Multiplexer Switch ICs 8:1 8Ch Fault Prtcd Analog MUX
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SO-24 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 长度 | 15.4 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 标称断态隔离度 | 68 dB |
| 通态电阻匹配规范 | 300 Ω |
| 最大通态电阻 (Ron) | 3000 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大信号电流 | 0.02 A |
| 最大供电电流 (Isup) | 2.5 mA |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 1 ns |
| 最长接通时间 | 1 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| MAX388EWG-T | MAX389C-D- | MAX389C-D | MAX389EWG-T | MAX388CWG+T | MAX388CPN+ | MAX389EPN+ | MAX389CWG+T | MAX389CPN+ | MAX388EPN+ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Multiplexer Switch ICs 8:1 8Ch Fault Prtcd Analog MUX | Multiplexer Switch ICs | Multiplexer Switch ICs High Voltage, Fault-Protected Analog Multiplexer | Multiplexer Switch ICs 8:2 8Ch Fault Prtcd Analog MUX | Multiplexer Switch ICs 8:1 8Ch Fault Prtcd Analog MUX | Multiplexer Switch ICs 8:1 8Ch Fault Prtcd Analog MUX | Multiplexer Switch ICs 8:2 8Ch Fault Prtcd Analog MUX | Multiplexer Switch ICs 8:2 8Ch Fault Prtcd Analog MUX | Multiplexer Switch ICs 8:2 8Ch Fault Prtcd Analog MUX | Multiplexer Switch ICs 8:1 8Ch Fault Prtcd Analog MUX |
| 是否无铅 | 含铅 | - | - | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | - | - | SOIC | SOIC | DIP | DIP | SOIC | DIP | DIP |
| 包装说明 | SO-24 | - | - | SO-24 | SOP, | DIP, DIP18,.3 | DIP, DIP18,.3 | SOP, | DIP, | DIP, |
| 针数 | 24 | - | - | 24 | 24 | 18 | 18 | 24 | 18 | 18 |
| Reach Compliance Code | not_compliant | - | - | not_compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | - | - | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G24 | - | - | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T18 | R-PDIP-T18 | R-PDSO-G24 | R-PDIP-T18 | R-PDIP-T18 |
| JESD-609代码 | e0 | - | - | e0 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 15.4 mm | - | - | 15.4 mm | 15.4 mm | 22.86 mm | 22.86 mm | 15.4 mm | 22.86 mm | 22.86 mm |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 标称负供电电压 (Vsup) | -15 V | - | - | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | - | - | 4 | 8 | 8 | 4 | 4 | 4 | 8 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | - | - | 24 | 24 | 18 | 18 | 24 | 18 | 18 |
| 标称断态隔离度 | 68 dB | - | - | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB |
| 通态电阻匹配规范 | 300 Ω | - | - | 300 Ω | 300 Ω | 300 Ω | 300 Ω | 300 Ω | 300 Ω | 300 Ω |
| 最大通态电阻 (Ron) | 3000 Ω | - | - | 3000 Ω | 3000 Ω | 3000 Ω | 3000 Ω | 3000 Ω | 3000 Ω | 3000 Ω |
| 最高工作温度 | 85 °C | - | - | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | - | - | SOP | SOP | DIP | DIP | SOP | DIP | DIP |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | - | - | 240 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | - | - | 2.65 mm | 2.65 mm | 4.572 mm | 4.572 mm | 2.65 mm | 4.572 mm | 4.572 mm |
| 标称供电电压 (Vsup) | 15 V | - | - | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | - | - | YES | YES | NO | NO | YES | NO | NO |
| 最长断开时间 | 1 ns | - | - | 1 ns | 1 ns | 1 ns | 1 ns | 1 ns | 1 ns | 1 ns |
| 最长接通时间 | 1 ns | - | - | 1 ns | 1 ns | 1 ns | 1 ns | 1 ns | 1 ns | 1 ns |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | MATTE TIN | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN | TIN | TIN |
| 端子形式 | GULL WING | - | - | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | - | - | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.5 mm | - | - | 7.5 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.62 mm | 7.62 mm |
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