BFR740L3RH
Low Noise Silicon Germanium Bipolar RF Transistor
Data Sheet
Revision 2.1, 2016-03-16
RF & Protection Devices
Edition 2016-03-16
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2016 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
BFR740L3RH
Revision History: 2016-03-16, Revision 2.1
Page
Revision 2.0
Subjects (major changes since last revision)
This data sheet replaces the revision from 2010-09-08. The reason for the new revision is to
increase the information content for the circuit designer. The performance parameters are now
enlisted in a table containing many relevant application frequencies. The measurement of
typical devices have been repeated and the device description has been expanded by adding
several new charasteristic curves. For customers who bought the product prior to the issue of
the new revision the old specification remain valid. There is no reason to adjust existing
applications.
Table 7-2: typical value for fT has been corrected to value as in Figure 7-7
Figure 7-2 has been reformatted for clearness
Revision 2.1,
page 11
Revision 2.1,
page 17
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,
POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
Data Sheet
3
Revision 2.1, 2016-03-16
BFR740L3RH
Table of Contents
Table of Contents
Table of Contents
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
8
9
Product Brief
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Applications
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Configuration
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Maximum Ratings
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Frequency Dependent AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Characteristic DC Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Characteristic AC Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
11
12
17
20
Simulation Data
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Package Information TSLP-3-9
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Data Sheet
4
Revision 2.1, 2016-03-16
BFR740L3RH
List of Figures
List of Figures
Figure 6-1
Figure 7-1
Figure 7-2
Figure 7-3
Figure 7-4
Figure 7-5
Figure 7-6
Figure 7-7
Figure 7-8
Figure 7-9
Figure 7-10
Figure 7-11
Figure 7-12
Figure 7-13
Figure 7-14
Figure 7-15
Figure 7-16
Figure 7-17
Figure 7-18
Figure 7-19
Figure 7-20
Figure 9-1
Figure 9-2
Figure 9-3
Figure 9-4
Total Power Dissipation
P
tot
=
f
(
T
S
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BFR740L3RH Testing Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Collector Current vs. Collector Emitter Voltage
I
C
=
f
(
V
CE
),
I
B
= Parameter in µA . . . . . . . . . . . . .
DC Current Gain
h
FE
=
f
(
I
C
),
V
CE
= 3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Collector Current vs. Base Emitter Forward Voltage
I
C
=
f
(
V
BE
),
V
CE
= 2 V . . . . . . . . . . . . . . . . .
Base Current vs. Base Emitter Forward Voltage
I
B
=
f
(
V
BE
),
V
CE
= 2 V . . . . . . . . . . . . . . . . . . . .
Base Current vs. Base Emitter Reverse Voltage
I
B
=
f
(
V
EB
),
V
CE
= 2 V . . . . . . . . . . . . . . . . . . . .
Transition Frequency
f
T
=
f
(
I
C
),
f
= 2 GHz,
V
CE
= Parameter in V . . . . . . . . . . . . . . . . . . . . . . . . .
3rd Order Intercept Point at output
OIP
3
=
f
(
I
C
),
Z
S
=
Z
L
= 50
Ω,
V
CE,
f
= Parameters . . . . . . . . .
3rd Order Intercept Point at output
OIP
3
[dBm] =
f
(
I
C,
V
CE
),
Z
S
=
Z
L
= 50
Ω,
f
= 5.5 GHz . . . . . . .
Compression Point at output
OP
1dB
[dBm] =
f
(
I
C,
V
CE
),
Z
S
=
Z
L
= 50
Ω,
f
= 5.5 GHz . . . . . . . . . .
Collector Base Capacitance
C
CB
=
f
(
V
CB
),
f
= 1 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Gain
G
ma,
G
ms,
|
S
21
|
2
=
f
(
f
),
V
CE
= 3 V,
I
C
= 15 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Power Gain
G
max
=
f
(
I
C
),
V
CE
= 3 V,
f
= Parameter in GHz . . . . . . . . . . . . . . . . . . . . . .
Maximum Power Gain
G
max
=
f
(
V
CE
),
I
C
= 15 mA,
f
= Parameter in GHz . . . . . . . . . . . . . . . . . . .
Input Matching
S
11
=
f
(
f
),
V
CE
= 3 V,
I
C
= 6 / 15 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Source Impedance for Minimum Noise Figure
Z
opt
=
f
(
f
),
V
CE
= 3 V,
I
C
= 6 / 15 mA . . . . . . . . . . .
Output Matching
S
22
=
f
(
f
),
V
CE
= 3 V,
I
C
= 6 / 15 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Noise Figure
NF
min
=
f
(
f
),
V
CE
= 3 V,
I
C
= 6 / 15 mA,
Z
S
=
Z
opt
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Noise Figure
NF
min
=
f
(
I
C
),
V
CE
= 3 V,
Z
S
=
Z
opt
,
f
= Parameter in GHz . . . . . . . . . . . . . . . . . . . . .
Noise Figure
NF
50
=
f
(
I
C
),
V
CE
= 3 V,
Z
S
= 50
Ω
, f
= Parameter in GHz . . . . . . . . . . . . . . . . . . . .
Package Outline of TSLP-3-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Footprint of TSLP-3-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Marking Layout of TSLP-3-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tape of TSLP-3-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
12
17
17
18
18
19
20
20
21
21
22
22
23
23
24
24
25
25
26
26
28
28
28
28
Data Sheet
5
Revision 2.1, 2016-03-16
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