CYStech Electronics Corp.
Low Vcesat NPN Epitaxial Planar Transistor
Spec. No. : C848M3-A
Issued Date : 2002.08.18
Revised Date : 2005.10.04
Page No. : 1/5
BTD2150AM3
Features
•
Low V
CE
(sat), V
CE
(sat)=0.1 V (typical), at I
C
/ I
B
= 1A / 50mA
•
Excellent current gain characteristics
•
Complementary to BTB1424AM3
•
Pb-free package
Symbol
BTD2150AM3
Outline
SOT-89
B：Base
C：Collector
E：Emitter
B C E
Absolute Maximum Ratings
(Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
V
CBO
V
CEO
V
EBO
I
C
Pd
Tj
Tstg
Limits
80
50
6
3
0.6
1
2
150
-55~+150
Unit
V
V
V
A
*1
*2
W
°C
°C
Note : *1 Printed circuit board, 1.7mm thick, collector copper plating 10mm*10mm.
*2 When mounted on a 40*40*0.7mm ceramic board.
BTD2150AM3
CYStek Product Specification
CYStech Electronics Corp.
Characteristics
(Ta=25°C)
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
I
EBO
*V
CE(sat)
*V
CE(sat)
*V
BE(sat)
*h
FE
1
*h
FE
2
*h
FE
3
f
T
Cob
Min.
80
50
6
-
-
-
-
-
120
120
100
-
-
Typ.
-
-
-
-
-
0.1
0.25
-
-
-
-
90
45
Max.
-
-
-
0.1
0.1
0.25
0.5
2
-
820
-
-
-
Unit
V
V
V
µA
µA
V
V
V
-
-
-
MHz
pF
Spec. No. : C848M3-A
Issued Date : 2002.08.18
Revised Date : 2005.10.04
Page No. : 2/5
Test Conditions
I
C
=50µA, I
E
=0
I
C
=1mA, I
B
=0
I
E
=50µA, I
C
=0
V
CB
=60V, I
E
=0
V
EB
=5V, I
C
=0
I
C
=1A, I
B
=50mA
I
C
=2A, I
B
=0.2A
I
C
=2A, I
B
=0.2A
V
CE
=2V, I
C
=0.1A
V
CE
=2V, I
C
=0.5A
V
CE
=2V, I
C
=1A
V
CE
=5V, I
C
=0.1A, f =100MHz
V
CB
=10V, f=1MHz
*Pulse Test : Pulse Width
≤380µs,
Duty Cycle≤2%
Classification Of h
FE
2
Rank
Range
Q
120~270
R
180~390
S
270~560
T
390~820
Ordering Information
Device
BTD2210AM3
Package
SOT-89
(Pb-free)
Shipping
1000 pcs / Tape & Reel
Marking
CF
Characteristic Curves
Grounded Emitter Output Characteristics
140
Collector Current---IC(mA)
Grounded Emitter Output Characteristics
700
2.5mA
2mA
1.5mA
1mA
500uA
IB=0uA
100
80
60
40
20
0
0
1
2
3
4
400uA
300uA
200uA
100uA
IB=0uA
Collector Current---IC(mA)
120
500uA
600
500
400
300
200
100
0
5
6
0
1
2
3
4
5
6
Collector To Emitter Voltage---VCE(V)
Collector To Emitter Voltage---VCE(V)
BTD2150AM3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves(Cont.)
Grounded Emitter Output Characteristics
2500
Collector Current---IC(mA)
Spec. No. : C848M3-A
Issued Date : 2002.08.18
Revised Date : 2005.10.04
Page No. : 3/5
Grounded Emitter Output Characteristics
3500
10mA
8mA
25mA
20mA
15mA
10mA
2000
1500
1000
500
0
0
1
2
3
4
5
Collector To Emitter Voltage---VCE(V)
Collector Current---IC(mA)
3000
2500
2000
1500
1000
500
0
6mA
4mA
2mA
IB=0mA
5mA
IB=0mA
6
0
1
2
3
4
5
6
Collector To Emitter Voltage---VCE(V)
Current gain vs Collector current
1000
Saturation voltage---(mV)
Saturation voltage vs Collector current
1000
VCE(sat)
Current gain---HFE
VCE=5V
100
IC=40IB
100
VCE=2V
VCE=1V
10
IC=10IB
IC=20IB
10
1
10
100
1000
10000
Collector current---IC(mA)
1
1
10
100
1000
10000
Collector current---IC(mA)
Saturation votlage vs Collector current
10000
Saturation voltage---(mV)
VBE(sat)@IC=10IB
Power Derating Curves
2.5
Power Dissipation---PD(W)
2
1.5
1
0.5
0
See Note 2 on Page 1
See Note 1 on Page 1
1000
100
1
10
100
1000
10000
Collector current---IC(mA)
0
50
100
150
200
Ambient Temperature---TA(℃)
BTD2150AM3
CYStek Product Specification
CYStech Electronics Corp.
Reel Dimension
Spec. No. : C848M3-A
Issued Date : 2002.08.18
Revised Date : 2005.10.04
Page No. : 4/5
Carrier Tape Dimension
BTD2150AM3
CYStek Product Specification
CYStech Electronics Corp.
SOT-89 Dimension
A
Spec. No. : C848M3-A
Issued Date : 2002.08.18
Revised Date : 2005.10.04
Page No. : 5/5
Marking:
1
2
C
3
H
CF*
B
D
Style: Pin 1. Base 2. Collector 3. Emitter
E
F
G
I
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
*: Typical
DIM
A
B
C
D
E
Inches
Min.
Max.
0.1732 0.1811
0.1594 0.1673
0.0591 0.0663
0.0945 0.1024
0.01417 0.0201
Millimeters
Min.
Max.
4.40
4.60
4.05
4.25
1.50
1.70
2.40
2.60
0.36
0.51
DIM
F
G
H
I
Inches
Min.
Max.
0.0583 0.0598
0.1165 0.1197
0.0551 0.0630
0.0138 0.0161
Millimeters
Min.
Max.
1.48
1.527
2.96
3.04
1.40
1.60
0.35
0.41
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy ; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD2150AM3
CYStek Product Specification
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