EEPROM 256x8 - 1.8V Lead Free Package
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | Microchip(微芯科技) |
| 产品种类 Product Category | EEPROM |
| RoHS | Details |
| 安装风格 Mounting Style | SMD/SMT |
| 封装 / 箱体 Package / Case | TSSOP-8 |
| Memory Size | 2 kbit |
| Organization | 256 x 8 |
| 接口类型 Interface Type | Serial, 2-Wire, I2C |
| Access Time | 900 ns |
| Data Retention | 200 Year |
| Maximum Clock Frequency | 0.4 MHz |
| Supply Current - Max | 3 mA |
| 工作电源电压 Operating Supply Voltage | 1.8 V, 5.5 V |
| 最小工作温度 Minimum Operating Temperature | - 40 C |
| 最大工作温度 Maximum Operating Temperature | + 85 C |
| 高度 Height | 1 mm |
| 长度 Length | 3 mm |
| 宽度 Width | 4.4 mm |
| 工作电源电流 Operating Supply Current | 3 mA |
| Programming Voltage | 1.7 V to 5.5 V |
| 工厂包装数量 Factory Pack Quantity | 100 |
| 电源电压-最大 Supply Voltage - Max | 5.5 V |
| 电源电压-最小 Supply Voltage - Min | 1.8 V |
| 单位重量 Unit Weight | 0.005573 oz |
| 24AA02-I-STG | 24AA02-I-PG | 24LC02B-I-STG | 24AA02T-I-SNG | 24AA02T-I/OTG | 24AA02T-I/MSG | 24LC02B-I/MSG | 24AA02-I/SNG | 24LC02BT-I/SNG | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM 256x8 - 1.8V Lead Free Package | EEPROM 256x8 - 1.8V Lead Free Package | EEPROM 256x8 - 1.8V Lead Free Package | EEPROM 256x8 - 1.8V Lead Free Package | EEPROM 256x8 - 1.8V Lead Free Package | 电可擦除可编程只读存储器 256x8 - 1.8V Lead Free Package | 电可擦除可编程只读存储器 256x8 - 1.8V Lead Free Package | 电可擦除可编程只读存储器 256x8 - 1.8V Lead Free Package | 电可擦除可编程只读存储器 256x8 - 1.8V Lead Free Package |
| 是否无铅 | - | - | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | - | - | - | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | - | - | - | - | SOT-23 | MSOP | MSOP | SOIC | SOIC |
| 包装说明 | - | - | - | - | ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN | ROHS COMPLIANT, PLASTIC, MSOP-8 | ROHS COMPLIANT, PLASTIC, MSOP-8 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
| 针数 | - | - | - | - | 5 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | - | - | - | - | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | - | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | - | - | - | - | 0.1 MHz | 0.1 MHz | 0.4 MHz | 0.1 MHz | 0.4 MHz |
| 数据保留时间-最小值 | - | - | - | - | 200 | 200 | 200 | 200 | 200 |
| 耐久性 | - | - | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | - | - | - | - | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR |
| JESD-30 代码 | - | - | - | - | R-PDSO-G5 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | - | - | - | - | e3 | e3 | e3 | e3 | e3 |
| 长度 | - | - | - | - | 2.9 mm | 3 mm | 3 mm | 4.9 mm | 4.9 mm |
| 内存密度 | - | - | - | - | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
| 内存集成电路类型 | - | - | - | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | - | - | - | - | 8 | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | - | - | - | - | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | - | - | - | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | - | - | - | 5 | 8 | 8 | 8 | 8 |
| 字数 | - | - | - | - | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | - | - | - | - | 256 | 256 | 256 | 256 | 256 |
| 工作模式 | - | - | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | - | - | - | - | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
| 封装主体材料 | - | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | - | - | LSSOP | TSSOP | TSSOP | SOP | SOP |
| 封装等效代码 | - | - | - | - | TSOP5/6,.11,37 | TSSOP8,.19 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 |
| 封装形状 | - | - | - | - | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | - | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | - | - | - | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | - | - | - | - | 260 | 260 | 260 | 260 | 260 |
| 电源 | - | - | - | - | 2/5 V | 2/5 V | 3/5 V | 2/5 V | 3/5 V |
| 认证状态 | - | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | - | - | 1.45 mm | 1.1 mm | 1.1 mm | 1.75 mm | 1.75 mm |
| 串行总线类型 | - | - | - | - | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | - | - | - | - | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
| 最大压摆率 | - | - | - | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 最大供电电压 (Vsup) | - | - | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | - | - | - | 1.7 V | 1.7 V | 2.5 V | 1.7 V | 2.5 V |
| 标称供电电压 (Vsup) | - | - | - | - | 2.5 V | 2.5 V | 5 V | 2.5 V | 5 V |
| 表面贴装 | - | - | - | - | YES | YES | YES | YES | YES |
| 技术 | - | - | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | - | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | - | - | - | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | - | - | - | 0.95 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | - | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | - | - | - | 40 | 40 | 40 | 40 | 40 |
| 宽度 | - | - | - | - | 1.55 mm | 3 mm | 3 mm | 3.9 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | - | - | - | - | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | - | - | - | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| Base Number Matches | - | - | - | - | 1 | 1 | 1 | 1 | 1 |
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