C
= 25 °C
2
T
C
= 125 °C
4
V
GS
= 1 V
0
0.0
0.4
0.8
1.2
1.6
2.0
T
C
= - 55 °C
0
0.0
0.5
1.0
1.5
2.0
V
DS
- Drain-to-Source Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Output Characteristics
0.10
0.09
R
DS(on)
- On-Resistance (Ω)
0.08
0.07
0.06
0.05
0.04
0.03
0
4
8
12
16
20
I
D
- Drain Current (A)
V
GS
= 2.5
V
V
GS
= 4.5
V
V
GS
= 1.8
V
C - Capacitance (pF)
600
Transfer Characteristics
500
C
iss
400
300
200
C
oss
100
C
rss
0
0
3
6
9
12
V
DS
- Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
8
I
D
= 5.5 A
V
GS
- Gate-to-Source Voltage (V)
6
V
DS
= 6 V
4
1.6
1.5
1.4
R
DS(on)
- On-Resistance
(Normalized)
Capacitance
V
GS
= 4.5
V,
2.5
V,
1.8
V,
I
D
= 4.2 A
1.3
1.2
1.1
1.0
0.9
0.8
V
DS
= 9.6 V
2
0
0
2
4
6
8
0.7
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 74953
S-80436-Rev. B, 03-Mar-08
www.vishay.com
3
New Product
SiA912DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.12
10
R
DS(on)
- On-Resistance (Ω)
0.10
I
S
- Source Current (A)
0.08
T
J
= 150 °C
T
J
= 25 °C
0.06
I
D
= 4.2 A, 125 °C
1
0.04
I
D
= 4.2 A, 25 °C
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.02
0
1
2
3
4
5
V
SD
- Source-to-Drain Voltage (V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
0.8
0.7
I
D
= 250 µA
0.6
V
GS(th)
(V)
0.5
0.4
0.3
On-Resistance vs. Gate-to-Source Voltage
20
15
Power (W)
- 25
0
25
50
75
100
125
150
10
5
0.2
0.1
- 50
0
0.001
0.01
0.1
1
Pulse (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
10
I
D
- Drain Current (A)
Single Pulse Power (Junction-to-Ambient)
100
µs
1 ms
10 ms
100 ms
1s
10 s
DC
T
A
= 25 °C
Single Pulse
0.01
0.1
*
V
GS
1
10
100
V
DS
- Drain-to-Source
Voltage
(V)
minimum
V
GS
at
which
R
DS(on)
is specified
BVDSS Limited
1
0.1
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
Document Number: 74953
S-80436-Rev. B, 03-Mar-08
New Product
SiA912DJ
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
14
12
I
D
- Drain Current (A)
10
8
6
4
2
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Power Dissipation (W)
6
8
4
Package Limited
2
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
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