REVISIONS
LTR
A
B
DESCRIPTION
Changes in accordance with N.O.R. 5962-R145-93.
Changes in accordance with N.O.R. 5962-R234-93.
Add case outline X, which is a 10-lead flat pack. Make changes to 1.3, 3.2.1,
3.2.2, and figure 1. Also, make changes to CMRR, +VO, -VO, GFPL, GFPH,
GFR, SSBW, HD2, HD3, and VN tests as specified in table I herein.
Redrawn. - ro
Make change to input offset current test as specified under table I.
Delete figure 1. - ro
Add radiation hardened requirements. - ro
Make correction to input referred noise voltage test unit as specified in
table I. - ro
Drawing updated to reflect current requirements. - ro
DATE (YR-MO-DA)
93-05-25
93-10-15
APPROVED
M. A. FRYE
M. A. FRYE
C
99-02-10
R. MONNIN
D
E
F
G
00-04-14
00-06-30
01-06-14
05-08-11
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
RICK OFFICER
G
1
G
2
G
3
G
4
G
5
G
6
G
7
G
8
G
9
G
10
G
11
G
12
G
13
G
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES E. BESORE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
DRAWING APPROVAL DATE
92-08-06
MICROCIRCUIT, LINEAR, HIGH SPEED,
VOLTAGE FEEDBACK OPERATIONAL
AMPLIFIER, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
G
SIZE
A
SHEET
CAGE CODE
67268
1 OF
14
5962-91758
DSCC FORM 2233
APR 97
5962-E650-05
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
F
91758
01
M
P
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
CLC420A
CLC420B
Circuit function
High speed, voltage feedback operational amplifier
High speed, voltage feedback operational amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
P
X
2
Descriptive designator
GDIP1-T8 or CDIP2-T8
GDFP1-G10
CQCC1-N20
Terminals
8
10
20
Package style
Dual-in-line
Flat pack with gull wing leads
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-91758
SHEET
G
2
1.3 Absolute maximum ratings. 1/
Supply voltage (V±) ..................................................................................
±7
V dc
Output current (I
OUT
) ............................................................................... 70 mA
Common mode input voltage (V
CM
) ......................................................... V±
Differential input voltage ........................................................................... 10 V
Power dissipation (P
D
) ............................................................................. 112 mW
Junction temperature (T
J
) ........................................................................
Storage temperature range ......................................................................
Lead temperature (soldering, 10 seconds) ...............................................
Thermal resistance, junction-to-case (θ
JC
):
Case P...................................................................................................
Case X ..................................................................................................
Case 2 ..................................................................................................
Thermal resistance, junction-to-ambient (θ
JA
):
Case P ..................................................................................................
+175°C
-65°C to +150°C
+300°C
23°C/W
24°C/W
25°C/W
125°C/W still air
72°C/W at 500 linear feet per minute (LFPM)
Case X .................................................................................................. 205°C/W still air
125°C/W at 500 linear feet per minute (LFPM)
Case 2 .................................................................................................. 100°C/W still air
68°C/W at 500 linear feet per minute (LFPM)
1.4 Recommended operating conditions.
Supply voltage (V±) ..................................................................................
±5
V dc
Gain range (A
V
) .......................................................................................
±1
to
±10
Ambient operating temperature (T
A
) ........................................................ -55°C to +125°C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 to 300 rads (Si)/s) ........... 300 Krads (Si) 2/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
_____
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-91758
SHEET
G
3
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-91758
SHEET
G
4
TABLE I. Electrical performance characteristics.
Conditions 1/ 2/ 3/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Limits 4/
Min
Max
Unit
Open loop characteristics
Input bias current
(noninverting)
+I
IN
1,2
3
M,D,P,L,R,F
Input bias current
(inverting)
-I
IN
1
1,2
3
M,D,P,L,R,F
Input offset voltage
V
IO
1
1
2
3
M,D,P,L,R,F
1
1
2
3
M,D,P,L,R,F
Average +input bias current
drift
T
C
(+I
IN
)
Average -input bias current
drift
T
C
(-I
IN
)
Average input offset
voltage drift
T
C
(V
IO
)
Input offset current
I
IO
1
2
3
M,D,P,L,R,F
See footnotes at end of table.
1
5/ 6/
5/ 6/
5/ 6/
1
2
3
2
3
2,3
01
02
All
All
All
02
01
All
All
-10
-20
-10
-10
-20
-10
-2.0
-3.5
-3.2
-2.0
-0.8
-1.8
-1.6
-0.8
+10
+20
+10
+10
+20
+10
+2.0
+3.5
+3.2
+2.0
+0.8
+1.8
+1.6
+0.8
60
120
60
120
15
10
1.0
2.0
3.0
1.0
µA
µV/°C
nA/°C
nA/°C
mV
µA
µA
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-91758
SHEET
G
5
TI技术论坛
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
