WIMA MKP-Y2
Metallized Polypropylene (PP) RFI-Capacitors Class Y2
in PCM 10 mm to 37.5 mm. Capacitances from 1000 pF to 1.0
mF.
Rated Voltage 300 VAC.
Special Features
˜
Reliable self-healing
˜
High degree of interference
suppression due to good
attenuation and low ESR
˜
According to RoHS 2011/65/EU
D
Electrical Data
Capacitance range:
1000 pF to 1.0
m
F
Rated voltage:
300 VAC
Continuous DC voltage*
(general guide):
1000 V
Capacitance tolerances:
±20%, ±10%, ±5%
Operating temperature range:
–55) C to +105) C
Climatic test category:
55/105/56 in accordance with IEC
Passive flammability class:
B for capacitors with V
1750 mm
3
C for capacitors with V
1750 mm
3
Dissipation factors
at + 20) C: tan
d
at f
1 kHz
10 kHz
100 kHz
Approvals:
Country
Germany
USA/Canada
Dielectric
Vacuum-deposited
electrode
Metal contact layer
(schoopage)
Terminating wire
Typical Applications
Class Y2 RFI applications to meet
EMC regulations
˜
Capacitors connected to the
mains between phase or neutral
and earthed casing
˜
By-passing of the basic or
supplementary insulation, pulse
peak voltage
5 kV
Insulation resistance
at +20+ C:
C
0.33
mF:
15 x10
3
M¸
C
0.33
mF:
5 000 sec (M¸ x
mF)
Measuring voltage: 100 V/1 min.
Test specifications:
In accordance with IEC 60384-14
Maximum pulse rise time:
100 V/msec for pulses equal to a voltage
amplitude with 2 x 300 VAC = 425 V
according to IEC 60384-14
Test voltage:
2700 VDC, 2 sec.
Reliability:
Operational life
300 000 hours
Failure rate
2 fit (0.5 x U
r
and 40) C)
0.1
mF
< C
1.0
mF
20 x 10
-4
60 x 10
-4
–
Symbol
Approval-No.
40008997
E 134915
C
0.1
mF
15 x 10
-4
20 x 10
-4
100
x 10
-4
Authority
VDE
UL
Specification
IEC 60384-14/4
UL 60384-14
CAN/CSA-E60384-14
Construction
Dielectric:
Polypropylene (PP) film
Capacitor electrodes:
Vacuum-deposited
Internal construction:
Mechanical Tests
Pull test on pins:
10 N in direction of pins
according to IEC 60068-2-21
Vibration:
6 hours at 10 ... 2000 Hz and
0.75 mm displacement amplitude or 10 g
in accordance with IEC 60068-2-6
Low air density:
1kPa = 10 mbar in
accordance with IEC 60068-2-13
Bump test:
4000 bumps at 390 m/sec
2
in
accordance with IEC 60068-2-29
Packing
Available taped and reeled.
Detailed taping information and graphs
at the end of the catalogue.
PCM 10: triple series connection
Encapsulation:
Solvent-resistant, flame-retardant plastic
case with epoxy resin seal, UL 94 V-0
Terminations:
Tinned wire.
Marking:
Colour: Red. Marking: Black.
* If safety-approved EMI suppression
capacitors are operated with a DC vol-
tage being above the specified AC voltage
rating the given approvals are no longer
valid (IEC 60384-14).
Furthermore the permissible pulse rise time
du/dt (F
max
.) will be subject to a reduction
according to
F
max.
= F
r
x 2 x UAC / UDC
if the DC operating voltage UDC is higher
than 2 x UAC
For further details and graphs please
refer to Technical Information.
84
04.16
D
Recommendation for Processing
and Application of
Through-Hole Capacitors
Soldering Process
Internal temperature of the capacitor must
be kept as follows:
Polyester:
preheating: T
max.
125° C
soldering: T
max.
135° C
Polypropylene: preheating: T
max.
100° C
soldering: T
max.
110° C
Single wave soldering
Soldering bath temperature: T
260 ° C
Dwell time:
t
5 sec
Double wave soldering
Soldering bath temperature: T
260 ° C
Dwell time:
St
5 sec
Due to different soldering processes and
heat requirements the graphs are to be
regarded as a recommendation only.
