Freescale Semiconductor
Data Sheet: Technical Data
Document Number K61P256M150SF3
Rev. 6, 09/2015
Supports the following:
MK61FX512VMJ15,
MK61FN1M0VMJ15
Key features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 150 MHz ARM® Cortex®-M4 core with
DSP instructions delivering 1.25 Dhrystone
MIPS per MHz
• Memories and memory interfaces
– Up to 1024 KB program flash memory on non-
FlexMemory devices
– Up to 512 KB program flash memory on
FlexMemory devices
– Up to 512 KB FlexNVM on FlexMemory devices
– 16 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
– DDR controller interface
– NAND flash controller interface
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– Memory protection unit with multi-master
protection
– 32-channel DMA controller, supporting up to
128 request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– Tamper detect and secure storage
– Hardware random-number generator
– Hardware encryption supporting DES, 3DES,
AES, MD5, SHA-1, and SHA-256 algorithms
– 128-bit unique identification (ID) number per
chip
• Human-machine interface
– Low-power hardware touch sensor interface
(TSI)
– General-purpose input/output
• Analog modules
– Four 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– Two 12-bit DACs
– Four analog comparators (CMP) containing a 6-
bit DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Two 8-channel motor control/general
purpose/PWM timers
– Two 2-channel quadrature decoder/general
purpose timers
– IEEE 1588 timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
K61 Sub-Family
K61P256M150SF3
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012–2015 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts........................................................................... 5
1.1 Determining valid orderable parts......................................5
2 Part identification...................................................................... 5
2.1 Description.........................................................................5
2.2 Format............................................................................... 5
2.3 Fields................................................................................. 5
2.4 Example............................................................................ 6
3 Terminology and guidelines...................................................... 6
3.1 Definitions..........................................................................6
3.2 Examples...........................................................................6
3.3 Typical-value conditions.................................................... 7
3.4 Relationship between ratings and operating
requirements......................................................................7
3.5 Guidelines for ratings and operating requirements............8
4 Ratings...................................................................................... 8
4.1 Thermal handling ratings................................................... 8
4.2 Moisture handling ratings.................................................. 9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings............................... 9
5 General..................................................................................... 10
5.1 AC electrical characteristics.............................................. 10
5.2 Nonswitching electrical specifications............................... 10
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
Voltage and current operating requirements...... 10
LVD and POR operating requirements............... 12
Voltage and current operating behaviors............13
Power mode transition operating behaviors....... 16
Power consumption operating behaviors............17
EMC radiated emissions operating behaviors.... 20
Designing with radiated emissions in mind.........21
Capacitance attributes........................................ 21
6.8.8
6.1.2
JTAG electricals..................................................26
6.2 System modules................................................................ 29
6.3 Clock modules................................................................... 29
6.3.1
6.3.2
6.3.3
MCG specifications.............................................29
Oscillator electrical specifications....................... 32
32 kHz oscillator electrical characteristics.......... 34
6.4 Memories and memory interfaces..................................... 34
6.4.1
6.4.2
6.4.3
6.4.4
6.4.5
Flash (FTFE) electrical specifications.................34
EzPort switching specifications...........................39
NFC specifications..............................................40
DDR controller specifications..............................43
Flexbus switching specifications.........................46
6.5 Security and integrity modules.......................................... 48
6.5.1
DryIce Tamper Electrical Specifications............. 48
6.6 Analog............................................................................... 49
6.6.1
6.6.2
6.6.3
6.6.4
ADC electrical specifications.............................. 49
CMP and 6-bit DAC electrical specifications...... 56
12-bit DAC electrical characteristics................... 58
Voltage reference electrical specifications..........61
6.7 Timers................................................................................62
6.8 Communication interfaces................................................. 62
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
Ethernet switching specifications........................62
USB electrical specifications...............................64
USB DCD electrical specifications......................65
USB VREG electrical specifications................... 65
ULPI timing specifications...................................66
CAN switching specifications..............................67
DSPI switching specifications (limited voltage
range)................................................................. 67
DSPI switching specifications (full voltage
range)................................................................. 68
6.8.9
6.8.10
6.8.11
6.8.12
Inter-Integrated Circuit Interface (I2C) timing..... 70
UART switching specifications............................71
SDHC specifications........................................... 71
I2S/SAI switching specifications......................... 72
5.3 Switching specifications.....................................................21
5.3.1
5.3.2
Device clock specifications................................. 21
General switching specifications.........................22
5.4 Thermal specifications.......................................................24
5.4.1
5.4.2
Thermal operating requirements.........................24
Thermal attributes...............................................24
6.9 Human-machine interfaces (HMI)......................................79
6.9.1
TSI electrical specifications................................ 79
5.5 Power sequencing............................................................. 25
6 Peripheral operating requirements and behaviors.................... 26
6.1 Core modules.................................................................... 26
6.1.1
Debug trace timing specifications....................... 26
7 Dimensions............................................................................... 80
7.1 Obtaining package dimensions......................................... 80
8 Pinout........................................................................................ 80
K61 Sub-Family, Rev.6, 09/2015.
Freescale Semiconductor, Inc.
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
freescale.com
and perform a part number search for the
following device numbers: PK61 and MK61
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
A
M
FFF
Qualification status
Kinetis family
Key attribute
Flash memory type
Program flash memory size
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K61
• F = Cortex-M4 w/ DSP and FPU
• N = Program flash only
• X = Program flash and FlexMemory
• 512 = 512 KB
• 1M0 = 1 MB
Table continues on the next page...
K61 Sub-Family, Rev.6, 09/2015.
Freescale Semiconductor, Inc.
5
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