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IDT77211L155PQF9

产品描述ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208
产品类别无线/射频/通信    电信电路   
文件大小297KB,共27页
制造商IDT (Integrated Device Technology)
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IDT77211L155PQF9概述

ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208

IDT77211L155PQF9规格参数

参数名称属性值
零件包装代码QFP
包装说明FQFP,
针数208
Reach Compliance Codeunknow
JESD-30 代码S-PQFP-G208
JESD-609代码e0
长度28 mm
功能数量1
端子数量208
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码FQFP
封装形状SQUARE
封装形式FLATPACK, FINE PITCH
认证状态Not Qualified
座面最大高度3.45 mm
标称供电电压5 V
表面贴装YES
技术CMOS
电信集成电路类型ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
宽度28 mm
Base Number Matches1

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155 Mbps ATM SAR
CONTROLLER FOR
PCI-BASED NETWORKING
APPLICATIONS
x
IDT77211
Key .eatures
Full-duplex Segmentation and Reassembly (SAR) at
155 Mbps "wire-speed" (310 Mbps aggregate speed).
Performs ATM layer protocol functions.
Supports AAL5, AAL3/4, "AAL0" and "Raw Cell" formats.
Supports Constant Bit Rate (CBR)Variable Bit Rate (VBR)
and Unassigned Bit Rate (UBR) service classes.
Reassembles received CS-PDUs directly into host memory.
Two buffer pools for independant or chained reassembly
Segments CS-PDUs ready for transmission directly from
host memory.
PCI bus master interface for efficient, low latency DMA
transfers with host system.
Operates with ATM networks up to 155.52 Mbps.
Up to 16K open transmit connections.
Up to 16K simultaneous receive connections.
Glue-less integration to host system's PCI bus.
UTOPIA Interface to PHY.
Utility & Management Interface to PHY.
Standalone controller: embedded processor not required.
Supports high-performance, lowest-cost ATM NIC solution.
Supports Big/Little endian on PCI interface
Descriptions
x
x
x
x
x
x
x
x
x
x
x
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x
x
x
The IDT77211 NICStAR
is a member of IDT's family of products for
Asynchronous Transfer Mode (ATM) networks. The NICStAR performs
both the ATM Adaption Layer (AAL) Segmentation and Reassembly
(SAR) function and the ATM layer protocol functions.
A Network Interface Card (NIC) or internetworking product based on
the NICStAR uses host memory, rather than local memory, to reassemble
Convergence Sublayer Protocol Data Units (CS-PDUs) from ATM cell
payloads received from the network. When transmitting, as CS-PDUs
become ready, they are queued in host memory and segmented by the
NICStAR into ATM cell payloads. From this, the NICStAR then creates
complete 53-byte ATM cells which are sent through the network. The
NICStAR's on-chip PCI bus master interface provides efficient, low latency
DMA transfers with the host system, while it's UTOPIA interface provides
direct connection to PHY components used in 25.6 Mbps to 155 Mbps ATM
networks.
The IDT77211 is fabricated using state-of-the-art CMOS technology,
providing the highest levels of integration, performance and reliability, with
the low-power consumption characteristics of CMOS.
System-Level .unctional Block Diagram
32K x32
SRAM
PCI BUS
PROM
32
8
Rx UTOPIA Bus
PCI Interface
8
33MHZ
32
IDT77211
155Mbps
PCI ATM
SAR
155Mbps
PHY
2
2
Tx UTOPIA Bus
8
Utility Bus
8
4
50.0MHZ OSC.
EEPROM
3502 drw 01
MARCH 2001
1
©2001 Integrated Device Technology, Inc.
DSC-3502/6

IDT77211L155PQF9相似产品对比

IDT77211L155PQF9 IDT77211L155PQF8
描述 ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208 ATM Segmentation and Reassembly Device, 1-Func, CMOS, PQFP208, PLASTIC, QFP-208
零件包装代码 QFP QFP
包装说明 FQFP, FQFP,
针数 208 208
Reach Compliance Code unknow unknow
JESD-30 代码 S-PQFP-G208 S-PQFP-G208
JESD-609代码 e0 e0
长度 28 mm 28 mm
功能数量 1 1
端子数量 208 208
最高工作温度 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FQFP FQFP
封装形状 SQUARE SQUARE
封装形式 FLATPACK, FINE PITCH FLATPACK, FINE PITCH
认证状态 Not Qualified Not Qualified
座面最大高度 3.45 mm 3.45 mm
标称供电电压 5 V 5 V
表面贴装 YES YES
技术 CMOS CMOS
电信集成电路类型 ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
温度等级 COMMERCIAL COMMERCIAL
端子面层 TIN LEAD TIN LEAD
端子形式 GULL WING GULL WING
端子节距 0.5 mm 0.5 mm
端子位置 QUAD QUAD
宽度 28 mm 28 mm
Base Number Matches 1 1

 
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