of input to output isolation, and features an ultra-low
on-resistance for high-current operation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Offering the superior reliability associated with
semiconductor devices, the LCA717 can be used to
replace mechanical relays. Because it has no moving
parts, it can offer faster, bounce-free switching in a
more compact surface mount or thru-hole package.
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Ordering Information
Part #
LCA717
LCA717S
LCA717STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Features
•
Very Low Maximum On-Resistance: 0.15
•
High Load Current: 2A
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements
(TTL/CMOS Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Small 6-Pin DIP Package
•
Machine Insertable, Wave Solderable
•
Surface Mount, Tape & Reel Version Available
Applications
•
Sensor Circuitry
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment: Patient/Equipment Isolation
•
Aerospace
•
Industrial Controls
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
Switching Characteristics
of Normally Open Devices
Form-A
I
F
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
I
LOAD
90%
10%
t
on
t
off
Pb
DS-LCA717-R04
e
3
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LCA717
Ratings
30
5
50
1
100
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
Measurement taken within 1 second of on-time.
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
0.083
0.023
-
0.92
0.44
100
0.115
-
1.2
-
3
2
4
±5
0.15
0.04
1
3
3
-
2
-
1.4
10
-
A
rms
/ A
DC
A
DC
A
P
µA
I
L
=1A
V
L
=30V
P
I
F
=5mA, V
L
=10V
V
L
=15V, f=1MHz
I
L
=1A
-
I
F
=5mA
V
R
=5V
-
-
-
-
-
-
0.1
0.9
-
-
ms
pF
mA
mA
V
µA
pF
ESD Rating
ESD Rating (Human Body Model)
1000 Volts
2
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
30
25
Device Count (N)
LCA717
Typical Turn-On Time Distribution
(N=50, I
F
=5mA, I
L
=120mA)
25
20
15
10
5
0
0.730 0.785 0.840 0.895 0.950 1.005 1.060
Turn-On Time (ms)
25
20
15
10
5
0
Typical Turn-Off Time Distribution
(N=50, I
F
=5mA, I
L
=120mA)
Device Count (N)
20
15
10
5
0
1.215 1.230 1.245 1.260 1.275 1.290 1.305
LED Forward Voltage (V)
Device Count (N)
0.41
0.42
0.43
0.44
0.45
0.46
Turn-Off Time (ms)
Typical I
F
for Switch Operation
(N=50, I
L
=500mA)
25
Device Count (N)
Typical On-Resistance Distribution
(N=50, I
F
=2mA, I
L
=1A)
20
20
Blocking Voltage Distribution
(N=50)
Device Count (N)
15
Device Count (N)
80.0
81.5
83.0
84.5
86.0
87.5
89.0
20
15
10
5
0
15
10
10
5
5
0
0.105
0.110 0.115 0.120 0.125
LED Forward Current (mA)
0.130
0
36.4
36.7
37.0 37.3 37.6 37.9
Blocking Voltage (V
P
)
38.2
On-Resistance (m )
Typical LED Forward Voltage Drop
vs. Temperature
1.6
LED Forward Voltage (V)
1.5
1.4
1.3
1.2
1.1
1.0
-40
I
F
=5mA
I
F
=2mA
I
F
=1mA
-20
0
20
40
60
Temperature (ºC)
80
100
Turn-On Time ( s)
5000
Typical Turn-On Time
vs. LED Forward Current
450
Turn-Off Time ( s)
430
410
390
370
350
0
10
20
30
40
LED Forward Current (mA)
50
0
Typical Turn-Off Time
vs. LED Forward Current
I
F
=50mA
I
F
=20mA
I
F
=10mA
4000
3000
2000
1000
0
10
20
30
40
LED Forward Current (mA)
50
0.17
LED Forward Current (mA)
0.16
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=1A)
Typical Turn-On Time
vs. Temperature
4000
3500
Turn-On Time ( s)
3000
2500
2000
1500
1000
500
I
F
=2mA
I
F
=5mA
I
F
=1mA
Turn-Off Time ( s)
700
650
600
550
500
450
400
350
-20
0
20
40
60
Temperature (ºC)
80
100
300
-40
-20
Typical Turn-Off Time
vs. Temperature
I
F
=1mA
I
F
=2mA
0.15
0.14
0.13
0.12
0.11
0.10
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=5mA
0
-40
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R04
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical On-Resistance
vs. Temperature
(I
F
=2mA, I
L
=1A)
LCA717
Maximum Load Current
vs. Temperature
5
DC-Only Configuration (A
DC
)
Load Current (A)
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
0.12
0.11
On-Resistance ( )
Typical Load Current
vs. Load Voltage
(I
F
=2mA)
4
Load Current
3
AC/DC Configuration (A
DC
/A
rms
)
2
1
0
-20
0
20
40
60
Temperature (ºC)
80
100
0.10
0.09
0.08
0.07
0.06
0.05
-40
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-2.0
-0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20
Load Voltage (V)
39.0
Blocking Voltage (V
P
)
38.5
38.0
37.5
37.0
36.5
36.0
35.5
-40
Typical Blocking Voltage
vs. Temperature
(I
L
=1 A)
Leakage Current (nA)
350
300
250
200
150
100
50
0
-40
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(V
L
=30V)
Energy Rating Curve
8
7
Load Current (A)
6
5
4
3
2
1
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
0
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R04
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Manufacturing Information
Moisture Sensitivity
LCA717
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LCA717 / LCA717S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LCA717 / LCA717S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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