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MBT3904DW2T1

产品描述Bipolar Transistors - BJT 200mA 60V Dual NPN
产品类别分立半导体    晶体管   
文件大小132KB,共8页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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MBT3904DW2T1概述

Bipolar Transistors - BJT 200mA 60V Dual NPN

MBT3904DW2T1规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅含铅
厂商名称ON Semiconductor(安森美)
零件包装代码SC-88
包装说明SMALL OUTLINE, R-PDSO-G6
针数6
制造商包装代码419B-02
Reach Compliance Codenot_compliant
ECCN代码EAR99
Is SamacsysN
最大集电极电流 (IC)0.2 A
集电极-发射极最大电压40 V
配置SEPARATE, 2 ELEMENTS
最小直流电流增益 (hFE)30
JESD-30 代码R-PDSO-G6
JESD-609代码e0
元件数量2
端子数量6
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)240
极性/信道类型NPN
最大功率耗散 (Abs)0.15 W
认证状态Not Qualified
表面贴装YES
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间30
晶体管应用AMPLIFIER
晶体管元件材料SILICON
标称过渡频率 (fT)300 MHz
最大关闭时间(toff)250 ns
最大开启时间(吨)70 ns
Base Number Matches1

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MBT3904DW1T1G,
MBT3904DW2T1G,
SMBT3904DW1T1G
Dual General Purpose
Transistors
The MBT3904DW1T1G and MBT3904DW2T1G devices are a
spin−off of our popular SOT−23/SOT−323 three−leaded device. It is
designed for general purpose amplifier applications and is housed in
the SOT−363 six−leaded surface mount package. By putting two
discrete devices in one package, this device is ideal for low−power
surface mount applications where board space is at a premium.
Features
http://onsemi.com
MARKING
DIAGRAM
6
6
1
SOT−363/SC−88/
SC70−6
CASE 419B
1
XX MG
G
h
FE
, 100−300
Low V
CE(sat)
,
0.4 V
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
Collector
−Base
Voltage
Emitter
−Base
Voltage
Collector Current
Continuous
Electrostatic Discharge
Symbol
V
CEO
V
CBO
V
EBO
I
C
ESD
Value
40
60
6.0
200
Unit
Vdc
Vdc
Vdc
mAdc
XX = MA for MBT3904DW1T1G
MJ for MBT3904DW2T1G
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
(3)
(2)
(1)
Q
1
Q
2
(4)
(5)
MBT3904DW1T1
STYLE 1
(3)
(2)
(6)
(1)
Q
2
Q
1
HBM Class 2
MM Class B
(4)
(5)
MBT3904DW2T1
STYLE 27
(6)
Stresses exceeding Maximum Ratings may damage the device. Maximum Rat-
ings are stress ratings only. Functional operation above the Recommended Op-
erating Conditions is not implied. Extended exposure to stresses above the Re-
commended Operating Conditions may affect device reliability.
ORDERING INFORMATION
Device
MBT3904DW1T1G
Package
SOT−363
(Pb−Free)
Shipping
3000 /
Tape & Reel
3000 /
Tape & Reel
3000 /
Tape & Reel
THERMAL CHARACTERISTICS
Characteristic
Total Package Dissipation (Note 1)
T
A
= 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage
Temperature Range
Symbol
P
D
R
qJA
T
J
, T
stg
Max
150
833
−55
to +150
Unit
mW
°C/W
°C
SMBT3904DW1T1G SOT−363
(Pb−Free)
MBT3904DW2T1G
SOT−363
(Pb−Free)
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MBT3904DW1T1/D
©
Semiconductor Components Industries, LLC, 2012
October, 2012
Rev. 9
1

MBT3904DW2T1相似产品对比

MBT3904DW2T1 MBT3904DW1T1 MBT3904DW2T1G
描述 Bipolar Transistors - BJT 200mA 60V Dual NPN Bipolar Transistors - BJT 200mA 60V Dual NPN Bipolar Transistors - BJT 200mA 60V Dual NPN
Brand Name ON Semiconductor ON Semiconductor ON Semiconductor
是否无铅 含铅 含铅 不含铅
厂商名称 ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美)
零件包装代码 SC-88 SC-88 SC-70
包装说明 SMALL OUTLINE, R-PDSO-G6 SMALL OUTLINE, R-PDSO-G6 HALOGEN FREE AND ROHS COMPLIANT, CASE 419B-02, SC-88, SC-70, 6 PIN
针数 6 6 6
制造商包装代码 419B-02 419B-02 419B-02
Reach Compliance Code not_compliant not_compliant compliant
ECCN代码 EAR99 EAR99 EAR99
最大集电极电流 (IC) 0.2 A 0.2 A 0.2 A
集电极-发射极最大电压 40 V 40 V 40 V
配置 SEPARATE, 2 ELEMENTS SEPARATE, 2 ELEMENTS SEPARATE, 2 ELEMENTS
最小直流电流增益 (hFE) 30 30 30
JESD-30 代码 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6
JESD-609代码 e0 e0 e3
元件数量 2 2 2
端子数量 6 6 6
最高工作温度 150 °C 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 240 240 260
极性/信道类型 NPN NPN NPN
认证状态 Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin (Sn)
端子形式 GULL WING GULL WING GULL WING
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 40
晶体管应用 AMPLIFIER AMPLIFIER AMPLIFIER
晶体管元件材料 SILICON SILICON SILICON
标称过渡频率 (fT) 300 MHz 300 MHz 300 MHz
最大关闭时间(toff) 250 ns 250 ns 250 ns
最大开启时间(吨) 70 ns 70 ns 70 ns
Is Samacsys N - N
最大功率耗散 (Abs) 0.15 W - 0.15 W
Base Number Matches 1 - 1
湿度敏感等级 - 1 1

 
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