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MAX503EWG-T

产品描述Digital to Analog Converters - DAC 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC
产品类别模拟混合信号IC    转换器   
文件大小116KB,共16页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX503EWG-T概述

Digital to Analog Converters - DAC 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC

MAX503EWG-T规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码SOIC
包装说明0.300 INCH, SOP-24
针数24
Reach Compliance Codenot_compliant
最大模拟输出电压4.6 V
最小模拟输出电压-4.6 V
转换器类型D/A CONVERTER
输入位码BINARY, OFFSET BINARY
输入格式PARALLEL, 8 BITS
JESD-30 代码R-PDSO-G24
JESD-609代码e0
长度15.4 mm
最大线性误差 (EL)0.0488%
湿度敏感等级1
标称负供电电压-5 V
位数10
功能数量1
端子数量24
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP24,.4
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)245
电源5/+-5 V
认证状态Not Qualified
座面最大高度2.65 mm
标称安定时间 (tstl)25 µs
最大压摆率0.4 mA
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.5 mm

MAX503EWG-T相似产品对比

MAX503EWG-T MAX503CNG MAX503EAG-T MAX503EWG MAX503CWG MAX503CAG MAX503EAG MAX503ENG MAX503CWG-T MAX503CAG-T
描述 Digital to Analog Converters - DAC 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC Digital to Analog Converters - DAC 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC Digital to Analog Converters - DAC 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC Digital to Analog Converters - DAC 10-Bit Precision DAC Digital to Analog Converters - DAC 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC Digital to Analog Converters - DAC 10-Bit Precision DAC Digital to Analog Converters - DAC 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC Digital to Analog Converters - DAC 10-Bit Precision DAC Digital to Analog Converters - DAC 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC Digital to Analog Converters - DAC 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 SOIC DIP SSOP SOIC SOIC SSOP SSOP DIP SOIC SSOP
包装说明 0.300 INCH, SOP-24 0.300 INCH, PLASTIC, DIP-24 SSOP-24 0.300 INCH, SOP-24 0.300 INCH, SOP-24 SSOP-24 SSOP-24 0.300 INCH, PLASTIC, DIP-24 0.300 INCH, SOP-24 SSOP-24
针数 24 24 24 24 24 24 24 24 24 24
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
最大模拟输出电压 4.6 V 4.6 V 4.6 V 4.6 V 4.6 V 4.6 V 4.6 V 4.6 V 4.6 V 4.6 V
最小模拟输出电压 -4.6 V -4.6 V -4.6 V -4.6 V -4.6 V -4.6 V -4.6 V -4.6 V -4.6 V -4.6 V
转换器类型 D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER
输入位码 BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY
输入格式 PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS
JESD-30 代码 R-PDSO-G24 R-PDIP-T24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDIP-T24 R-PDSO-G24 R-PDSO-G24
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 15.4 mm 30.545 mm 8.2 mm 15.4 mm 15.4 mm 8.2 mm 8.2 mm 30.545 mm 15.4 mm 8.2 mm
最大线性误差 (EL) 0.0488% 0.0488% 0.0488% 0.0488% 0.0488% 0.0488% 0.0488% 0.0488% 0.0488% 0.0488%
湿度敏感等级 1 1 1 1 1 1 1 1 1 1
标称负供电电压 -5 V -5 V -5 V -5 V -5 V -5 V -5 V -5 V -5 V -5 V
位数 10 10 10 10 10 10 10 10 10 10
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 24 24 24 24 24 24 24 24 24 24
最高工作温度 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP DIP SSOP SOP SOP SSOP SSOP DIP SOP SSOP
封装等效代码 SOP24,.4 DIP24,.3 SSOP24,.3 SOP24,.4 SOP24,.4 SSOP24,.3 SSOP24,.3 DIP24,.3 SOP24,.4 SSOP24,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH IN-LINE SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度) 245 245 245 245 245 245 245 245 245 245
电源 5/+-5 V 5/+-5 V 5/+-5 V 5/+-5 V 5/+-5 V 5/+-5 V 5/+-5 V 5/+-5 V 5/+-5 V 5/+-5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.65 mm 4.572 mm 1.99 mm 2.65 mm 2.65 mm 1.99 mm 1.99 mm 4.572 mm 2.65 mm 1.99 mm
标称安定时间 (tstl) 25 µs 25 µs 25 µs 25 µs 25 µs 25 µs 25 µs 25 µs 25 µs 25 µs
最大压摆率 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES NO YES YES YES YES YES NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
端子节距 1.27 mm 2.54 mm 0.65 mm 1.27 mm 1.27 mm 0.65 mm 0.65 mm 2.54 mm 1.27 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 7.5 mm 7.62 mm 5.29 mm 7.5 mm 7.5 mm 5.29 mm 5.29 mm 7.62 mm 7.5 mm 5.29 mm

 
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