state relay that has two independently controlled,
optically coupled MOSFET switches in an 8-pin SOIC
package that employs optically coupled MOSFET
technology to provide 3750V
rms
of input to output
isolation.
Its optically coupled outputs, which use patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Dual single-pole OptoMOS relays provide a more
compact design solution than discrete single-pole
relays in a variety of applications by incorporating
both relays in a single 8-pin package.
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements
(TTL/CMOS Compatible)
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 8-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount, Tape & Reel Version Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
LBB110
LBB110P
LBB110PTR
LBB110S
LBB110STR
Description
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1000/Reel)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1000/Reel)
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
2
3
4
8
7
6
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Closed Devices
Form-B
I
F
I
LOAD
90%
10%
t
off
t
on
Pb
DS-LBB110-R08
e
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LBB110
Ratings
350
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW /
ºC
Derate linearly 6.67 mW /
ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
L
=120mA
V
L
=350V
P
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
25
-
-
-
25
-
0.7
1.2
-
3
120
±350
35
1
3
3
-
5
-
1.4
10
-
mA
rms
/ mA
DC
A
P
A
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=120mA
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
A
pF
If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value.
Measurement taken within 1 second of on-time.
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
35
30
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
LBB110
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=120mA
DC
)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=120mA
DC
)
0.09
0.27
0.45
0.63
0.81
0.99
Device Count (N)
0.27
0.45
0.63
0.81
0.99
1.17
1.35
Turn-On Time (ms)
Turn-Off Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=120mA
DC
)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=120mA
DC
)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
L
=120mA
DC
)
Device Count (N)
Device Count (N)
0.33
0.55
0.77
0.99
1.21
1.43
1.65
0.11
0.33
0.55
0.77
0.99
1.21
1.43
Device Count (N)
25.5
26.5
27.5
28.5
29.5 30.5
31.5
LED Current (mA)
LED Current (mA)
On-Resistance ( )
25
20
15
10
5
0
Typical Blocking Voltage Distribution
(N=50, I
F
=5mA)
Device Count (N)
357.5
372.5
387.5
402.5
417.5
432.5
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
0.30
0.25
0.20
0.15
0.10
0.05
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=120mA
DC
)
0.7
0.6
Turn-Off Time (ms)
0.5
0.4
0.3
0.2
0.1
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=120mA
DC
)
I
F
=50mA
I
F
=10mA
I
F
=5mA
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R08
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=120mA
DC
)
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=120mA
DC
)
On-Resistance ( )
LBB110
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
-40
0.6
Turn-On Time (ms)
0.5
0.4
0.3
0.2
0.1
0
50
45
40
35
30
25
20
15
10
5
0
Typical On-Resistance vs. Temperature
(I
L
=120mA
DC
)
Dual Pole
Single Pole
Instantaneous
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=120mA
DC
)
Turn-Off Time (ms)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0
Typical Turn-Off Time
vs. Temperature
(I
L
=120mA
DC
)
Load Current (mA)
40
60
80
100
I
F
=5mA
I
F
=10mA
Typical Load Current vs. Load Voltage
150
100
50
0
-50
-100
-20
0
20
40
60
80
100
-40
-20
0
20
-150
-4
-3
-2
-1
0
1
2
3
4
Load Voltage (V)
Temperature (ºC)
Temperature (ºC)
Maximum Load Current
vs. Temperature
180
160
Blocking Voltage (V
P
)
Load Current (mA)
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
410
405
Typical Blocking Voltage
vs. Temperature
(I
F
=5mA)
Typical Leakage vs. Temperature
(Measured across Pins 5&6 or 7&8)
0.045
0.040
0.035
Leakage ( A)
0.030
0.025
0.020
0.015
0.010
0.005
0
-40
400
395
390
385
380
-40
-20
0
20
40
60
80
100
Temperature (ºC)
-20
0
20
40
60
80
100
Temperature (ºC)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10 s 100 s 1ms 10ms 100ms
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Load Current (A)
1s
10s
100s
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Manufacturing Information
Moisture Sensitivity
LBB110
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LBB110 / LBB110S / LBB110P
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LBB110 / LBB110S
LBB110P
Maximum Temperature x Time
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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