Flip Flops 3.3V/5V ECL 6-Bit Diff w/Master Reset
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | QFP |
| 包装说明 | LQFP, QFP32,.35SQ,32 |
| 针数 | 32 |
| 制造商包装代码 | 873A-02 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 1 week |
| 其他特性 | NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V |
| 计数方向 | RIGHT |
| 系列 | 10E |
| JESD-30 代码 | S-PQFP-G32 |
| JESD-609代码 | e3 |
| 长度 | 7 mm |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 3000000000 Hz |
| 湿度敏感等级 | 2 |
| 位数 | 6 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装等效代码 | QFP32,.35SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | -5.2 V |
| 传播延迟（tpd） | 0.55 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7 mm |
| MC10EP451FAG | MC100EP451MNG | MC10EP451MNG | MC10EP451MNR4G | |
|---|---|---|---|---|
| 描述 | Flip Flops 3.3V/5V ECL 6-Bit Diff w/Master Reset | Flip Flops BBG ECL RESET | Flip Flops BBG ECL RESET | Flip Flops BBG ECL RESET |
| Brand Name | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| 零件包装代码 | QFP | QFN | QFN | QFN |
| 包装说明 | LQFP, QFP32,.35SQ,32 | HVQCCN, LCC32,.2SQ,20 | 5 X 5 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFN-32 | 5 X 5 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFN-32 |
| 针数 | 32 | 32 | 32 | 32 |
| 制造商包装代码 | 873A-02 | 488AM | 488AM | 488AM |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| 其他特性 | NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V | NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V | NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V | NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V |
| 计数方向 | RIGHT | RIGHT | RIGHT | RIGHT |
| 系列 | 10E | 100E | 10E | 10E |
| JESD-30 代码 | S-PQFP-G32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 |
| JESD-609代码 | e3 | e3 | e3 | e3 |
| 长度 | 7 mm | 5 mm | 5 mm | 5 mm |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 3000000000 Hz | 3000000000 Hz | 3000000000 Hz | 3000000000 Hz |
| 湿度敏感等级 | 2 | 1 | 1 | 1 |
| 位数 | 6 | 6 | 6 | 6 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | QFP32,.35SQ,32 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | -5.2 V | -4.5 V | -5.2 V | -5.2 V |
| 传播延迟（tpd） | 0.55 ns | 0.55 ns | 0.55 ns | 0.55 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | ECL | ECL | ECL | ECL |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子形式 | GULL WING | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.8 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 7 mm | 5 mm | 5 mm | 5 mm |
| Factory Lead Time | 1 week | 1 week | 1 week | - |
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