电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MV1N5949UR-1TR

产品描述Zener Diode, 100V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2
产品类别分立半导体    二极管   
文件大小377KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

MV1N5949UR-1TR概述

Zener Diode, 100V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2

MV1N5949UR-1TR规格参数

参数名称属性值
是否Rohs认证不符合
Objectid1996508175
零件包装代码DO-213AB
包装说明O-LELF-R2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AB
JESD-30 代码O-LELF-R2
JESD-609代码e0
湿度敏感等级1
元件数量1
端子数量2
最高工作温度175 °C
最低工作温度-65 °C
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
极性UNIDIRECTIONAL
最大功率耗散1.25 W
认证状态Not Qualified
标称参考电压100 V
表面贴装YES
技术ZENER
端子面层TIN LEAD
端子形式WRAP AROUND
端子位置END
最大电压容差20%
工作测试电流3.7 mA

文档预览

下载PDF文档
1N5913BUR-1 thru 1N5956BUR-1
(or MLL5913B thru MLL5956B)
SCOTTSDALE DIVISION
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 1.5 WATT ZENERS
DESCRIPTION
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB
package is similar in electrical features to the JEDEC registered 1N5913B
thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection
for applications of high density and low parasitic requirements. Due to its
glass hermetic qualities and metallurgically enhanced internal contacts, it
may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as
described in Features below. Zener voltage tolerance options are identified
by part number suffix including tight-tolerance. A variety of other Zener
product offerings and packages are available by Microsemi to meet higher
or lower power and test current applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
FEATURES
Electrically similar to the JEDEC registered 1N5913B
thru 1N5956B zener series
Zener voltages available 3.3V to 200V
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers, e.g. MX1N5913BUR-1,
MV1N5923CUR-1, MSP1N5952DUR-1, etc.
Surface mount equivalents also available as
SMBJ5913B to SMBJ5956B, SMBG5913B to
SMBG5956B, or SMAJ5913B to SMAJ5956B (see
separate data sheets)
Plastic body axial-leaded Zener equivalents are also
available as 1N5913BP to 1N5956BP (see separate
data sheet)
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 3.3 to 200 V
Leadless package for surface mounting
Ideal for high density mounting
Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
Standard voltage tolerances are +/- 5% with B suffix
and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to +175
º
C
Thermal Resistance: 40
º
C/W junction to end cap, or
120
º
C/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint (see
last page)
Steady-State Power: 1.50 watts at T
EC
< 115
o
C, or
1.25 watts at T
A
= 25
º
C when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed DO-213AB glass MELF
package
TERMINALS: End caps, tin-lead plated solderable
per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N5913BUR-1−1N5956BUR-1
Copyright
2002
11-05-2003 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
今天是首个“烈士纪念日”,你知道吗?
今天是首个“烈士纪念日”。让我们纪念英雄们吧。...
凤凰息梧桐 聊聊、笑笑、闹闹
毕业出一大波书籍,C/C++,linux,算法,其它等等,大甩卖,仅剩3天
本帖最后由 flashtt 于 2019-6-21 15:34 编辑 马上就要入职了,之前买了许多书,好多都没看过,快递实在麻烦,以后估计看的机会就更少了,低价转给需要的人,量大优惠,需要的请留言或联系qq ......
flashtt 淘e淘
WINCE 5.0 on s3c2440: 谁在改动串口设置?我想用串口0作为调试口,在OEMInitDebugSerial对串口0的设置被谁修改了?
我在J:\WINCE500\PLATFORM\SMDK2440A\Src\Kernel\Oal\debug.c里修改OEMInitDebugSerial以使用串口0为调试口; 启动WINCE时输出下面信息(有些乱码),然后就看不到任何信息了。 我再用JTAG工具 ......
nibian 嵌入式系统
分析ESD原因以及防护和改善对策(汇集多年的ESD整改经验)免费万岁
分析ESD原因以及防护和改善对策分析ESD原因以及防护和改善对策...
linda_xia 模拟电子
简易阻抗匹配方法
在高速的设计中,阻抗的匹配与否关系到信号的质量优劣。阻抗匹配的技术可以说是丰富多样,在此只对几种简单常用的端接方法进行介绍。为什么要进行阻抗匹配呢?无外乎几种原因,如减少反射、控制 ......
youki12345 测试/测量
【hanker】第3周,M4\M3的比较
第三周的作业: 比较了M3/M4的浮点、电机控制、冬眠模式 直接上附件了 视频在一楼...
zca123 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1155  963  2280  1264  1023  53  50  58  35  9 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved