CM1411
2 Channel Headset/Speaker EMI Filter with ESD Protection
Features
•
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•
•
•
•
•
•
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Functionally and pin compatible with CMD’s
CSPEMI201A
OptiGuard
™
coated for improved reliability at
assembly
Two channels of EMI filtering
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
Greater than 40dB attenuation at 1GHz
+
8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+
15kV ESD protection in each channel (HBM)
Supports AC signals—ideal for audio applications
Extremely low lead inductance for optimum filter
and ESD performance
5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
Lead-free version available
Product Description
The CM1411 is a dual low-pass filter array integrating
two pi-style filters (C-R-C) that reduce EMI/RFI emis-
sions while at the same time providing ESD protection.
This part is custom-designed to interface with a
speaker port on a cellular telephone or similar device.
Each high quality filter provides more than 35dB atten-
uation in the 800-2700 MHz range. These pi-style fil-
ters support bidirectional filtering, controlling EMI both
to and from a speaker element. They also support AC
signals with a cutoff frequency of 31MHz, enabling
audio signals to pass through without distortion.
In addition, the CM1411 provides a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
CM1411 can safely dissipate ESD strikes of 8kV, the
maximum requirement of the IEC 61000-4-2 interna-
tional standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than 15kV.
The CM1411 is particularly well-suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight. The CM1411 incorporates
OptiGuard
™
coating which results in improved reliability at assem-
bly and is available in a space-saving, low-profile Chip
Scale Package with optional lead-free finishing.
Applications
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EMI filtering and ESD protection for
headset/speaker ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
Electrical Schematic
A1
10Ω
C1
100pF
SPKR_IN1
SPKR_OUT1
100pF
SPKR_IN2
A3
10Ω
C3
100pF
SPKR_OUT2
100pF
GND
B2
©
2005 California Micro Devices Corp. All rights reserved.
09/15/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
CM1411
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
BOTTOM VIEW
(Bumps Up View)
SPKR_OUT1 SPKR_OUT2
1 2 3
A
C1
C3
GND
B
C
CA
B2
Pin "A1"
Marking
SPKR_IN1
SPKR_IN2
A1
A3
A1
Notes:
1)
These drawings are not to scale.
2)
Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1411
CSP Package
PIN DESCRIPTIONS
PIN
A1
A3
B2
C1
C3
NAME
SPKR_IN1
SPKR_IN2
GND
SPKR_OUT1
SPKR_OUT2
DESCRIPTION
Speaker Input 1 (from audio circuitry)
Speaker Input 2 (from audio circuitry)
Device Ground
Speaker Output 1 (to speaker)
Speaker Output 2 (to speaker)
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Pins
5
Package
CSP
Ordering Part
Number
1
CM1411-03CS
Part Marking
CA
Lead-free Finish
2
Ordering Part
Number
1
CM1411-03CP
Part Marking
CA
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
©
2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
09/15/05
CM1411
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
RATING
-65 to +150
100
200
UNITS
°C
mW
mW
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
-40 to +85
UNITS
°C
ELECTRICAL OPERATING CHARACTERISTICS
(SEE NOTE 1)
SYMBOL
R
C
I
LEAK
V
SIG
PARAMETER
Resistance
Capacitance
Diode Leakage Current
Signal Voltage
Positive Clamp
Negative Clamp
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Cut-off frequency
Z
SOURCE
= 50Ω, Z
LOAD
= 50Ω
V
IN
=5.0V
I
LOAD
= 10mA
5
-5
±15
±8
Notes 2,3,4 and 5
+15
-19
R = 10Ω, C = 100pF
31
V
V
MHz
7
-10
CONDITIONS
MIN
9
80
TYP
10
100
MAX
11
120
1.0
15
-15
UNITS
Ω
pF
μA
V
V
kV
kV
V
ESD
Notes 2,4 and 5
V
CL
f
C
Note 1: T
A
=25
°
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
©
2005 California Micro Devices Corp. All rights reserved.
09/15/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
3
CM1411
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2)
©
2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
09/15/05
CM1411
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50μm
+20μm
60 seconds
240°C
260°C
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (°C)
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
©
2005 California Micro Devices Corp. All rights reserved.
09/15/05
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
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