* Pb containing terminations are not RoHS compliant, exemptions may apply.
t
≤
10 s
Steady State
Steady State
Symbol
R
thJA
R
thJF
Typical
88
120
65
Maximum
110
150
80
°C/W
Unit
Document Number: 72017
S-81221-Rev. C, 02-Jun-08
www.vishay.com
1
Si6969BDQ
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Diode Forward Voltage
a
Dynamic
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
t
rr
I
F
= - 1.25 A, dI/dt = 100 A/µs
V
DD
= - 6 V, R
L
= 6
Ω
I
D
≅
- 1.0 A, V
GEN
= - 4.5 V, R
G
= 6
Ω
V
DS
= - 6 V, V
GS
= - 4.5 V, I
D
= - 4.6 A
16.5
2
4.7
20
35
110
90
100
40
60
180
150
200
ns
25
nC
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
SD
V
DS
= V
GS
, I
D
= - 250 µA
V
DS
= 0 V, V
GS
= ± 8 V
V
DS
= - 9.6 V, V
GS
= 0 V
V
DS
= - 9.6 V, V
GS
= 0 V, T
J
= 70 °C
V
DS
- 8 V, V
GS
= - 4.5 V
V
GS
=
- 4.5 V, I
D
= - 4.6 A
V
GS
= - 2.5 V, I
D
= - 3.8 A
V
GS
= - 1.8 V, I
D
= - 3.0 A
V
DS
= - 8 V, I
D
= - 4.6 A
I
S
= - 1.25 A, V
GS
= 0 V
- 30
0.024
0.031
0.044
18
- 0.68
- 1.1
0.030
0.040
0.055
S
V
Ω
- 0.45
- 0.8
± 100
-1
- 25
V
nA
µA
A
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
便携式医疗设备的特殊性决定了它们应该是对用户友好的、必须工作在无菌环境下，并且空间占用小、耗能低。 同时，便携式医疗设备还需要足够的计算能力以便处理医疗数据，能够连接到无线或有线接口以便记录和发送数据。从设计人员的角度考虑，上述需求需要低功耗的单片机（MCU）和数字信号控制器（Digital Signal Controller，DSC）。 正是有了嵌入式处理器，设计人员才有可能设...[详细]
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