CM1300
4 Channel EMI Filter Network
Features
•
•
•
•
•
•
•
•
•
Functionally and pin compatible with CSPRC032A
OptiGuard
TM
coated for improved reliability at
assembly
4 EMI filter lines per device
Filters attenuate to –30dB at 3GHz
CSP package minimizes cross-talk
9-bump 2.485mm X 0.985mm Chip Scale
Package (CSP), 0.5mm pitch
0.30mm Eutectic solder bumps
Ultra small footprint suitable for portable devices
Lead-free version available
Product Description
The CM1300 is a 4-channel low pass EMI filter (R-C-R
configuration) manufactured in a Chip Scale Package
(CSP). Many portable applications require the attenua-
tion of signals in the 800-3000 MHz band. California
Micro Devices’ unique thin film technology provides a
minimum of –25dB of attenuation over this frequency
band.
The bump size and pitch of these filters are selected
such that the device can be placed directly on an FR4
printed circuit board using conventional assembly tech-
niques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal PCB signal rout-
ing. The solder bump contacts are a 63/37 Sn/Pb alloy
(Sn/Ag/Cu for lead-free finish) and are 0.30 mm in
diameter.
The CM1300 incorporates
OptiGuard
TM
coating which
results in improved reliability at assembly. The device
is available in a space-saving, low-profile Chip Scale
Package with optional lead-free finishing.
Applications
•
•
•
•
•
•
EMI filtering for RF sections of wireless devices
Cellular phones
Cordless phones
Internet appliances
PDAs
Laptop computers
Electrical Schematic
A1
50Ω
R
50Ω
C R
43pF
GND
50Ω
C R
43pF
GND
B1
A2
50Ω
R
B2
B3
A4
50Ω
R
GND
50Ω
C R
43pF
B4
A5
50Ω
R
GND
50Ω
C R
43pF
B5
GND
© 2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CM1300
PACKAGE / PINOUT DIAGRAMS
(Bumps Down View)
TOP VIEW
(Bumps Up View)
BOTTOM VIEW
Orientation
Marking
A
B
A5
A4
B4
B3
A2
B2
A1
B1
M003
CM1300
B5
Notes:
CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Bumps
9
Package
CSP
Ordering Part
Number
1
CM1300-03CS
Part Marking
M003
Lead-free Finish
2
Ordering Part
Number
1
CM1300-03CP
Part Marking
M003
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
Power Rating per Resistor
RATING
-55 to +150
25
UNITS
°C
mW
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
-40 to +85
UNITS
°C
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
A
11/07/05
Orientation
Marking
(see note 2)
1
2
3
4
5
CM1300
ELECTRICAL OPERATING CHARACTERISTICS
1
SYMBOL
I
LEAK
R
C
TOL
R
TOL
C
TCR
TCC
F
C
PARAMETER
Leakage Current, An or Bn to GND
Resistance
Capacitance
Resistor Absolute Tolerance
Capacitor Absolute Tolerance
Temperature Coefficient of
Resistance
Temperature Coefficient of
Capacitance
Filter Cutoff Frequency
Z
SOURCE
=0
Ω
, Z
LOAD
=
∞
Z
SOURCE
=50
Ω
, Z
LOAD
=50
Ω
R = 50
Ω
C=43pF
Note 2
Note 2
R=50
Ω
, C=43pF;
CONDITIONS
V
IN
=6.0V
45
34
50
43
MIN
TYP
MAX
1
55
52
+10
+20
+150
+500
UNITS
µA
Ω
pF
%
%
ppm/°C
ppm/°C
74
82
MHz
MHz
Note 1: Electrical Operating Characteristics are guaranteed over the Operating Temperature Range unless otherwise specified.
Note 2: Parameters guaranteed by design or characterization.
Filter Performance
CM1300 Filter Typical Measured Frequency Response (S21) Measurement
The measurement is done with 50Ω-source and 50Ω-load impedance using a HP8753C Network Analyzer with a
HP85047A S-parameter Test Set.
© 2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CM1300
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (°C)
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
●
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
11/07/05
CM1300
Mechanical Details
CSP Mechanical Specifications
The CM1300 is offered in a custom Chip Scale Pack-
age (CSP). Dimensions are presented below. For com-
plete information on CMD’s Chip Scale Packaging, see
the California Micro Devices CSP Package Information
document.
.
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
5
4
3
A2
B2
OptiGuard
TM
Coating
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
C1
C2
D1
D2
Millimeters
Min
0.940
2.440
0.495
0.495
Nom
0.985
2.485
0.500
0.500
Max
1.030
2.530
0.505
0.505
Min
Custom CSP
9
Inches
Nom
Max
0.0370 0.0388 0.0406
0.0961 0.0978 0.0996
0.0195 0.0197 0.0199
0.0195 0.0197 0.0199
2
1
B
A
C2
B
A
D1
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
SIDE
VIEW
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
0.575
0.368
0.644
0.419
0.714
0.470
0.0226 0.0254 0.0281
0.0145 0.0165 0.0185
3500 pieces
Controlling dimension: millimeters
Package Dimensions for
CM1300 9-bump Chip Scale Package
# per tape
and reel
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B
0
X A
0
X K
0
2.62 X 1.12 X 0.762
P
o
Top
Cover
Tape
PART NUMBER
CM1300
PKG. SIZE (mm)
2.485 X 0.985 X 0.644
TAPE WIDTH
W
8mm
REEL
DIA.
178mm (7")
QTY
PER
REEL
3500
P
0
4mm
P
1
4mm
10 Pitches Cumulative
Tolerance On Tape
±
0.2 mm
A
o
W
B
o
K
o
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P
1
User Direction of Feed
Center Lines
of Cavity
Figure 4. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
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