REVISIONS
LTR
A
B
C
DESCRIPTION
Added tests to table I. Updated document to current MIL-H-38534
requirements. Editorial changes throughout.
Changes made in accordance with NOR 5962-R242-97.
Added vendor cage 1HBD3. Removed vendor cage 62839. Made
corrections to table I. Editorial changes throughout. -sld
DATE (YR-MO-DA)
92-01-22
97-03-13
00-06-07
APPROVED
A. Barone
Kendall A. Cottongim
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Gary Zahn
CHECKED BY
Robert M. Heber
APPROVED BY
William K. Heckman
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
10
C
11
C
12
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
MICROCIRCUIT, HYBRID, LINEAR, HIGH
SPEED, WIDEBAND, OPERATIONAL
AMPLIFIER
DRAWING APPROVAL DATE
90-07-26
REVISION LEVEL
C
SIZE
A
SHEET
CAGE CODE
67268
1 OF
12
5962-89594
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E332-00
1. SCOPE
1.1 Scope. This drawing documents one product assurance class, class H (high reliability) and a choice of case outlines and
lead finishes are available and are reflected in the Part or Identifying Number (PIN).
1.2 PIN. The PIN shall be as shown in the following example:
5962
-
89594
Drawing number
01
Device
type
(see 1.2.1)
X
Case
outline
(see 1.2.2)
X
Lead
finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number 1/
CLC231A, KH231A
Circuit function
High speed, wideband, operational amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
See figure 1
Terminals
12
Package style
Can package
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 2/
Supply voltage (±V
CC
) ................................................................
Output current.............................................................................
Storage temperature range ........................................................
Lead temperature (soldering, 10 seconds) ................................
Junction temperature (T
J
) ..........................................................
Power dissipation (P
D
)................................................................
Thermal resistance, case-to-ambient (θ
CA
)................................
Thermal resistance, junction-to-case:
θ
JC
...............................................................................................
θ
JC
...............................................................................................
±20
V dc
±100
mA
-65°C to +150°C
+300°C
+175°C
3/
65°C/W 4/
48°C/W 5/
100°C/W 6/
1/
2/
3/
4/
5/
6/
The CLC231A is not available from an approved source of supply.
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
The power dissipation can be determined based on the application and junction temperature verified to T
J
≤
+175°C and
using the thermal resistance values given.
Still air, no heat sink.
Thermal resistance of circuit; P
CIRCUIT
= 2(V
CC
) I
CC
.
Thermal resistance of output transistors; P
OUTPUT
= V
CE
(I
E
) x (% duty cycle).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
C
5962-89594
SHEET
2
DSCC FORM 2234
APR 97
1.4 Recommended operating conditions.
Supply voltage range......................................................................
Gain range......................................................................................
Ambient operating temperature range (T
A
) ...................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-
38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device
manufacturer's Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and
inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturer
may take exceptions or use alternate methods to the tests and inspections herein and not perform them. However, the
performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
±5
V dc to
±15
V dc
±1
to
±5
-55°C to +125°C
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
C
5962-89594
SHEET
3
DSCC FORM 2234
APR 97
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are defined in table I.
3.5 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for
each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if
any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made
available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing.
The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the
performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified
in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or
function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
C
5962-89594
SHEET
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C
≤
T
A
≤+125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Max
Unit
Small signal bandwidth
(-3 dB bandwidth)
SSBW
4, 6
5
01
145
120
MHz
Gain flatness peaking low
GFPL
f = 100 KHz to 50 MHz
4
5, 6
01
0.3
0.6
dB
Gain flatness peaking high
GFPH
f
>
50 MHz
4
5
6
01
0.3
0.6
1.5
dB
Gain flatness rolloff
GFR
f = 100 MHz
4, 6
5
01
0.6
1.0
dB
Linear phase deviation 2/
LPD
f
<
100 MHz
5 V step
4, 5, 6
01
2
degree
Overshoot 2/
OS
4
5, 6
01
10
15
%
Slew rate
2/
(overdriven input)
SR
10 V step
4, 6
5
01
2.5
1.8
V/ns
Noninverting input 2/
capacitance
C
IN
4, 5, 6
01
2.5
pF
Noninverting input
resistance
2/
R
IN
f = 100 MHz
4
5
6
01
200
400
100
kΩ
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
C
5962-89594
SHEET
5
DSCC FORM 2234
APR 97
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
