Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
3
Conditions
Symbol
Min
Typ
Max
Units
I
F
=2mA
I
F
=2mA , t=10ms
I
F
=2mA, I
L
= 100mA
I
F
=5mA, I
L
=1mA
I
F
=0mA, V
L
=800V
P
I
F
=5mA, V
L
=10V
I
F
=0mA, V
L
=50V, f=1MHz
I
L
=100mA
-
I
F
=5mA
V
R
=5V
-
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
-
0.1
0.9
-
-
-
-
40
70
-
0.42
0.15
11
0.39
-
1.2
-
3
100
±350
50
85
1
5
5
-
2
-
1.4
10
-
mA
rms
/ mA
DC
mA
P
µA
ms
pF
mA
mA
V
µA
pF
Load derates linearly from 100mA @ 25
o
C to 55mA @85
o
C.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60
o
C) a LED drive current of 5mA is recommended.
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
35
30
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.230
1.235 1.240 1.245 1.250
LED Forward Voltage (V)
1.255
PLA171
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
25
20
15
10
5
0
0.36
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA)
20
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA)
Device Count (N)
0.38
0.40 0.42 0.44 0.46
Turn-On Time (ms)
0.48
15
10
5
0
0.135 0.140 0.145 0.150 0.155 0.160 0.165
Turn-Off Time (ms)
15
Typical I
F
for Switch Operation
(N=50, I
L
=100mA)
35
30
Typical On-Resistance Distribution
(N=50, I
F
=2mA, I
L
=100mA)
Typical Blocking Voltage Distribution
(N=50)
15
Device Count (N)
Device Count (N)
10
25
20
15
10
5
Device Count (N)
40.0
40.5
41.0
41.5
42.0
On-Resistance ( )
42.5
10
5
5
0
0.33
0.35
0.37 0.39 0.41
LED Current (mA)
0.43
0.45
0
0
956
964
972 980 988 996
Blocking Voltage (V
P
)
1004
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Voltage Drop
vs. Temperature
1.6
LED Voltage Drop (V)
Turn-On Time (ms)
1.5
1.4
1.3
1.2
1.1
1.0
-40
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
I
F
=2mA
-20
0
20
40
60
Temperature (ºC)
80
100
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
20
30
LED Current (mA)
40
50
PLA171
Typical Turn-On Time
vs. LED Forward Current
(I
L
=55mA)
Turn-Off Time (ms)
0.160
0.158
0.156
0.154
0.152
0.150
0.148
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=55mA)
10
20
30
LED Current (mA)
40
50
0.55
LED Current (mA)
LED Current to Operate
vs. Temperature
(I
L
=55mA)
Turn-On Time (ms)
Typical Turn-On Time
vs. Temperature
0.9
Turn-Off Time (ms)
0.8
0.7
I
F
=2mA
0.6
0.5
0.4
I
F
=5mA
0.20
0.18
Typical Turn-Off Time
vs. Temperature
0.50
I
F
=2mA
0.16
0.14
I
F
=5mA
0.12
0.10
-40
0.45
0.40
0.35
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.3
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
70
On-Resistance ( )
60
50
40
Typical On-Resistance
vs. Temperature
(I
F
=5mA)
I
L
=30mA
Load Current (mA)
100
Typical Load Current
vs. Load Voltage
(I
F
=2mA)
Load Current (mA)
110
100
90
80
70
60
50
Maximum Load Current
vs. Temperature
(I
F
=5mA)
50
0
I
L
=55mA
30
20
-40
-50
-100
-20
0
20
40
60
Temperature (ºC)
80
100
-6
-4
-2
0
2
Voltage (V)
4
6
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Blocking Voltage
vs. Temperature
1040
Leakage Current (nA)
Blocking Voltage (V
P
)
1020
1000
980
960
940
920
900
-40
-20
0
20
40
60
Temperature (ºC)
80
100
80
70
60
50
40
30
20
10
-40
Typical Leakage Current
vs. Temperature
(V
L
=800V)
Energy Rating Curve
1.0
0.8
0.6
0.4
0.2
0.0
10 s 100 s 1ms 10ms 100ms
Time
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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Manufacturing Information
Moisture Sensitivity
PLA171
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA171P
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA171P
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
据外媒报道，萨里大学（University of Surrey）的研究人员开发出一种无需依赖GPS即可在人口密集的城市地区精确定位设备位置的人工智能系统。该系统可将定位误差从734米缩小到22米以内，这对于自动驾驶汽车和救援车辆等技术的发展意义重大。 图片来源： 萨里大学 在发表于《IEEE Robotics and Automation Letters》的论文中，研究人员介绍了PEn...[详细]
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