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CY7C1355C-100BGCT

产品描述SRAM 256Kx36 3.3V NoBL Sync FT SRAM COM
产品类别存储   
文件大小474KB,共28页
制造商Cypress(赛普拉斯)
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CY7C1355C-100BGCT概述

SRAM 256Kx36 3.3V NoBL Sync FT SRAM COM

CY7C1355C-100BGCT规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
Cypress(赛普拉斯)
产品种类
Product Category
SRAM
RoHSDetails
Memory Size9 Mbit
Organization256 k x 36
Access Time7.5 ns
Maximum Clock Frequency100 MHz
接口类型
Interface Type
Parallel
电源电压-最大
Supply Voltage - Max
3.6 V
电源电压-最小
Supply Voltage - Min
3.135 V
Supply Current - Max180 mA
最小工作温度
Minimum Operating Temperature
0 C
最大工作温度
Maximum Operating Temperature
+ 70 C
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
FBGA-119
系列
Packaging
Cut Tape
系列
Packaging
Reel
数据速率
Data Rate
SDR
Memory TypeSDR
类型
Type
Synchronous
Number of Ports4
Moisture SensitiveYes
工厂包装数量
Factory Pack Quantity
500

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CY7C1355C
CY7C1357C
9-Mbit (256K x 36/512K x 18)
Flow-Through SRAM with NoBL™ Architecture
Features
• No Bus Latency™ (NoBL™) architecture eliminates
dead cycles between write and read cycles
• Can support up to 133-MHz bus operations with zero
wait states
— Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate
the need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• 3.3V/2.5V I/O power supply (V
DDQ
)
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend
operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• Available in JEDEC-standard and lead-free 100-Pin
TQFP, lead-free and non lead-free 119-Ball BGA
package and 165-Ball FBGA package
• Three chip enables for simple depth expansion.
• Automatic Power-down feature available using ZZ
mode or CE deselect
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst Capability—linear or interleaved burst order
• Low standby power
Functional Description
[1]
The CY7C1355C/CY7C1357C is a 3.3V, 256K x 36/512K x 18
Synchronous Flow-through Burst SRAM designed specifically
to support unlimited true back-to-back Read/Write operations
without
the
insertion
of
wait
states.
The
CY7C1355C/CY7C1357C is equipped with the advanced No
Bus Latency (NoBL) logic required to enable consecutive
Read/Write operations with data being transferred on every
clock cycle. This feature dramatically improves the throughput
of data through the SRAM, especially in systems that require
frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two or four Byte Write
Select (BW
X
) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
Selection Guide
133 MHz
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
6.5
250
40
100 MHz
7.5
180
40
Unit
ns
mA
mA
Note:
1. For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05539 Rev. *E
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised September 14, 2006
[+] Feedback

CY7C1355C-100BGCT相似产品对比

CY7C1355C-100BGCT 1219.76OHMS0.005% CY7C1355C-133BGCT CY7C1357C-133AXCT
描述 SRAM 256Kx36 3.3V NoBL Sync FT SRAM COM Fixed Resistor, Wire Wound, 0.5W, 9.76ohm, 400V, 0.005% +/-Tol, -30,30ppm/Cel, SRAM 256Kx36 3.3V NoBL Sync FT SRAM COM SRAM 9Mb 133Mhz 512K x 18 Flow-Thru SRAM

 
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