Surface Mount Chip LEDs
Technical Data
HSMF-C155/C156/C157
Features
•
•
•
•
•
Small Size
Industry Standard Footprint
Compatible with IR Solder
Diffused Optics
Operating Temperature
Range of –30
°
C to +85
°
C
• Three Color Combinations
Available: Red/Green,
Yellow/Green, and
Orange/Green.
• Available in 8 mm Tape on
7 in. (178 mm) Diameter
Reels
Description
The HSMF-C15x series of bicolor
chip-type LEDs is designed in
an industry standard package for
ease of handling and use. These
bicolor LEDs are available as
high efficiency red/green, yellow/
green and orange/green. The
HSMF-C15x has the widely used
3.2 x 2.7 mm footprint and wide
viewing angle make this LED
exceptional for backlighting
applications.
All packages are compatible with
IR reflow solder processes. The
small size and wide viewing angle
make these LEDs prime choices
for backlighting applications and
front panel indicators especially
where space is a premium.
Applications
•
•
•
•
Push-Button Backlighting
Symbol Backlighting
Status Indicator
Front Panel Indicator
Device Selection Guide
Part Number
HSMF-C155
HSMF-C156
HSMF-C157
Color Combinations
High Efficiency Red/Green
Yellow/Green
Orange/Green
Parts Per Reel
3000
3000
3000
2
Package Dimensions
LED DIE
CATHODE
MARK
1
2
1.4
(0.055)
2.7
(0.106)
3
4
3.2 (0.126 )
0.60
(0.024)
DIFFUSED
EPOXY
2.00
(0.079)
PART NUMBER
POLARITY
1.10 (0.043)
HSMF-C-155
1
2
4
GREEN
RED
HSMF-C-156
GREEN
YELLOW
HSMF-C-157
GREEN
ORANGE
PC BOARD
0.50 (0.020)
0.55
(0.022)
R 0.25
(0.010)
TYP.
0.55
(0.022)
3
POSITION OF COLOR SOURCE ON DEVICE
SOLDERING
TERMINAL
1.10 (0.043)
0.40
(0.016)
4 – 0.05 (0.002) MAX.
CATHODE LINE
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMF-C155/C156/C157
3
Absolute Maximum Ratings at T
A
=25
°
C
Parameter
DC Forward Current
[1]
Peak Pulsing Current
[2]
Power Dissipation
Reverse Voltage (I
R
= 100
µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
HSMF-C155/C156/C157
25
100
65
5
95
–30 to +85
–40 to +85
Units
mA
mA
mW
V
°C
°C
°C
See IR soldering profile (Figure 6)
Optical Characteristics at T
A
=25
°
C
Color
HER
Orange
Yellow
Green
Luminous
Intensity
[1]
Iv(mcd) @ 20mA
Min.
Typ.
2.50
10.0
2.50
8.0
2.50
8.0
4.00
15.0
Peak
Wavelength
peak
(nm)
Typ.
630
605
589
570
Dominant
Wavelength
d
(nm)
Typ.
626
604
586
572
Viewing Angle
2
1/2
Degrees
[2]
Typ.
170
170
170
170
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical
axis of the lamp package.
2.
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at T
A
=25
°
C
Color
HER
Orange
Yellow
Green
Forward Voltage
V
F
(V)
@ I
F
= 20 mA
Typ.
Max.
2.1
2.6
2.2
2.6
2.1
2.6
2.2
2.6
Reverse
Capacitance
Breakdown V
R
(V)
C(pF)
@ I
R
= 100
µ
A
@ V
F
= 0, f = 1Mhz
Min.
Typ.
5
5
5
7
5
6
5
9
Thermal
Resistance
R
J-P
(
°
C/W)
Typ.
325
325
325
325
Note:
The bicolor package contains two individual light sources of different color. The specifications above refer to each color of a
particular package.
4
Color Bin Limits
Green Color Bins
[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
B
C
D
E
561.5
564.5
567.5
570.5
573.5
564.5
567.5
570.5
573.5
576.5
Orange Color Bins
[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
B
C
D
E
F
597.0
600.0
603.0
606.0
609.0
612.0
600.0
603.0
606.0
609.0
612.0
615.0
Yellow/Amber Color Bins
[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
B
C
D
H
J
582.0
584.5
587.0
589.5
592.0
594.5
584.5
587.0
589.5
592.0
594.5
597.0
Tolerance:
±
0.5 nm
Tolerance:
±
1 nm
Tolerance:
±
0.5 nm
Light Intensity (Iv) Bin Limits
[1]
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
Intensity (mcd)
Min.
Max.
0.11
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
Bin ID
N
P
Q
R
S
T
U
V
W
X
Y
Intensity (mcd)
Min.
Max.
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
Note:
1. Bin categories are established for
classification of products. Products
may not be available in all categories.
Please contact your Agilent representa-
tive for information on currently
available bins.
Tolerance:
±
15%
1.0
GREEN
RELATIVE INTENSITY
YELLOW
0.5
ORANGE
HER
0
500
550
600
650
700
750
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Wavelength.
5
100
I
F
– FORWARD CURRENT – mA
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
HER
10
GREEN
1.2
0.8
1
YELLOW
0.1
ORANGE
1.5
1.7
1.9
2.1
2.3
0.4
0
0
10
20
30
40
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
Figure 2. Forward Current vs.
Forward Voltage.
Figure 3. Luminous Intensity vs. Forward
Current (All Colors).
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
35
RELATIVE INTENSITY – %
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
30
25
20
15
10
5
0
0
20
40
60
80
100
Rθ
J-A
= 600°C/W
Rθ
J-A
= 800°C/W
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
T
A
– AMBIENT TEMPERATURE – °C
ANGLE
Figure 4. Maximum Forward Current
vs. Ambient Temperature.
Figure 5. Relative Intensity vs. Angle for
HSMx-C155, C156 and C157.
10 to 20 SEC.
217 °C
TEMPERATURE
255 °C (+5/-0)
3 °C/SEC. MAX.
1.0 (0.039)
6 °C/SEC. MAX.
140 - 160 °C
0.4 (0.016)
MAX. 120 SEC.
60 to 150 SEC.
1.0 (0.039)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Note:
1. All dimensions in millimeters (inches).
Figure 6. Recommended Pb Free Reflow Soldering Profile.
Figure 7. Recommended Solder Pad Pattern.
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