lower on-resistance. It uses optically coupled relay
technology to provide an enhanced 3750V
rms
isolation barrier between the input and the output of
the relay.
The efficient MOSFET switches use the patented
OptoMOS architecture. A highly efficient GaAlAs
infrared LED controls the optically coupled output.
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
•
Tape & Reel, Surface Mount Version Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
LCB126
LCB126S
LCB126STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics
of Normally Closed Devices
Form-B
I
F
I
LOAD
10%
90%
Pb
DS-LCB126-R06
e
3
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t
off
t
on
1
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C
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IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LCB126
Ratings
250
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
AC/DC Configuration, Continuous
DC Configuration, Continuous
Peak
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
-
-
t=10ms
I
L
=170mA
I
L
=300mA
V
L
=250V
P
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=170mA
-
I
F
=5mA
V
R
=5V
-
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
10
4
-
-
-
50
-
0.7
1.2
-
3
170
300
±400
15
5
1
5
5
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
A
ms
pF
mA
mA
V
A
pF
2
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PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
35
30
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
LCB126
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
30
25
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=170mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=170mA
DC
)
20
15
10
5
0
0.30
0.42
0.54
0.66
0.78
0.90
1.02
Turn-On Time (ms)
0.625 0.875 1.125 1.375 1.625 1.875 2.125
Turn-Off Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=170mA
DC
)
40
35
Typical I
F
for Switch Dropout
(N=50, I
L
=170mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
L
=170mA
DC
)
Device Count (N)
Device Count (N)
30
25
20
15
10
5
0
0.45
0.63
0.81
0.99
1.17
1.35
1.53
0.45
0.63
0.81
0.99
1.17
1.35
1.53
10.4
10.8
11.2
11.6
12.0
12.4
LED Current (mA)
LED Current (mA)
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
291.25 293.75 296.25 298.75 301.25 303.75
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
0.634
0.632
0.630
0.628
0.626
0.624
0.622
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=170mA
DC
)
1.2
Turn-Off Time (ms)
1.0
0.8
0.6
0.4
0.2
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=170mA
DC
)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R06
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NTEGRATED
C
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D
IVISION
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
Typical On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=170mA
DC
)
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=170mA
DC
)
LCB126
60
On-Resistance ( )
50
40
30
20
10
0
-40
-20
1.2
Turn-On Time (ms)
1.0
0.8
0.6
0.4
0.2
0
2.5
Turn-Off Time (ms)
2.0
1.5
1.0
0.5
0
Typical Turn-Off Time
vs. Temperature
(I
L
=170mA
DC
)
I
F
=5mA
I
F
=10mA
I
F
=20mA
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
3.0
2.5
LED Current (mA)
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=170mA
DC
)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=170mA
DC
)
Load Current (mA)
200
150
100
50
0
-50
-100
-150
Typical Load Current
vs. Load Voltage
(I
F
=5mA)
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
-40
-20
0
20
40
60
80
100
-200
-2.0 -1.5 -1.0 -0.5
0
0.5
1.0
1.5
2.0
Temperature (ºC)
Load Voltage (V)
250
Load Current (mA)
200
150
100
50
0
-40
-20
Maximum Load Current
vs. Temperature
(I
F
=5mA)
Blocking Voltage (V
P
)
Typical Blocking Voltage
vs. Temperature
310
305
Leakage ( A)
300
295
290
285
0.030
0.025
0.020
0.015
0.010
0.005
-40
-20
0
20
40
60
80
100
0
-40
Typical Leakage vs. Temperature
Measured across Pins 4&6
0
20
40
60
80
100
120
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
1s
10s
100s
4
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IVISION
Manufacturing Information
Moisture Sensitivity
LCB126
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LCB126 / LCB126S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LCB126 / LCB126S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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