CYStech Electronics Corp.
Schottky barrier diode
Spec. No. : C300N3
Issued Date : 2004.10.15
Revised Date :
Page No. : 1/3
RB491DN3
Description
Planar silicon Schottky barrier diode encapsulated in a SOT-23 plastic SMD package.
Features
•Small
surface mounting type SOT-23
•Ultra
low V
F
(V
F
=0.4V typ at 1A)
•I
F
=1A guaranteed despite the size
Applications
•Low
power rectification
•For
switching power supply
Symbol
RB491DN3
Outline
SOT-23
Cathode
2
1
3
1. Anode
2. Not Connected
3. Cathode
Anode
Not Connected
Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Peak reverse voltage
DC reverse voltage
DC forward current
Peak forward surge current *
Junction temperature
Storage temperature
* 60 Hz for 1 cycle
Symbol
V
RM
V
R
I
F
I
FSM
Tj
Tstg
Limits
25
20
1
3
125
-40~+125
Unit
V
V
A
A
˚C
˚C
RB491DN3
CYStek Product Specification
CYStech Electronics Corp.
Electrical Characteristics
(Ta=25°C)
Parameter
Forward Voltage
Reverse Current
Symbol
V
F
I
R
I
F
=1A
V
R
=20V
Condition
Min.
-
-
Spec. No. : C300N3
Issued Date : 2004.10.15
Revised Date :
Page No. : 2/3
Typ
-
-
Max.
0.45
200
Unit
V
µA
Note:ESD sensitive product handling required
RB491DN3
CYStek Product Specification
CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C300N3
Issued Date : 2004.10.15
Revised Date :
Page No. : 3/3
Marking:
A
L
3
B
1
2
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
Style:Pin.1. Anode 2. Not Connected
3.Cathode
D
K
S
10T
TE
V
G
C
H
J
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
Millimeters
Min.
Max.
0.085
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy ; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
RB491DN3
CYStek Product Specification
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