Buffers & Line Drivers 5V/3.3V Differential Receiver
参数名称 | 属性值 |
厂商名称 | Microchip(微芯科技) |
包装说明 | SOP, |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
输入特性 | DIFFERENTIAL |
接口集成电路类型 | LINE RECEIVER |
接口标准 | GENERAL PURPOSE |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e4 |
长度 | 4.93 mm |
标称负供电电压 | -3.3 V |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
认证状态 | Not Qualified |
最大接收延迟 | 0.325 ns |
接收器位数 | 1 |
座面最大高度 | 1.73 mm |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 3.94 mm |
SY10EL16VZG | SY10EL16VKG | SY100EL16VZG | SY10EL16VZG-TR | |
---|---|---|---|---|
描述 | Buffers & Line Drivers 5V/3.3V Differential Receiver | Buffers & Line Drivers 5V/3.3V Enhanced Differential Receiver | Buffers & Line Drivers 5V/3.3V Differential Receiver | Buffers & Line Drivers |
包装说明 | SOP, | TSSOP, | SOP, SOP8,.24 | LEAD FREE, SOIC-8 |
Reach Compliance Code | unknown | compliant | compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
输入特性 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
接口集成电路类型 | LINE RECEIVER | LINE RECEIVER | LINE RECEIVER | LINE RECEIVER |
接口标准 | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE |
JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 4.93 mm | 3 mm | 4.93 mm | 4.93 mm |
标称负供电电压 | -3.3 V | -3.3 V | -3.3 V | -3.3 V |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | TSSOP | SOP | SOP |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大接收延迟 | 0.325 ns | 0.325 ns | 0.375 ns | 0.325 ns |
接收器位数 | 1 | 1 | 1 | 1 |
座面最大高度 | 1.73 mm | 1.1 mm | 1.73 mm | 1.73 mm |
表面贴装 | YES | YES | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 3.94 mm | 3 mm | 3.94 mm | 3.94 mm |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) |
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