REVISIONS
LTR
A
B
DESCRIPTION
Added device type11. Change limits for I
CC
and I
CCDR1
in table I.
Add: note to paragraph 1.2.2 and table I, conditions. Add device types
12 through 17. Add vendor CAGE code 0EU86. Add condition D to
paragraphs 4.2.a.1 and 4.3.3.b.1. Changes to table I and dimensions
to case outlines T, U, X, Y, and Z. Table I, add note 3 to C
IN
and C
OUT
.
Add case outline N.
Updated drawing to latest requirements. -sld
DATE (YR-MO-DA)
98-06-22
01-03-01
APPROVED
K. A. Cottongim
Raymond Monnin
C
D
01-03-21
06-03-07
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
D
18
REV
SHEET
PREPARED BY
Gary Zahn
CHECKED BY
Michael C. Jones
D
19
D
20
D
21
D
1
D
22
D
2
D
23
D
3
D
24
D
25
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
14
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil/
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, MEMORY, DIGITAL, CMOS,
SRAM, 128K x 8-BIT, MONOLITHIC SILICON
DRAWING APPROVAL DATE
96-10-30
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
25
5962-96691
5962-E298-06
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
⏐
⏐
⏐
Federal
stock class
designator
\
-
⏐
⏐
⏐
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. Device classes H and K RHA marked devices shall meet the
MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA
device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type 1/ 2/
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
Generic number
Circuit function
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
SRAM, 128K X 8-bit
Access time
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
17 ns
15 ns
55 ns
45 ns
35 ns
25 ns
20 ns
17 ns
96691
01
⏐
⏐
⏐
Device
type
(see 1.2.2)
/
H
⏐
⏐
⏐
Device
class
designator
(see 1.2.3)
X
⏐
⏐
⏐
Case
outline
(see 1.2.4)
X
⏐
⏐
⏐
Lead
finish
(see 1.2.5)
WMS128K8-120
WMS128K8-100
WMS128K8-85
WMS128K8-70
MT5C128K8-55, WMS128K8-55
MT5C128K8-45, WMS128K8-45
MT5C128K8-35, WMS128K8-35
MT5C128K8-25, WMS128K8-25
MT5C128K8-20, WMS128K8-20
MT5C128K8-17, WMS128K8-17
WMS128K8-15
MT5C128K8-55L
MT5C128K8-45L
MT5C128K8-35L
MT5C128K8-25L
MT5C128K8-20L
MT5C128K8-17L
1/
2/
Due to the nature of the 4 transistor design of the die used in these device types, topologically pure testing is important,
particularly for high reliability applications. The device manufacturer should be consulted concerning their testing methods
and algorithms.
Device types and case outlines may be similar to the device types and case outlines listed on SMD 5962-89598.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
D
5962-96691
SHEET
2
DSCC FORM 2234
APR 97
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All
levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and
E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C, and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
H
G
E
D
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
N
T
U
X
Y
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
32
32
32
36
32
36
Package style
Co-fired ceramic flat pack, evolutionary pinout,
with or without pedestal
Co-fired ceramic SOJ, evolutionary pinout
Co-fired ceramic SOJ, revolutionary pinout
Co-fired ceramic flat pack, revolutionary pinout,
with or without pedestal and with or without
non-conductive tie bar
Co-fired ceramic dual-in-line, evolutionary pinout
Co-fired ceramic SOJ, revolutionary pinout
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
)..........................................................
Signal voltage range (V
G
) ............................................................
Power dissipation (P
D
).................................................................
Storage temperature range .........................................................
Lead temperature (soldering, 10 seconds) ..................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)..........................................................
Input low voltage range (V
IL
)........................................................
Input high voltage range (V
IH
)......................................................
Case operating temperature (T
C
) ................................................
1/
+4.5 V dc to +5.5 V dc
-0.3 V dc to +0.8 V dc
+2.2 V dc to V
CC
+ 0.3 V dc
-55°C to +125°C
-0.5 V dc to +7.0 V dc
-0.5 V dc to V
CC
+0.5 V dc
0.88 W maximum
-65°C to +150°C
+300°C
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
D
5962-96691
SHEET
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this
drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
D
5962-96691
SHEET
4
DSCC FORM 2234
APR 97
3.2.5 Block diagram(s). The block diagram(s) shall be as specified on figure 6.
3.2.6 Output load circuit. The output load circuit used to test product shall be equivalent to the circuit specified on figure 7.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015
of MIL-STD-883.
T
A
as specified in accordance with table 1 of method 1015 of MIL-STD-883.
(2)
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
D
5962-96691
SHEET
5
DSCC FORM 2234
APR 97
NXP MCU
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