Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +160NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
8-Pin TDFN
Junction-to-Ambient Thermal Resistance (q
JA
) ..........48°C/W
Junction-to-Case Thermal Resistance (q
JC
) .................8°C/W
10-Pin TDFN
Junction-to-Ambient Thermal Resistance (q
JA
) ..........41°C/W
Junction-to-Case Thermal Resistance (q
JC
) .................9°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
PARAMETER
DC CHARACTERISTICS
Power Supply Range
Continuous Current Through
Switch
V
CC
I
A_
SYMBOL
(V
CC
= +3.0V to +5.5V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= 5V and T
A
= +25°C.) (Note 2)
CONDITIONS
MIN
3.0
(MAX14759)
(MAX14761/MAX14763)
V
CC
≤ 4.7V
Supply Current
I
CC
V
CC
> 4.7V
Analog-Signal Range
V
COM
,
V
A_
, V
B_
R
ON
Switch open or closed
I
B
=
Q500mA,
V
A
=
Q25V
(MAX14759)
I
COM
or I
B_
=
Q250mA,
V
A
_=
Q25V
(MAX14761/MAX14763)
-25V < V
A
< +25V, I
B
=
Q500mA
(MAX14759)
On-Resistance Flatness
DR
ON
-25V < V
A_
< +25V, I
B_
or I
COM
=
Q250mA
(MAX14761/MAX14763)
V
A
= +25V, V
B
= 0V, Figure 1 (MAX14759)
V
A_
= +25V, V
COM
or V
B_
= 0V, Figure 1
(MAX14761/MAX14763)
-250
-250
-100
-100
V
EN_
= V
CC
V
EN_
= V
CC
/2
V
EN_
= V
CC
V
EN_
= V
CC
/2
-25
0.6
1.2
2.4
5.1
+250
+250
+100
+100
2
TYP
MAX
5.5
+500
+250
UNITS
V
mA
-500
-250
4.1
4.1
2.5
2.5
10
10
6
6
+25
1
2
I
V
mA
On-Resistance
mI
A, A1, A2 Off-Leakage Current
I
A_(OFF)
nA
COM, B, B1, B2 Off-Leakage
Current
Maxim Integrated
V
COM
or V
B
= 15V, V
A_
= 0V, Figure 1
I
COM(OFF)
, (MAX14759/MAX14763)
I
B_(OFF)
V
B_
= 15V, V
A_
= 0V, Figure 1 (MAX14761)
nA
MAX14759/MAX14761/MAX14763
Above- and Below-the-Rails
Low On-Resistance Analog Switches
ELECTRICAL CHARACTERISTICS (continued)
PARAMETER
SYMBOL
(V
CC
= +3.0V to +5.5V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= 5V and T
A
= +25°C.) (Note 2)
CONDITIONS
V
A
= ±25V, B1, B2, or COM are unconnected,
Figure 1 (MAX14759)
On-Leakage Current
I
ON
V
A
= ±25V, B1, B2, or COM are unconnected,
Figure 1 (MAX14761)
V
A
= ±25V, B1, B2, or COM are unconnected,
Figure 1 (MAX14763)
DIGITAL LOGIC
V
CC
= 3.0V
Input-Voltage Low
V
IL
V
CC
= 3.6V
V
CC
= 4.5V
V
CC
= 5.5V
V
CC
= 3.0V
Input-Voltage High
V
IH
V
CC
= 3.6V
V
CC
= 4.5V
V
CC
= 5.5V
Input Current
AC CHARACTERISTICS
Power-On Time
Enable Turn-On Time
Enable Turn-Off Time
Break-Before-Make Interval
Off-Isolation
Crosstalk
-3dB Bandwidth
Total Harmonic Distortion Plus
Noise
Charge Injection
Input Capacitance
THERMAL PROTECTION
Thermal Shutdown Temperature
Shutdown Temperature Hysteresis
ESD PROTECTION
All Pins
Human Body Model
Q2
kV
Note 2:
All devices are 100% production tested at T
A
= +25NC. Specifications over operating temperature range are guaranteed
by design.
Note 3:
The power-on time is defined as the settling time for the charge pump’s output to reach steady-state value within 1%.
Description Resource Path Location Type
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