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IS61LP6432A-133TQ-TR

产品描述SRAM 2Mb 64Kx32 133Mhz Sync SRAM 3.3v
产品类别存储   
文件大小225KB,共17页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
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IS61LP6432A-133TQ-TR概述

SRAM 2Mb 64Kx32 133Mhz Sync SRAM 3.3v

IS61LP6432A-133TQ-TR规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
ISSI(芯成半导体)
产品种类
Product Category
SRAM
RoHSN
Memory Size2 Mbit
Organization64 k x 32
Access Time4 ns
Maximum Clock Frequency133 MHz
接口类型
Interface Type
Parallel
电源电压-最大
Supply Voltage - Max
3.465 V
电源电压-最小
Supply Voltage - Min
3.135 V
Supply Current - Max180 mA
最小工作温度
Minimum Operating Temperature
0 C
最大工作温度
Maximum Operating Temperature
+ 70 C
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
TQFP-100
系列
Packaging
Reel
数据速率
Data Rate
SDR
Memory TypeSDR
类型
Type
Synchronous
Number of Ports1
Moisture SensitiveYes
工厂包装数量
Factory Pack Quantity
800
单位重量
Unit Weight
0.023175 oz

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IS61LP6436A
IS61LP6432A
64K x 32, 64K x 36 SYNCHRONOUS
PIPELINED STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Pentium™ or linear burst sequence control us-
ing MODE input
• Three chip enables for simple depth expansion
and address pipelining
• Common data inputs and data outputs
• JEDEC 100-Pin TQFP package
• Power-down snooze mode
• Power Supply:
+3.3V V
dd
+3.3V or 2.5V V
ddq
(I/O)
• Lead-free available
®
Long-term Support
World Class Quality
MAY 2017
DESCRIPTION
The
ISSI
IS61LP6432A/36A is a high-speed synchronous
static RAM designed to provide a burstable, high-perfor-
mance memory for high speed networking and communica-
tion applications. The IS61LP6432A is organized as 64K
words by 32 bits and the IS61LP6436A is organized as 64K
words by 36 bits. Fabricated with
ISSI
's advanced CMOS
technology, the device integrates a 2-bit burst counter,
high-speed SRAM core, and high-drive capability outputs
into a single monolithic circuit. All synchronous inputs pass
through registers controlled by a positive-edge-triggered
single clock input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be from one
to four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be writ-
ten.
BW1 controls DQa, BW2 controls DQb, BW3
controls
DQc, BW4 controls DQd, conditioned by BWE being LOW.
A LOW on GW input would cause all bytes to be written.
Bursts can be initiated with either ADSP (Address Status
Processor) or
ADSC
(Address Status Cache Controller)
input pins. Subsequent burst addresses can be gener-
ated internally and controlled by the
ADV
(burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW. Interleave
burst is achieved when this pin is tied HIGH or left floating.
FAST ACCESS TIME
Symbol
t
kq
t
kc
Parameter
Clock Access Time
Cycle Time
Frequency
-166
3.5
6
166
-133
4
7.5
133
Units
ns
ns
MHz
Copyright © 2017 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be ex-
pected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon
Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.
Rev. C1
05/22/2017
1

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