WIMA Quality and Environmental Philosophy
ISO 9001:2008 Certification
ISO 9001:2008 is an international basic
standard of quality assurance systems
for all branches of industry. The approval
according to ISO 9001:2008 of our facto-
ries by the infaz (Institut für Auditierung und
Zertifizierung) certifies that organisation,
equipment and monitoring of quality assu-
rance in our factories correspond to inter-
nationally recognized standards.
WIMA Environmental Policy
All WIMA capacitors, irrespective of
whether through-hole devices or SMD,
are made of environmentally friendly
materials. Neither during manufacture
nor in the product itself any toxic sub-
stances are used, e.g.
–
–
–
–
–
Lead
PCB
CFC
Hydrocarbon chloride
Chromium 6+
–
–
–
–
–
PBB/PBDE
Arsenic
Cadmium
Mercury
etc.
RoHS Compliance
According to the RoHS Directive 2011/65/EU
certain hazardous substances like e.g. lead,
cadmium, mercury must not be used any
longer in electronic equipment as of July 1st,
2006. For the sake of the environment WIMA
has refraind from using such substances since
years already.
WIMA WPCS
The WIMA Process Control System (WPCS)
is a quality surveillance and optimization
system developed by WIMA. WPCS is a
major part of the quality-oriented WIMA
production. Points of application during
production process:
”
”
”
”
”
”
”
incoming material inspection
metallization
film inspection
schoopage
pre-healing
pin attachment
cast resin preparation/
encapsulation
”
100% final inspection
”
Testing as per customer requirements
We merely use pure, recyclable materials
for packing our components, such as:
”
”
”
”
carton
cardboard
adhesive tape made of paper
polystyrene
WIMA Kondensatoren sind bleifrei
konform RoHS 2011/65/EU
WIMA capacitors are lead free
in accordance with RoHS 2011/65/EU
Tape for lead-free WIMA capacitors
We almost completely refrain from using
packing materials such as:
”
foamed polystyrene (Styropor®)
”
adhesive tapes made of plastic
”
metal clips
DIN EN ISO 14001:2004
WIMA’s environmental management has
been established in accordance with the
guidelines of DIN EN ISO 14001:2004 to
optimize the production processes with
regard to energy and resources.
04.16
15
D
Typical Dimensions for
Taping Configuration
P
2
P
Vh
H
H
1
W
2
P
1
Diagram 1:
PCM 2.5/5/7.5mm
W
0
D
0
F
P
0
P
d
P
W
W
1
H
1
t
P
1
P
1
H
d
F
P
0
P
2
F
P
2
d
P
0
Diagram 2: PCM 10/15 mm
Diagram 3: PCM 22.5 and 27.5*mm
*PCM 27.5 taping possible with two feed holes between components
Dimensions for Radial Taping
Designation
Carrier tape width
Hold-down tape width
Hole position
Hold-down tape position
Feed hole diameter
Pitch of component
Feed hole pitch
Feed hole centre
to pin
Hole centre to
component centre
Feed hole centre to bottom
edge of the component
Feed hole centre to top
edge of the component
Pin spacing at
upper edge of carrier tape
Pin diameter
Component alignment
Total tape thickness
Package
(see also page 146)
Unit
Dims in mm.
„
Symbol
PCM 2.5 taping
W
W
0
W
1
W
2
D
0
P
P
0
P
1
P
2
H
H
1
F
d
Dh
t
18.0
p0.5
6.0
for hot-sealing
adhesive tape
PCM 5 taping
18.0
p0.5
6.0
for hot-sealing
adhesive tape
PCM 7.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 10 taping*
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 15 taping*
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 22.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 27.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
25.4
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
25.4
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
38.1
p1.5
12.7
p0.3
7.8
p0.7
19.05
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
30.0 to 43.0
22.5
p0.8
0.8
–0.05
p
3.0 max.
0.7
p0.2
54
p2
B 60
p2
68
p2
depending
on PCM and
component dimensions
+0,08
cumulative pitch
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
*
38.1
p1.5
or 50.8
p1.5
12.7
p0.3
5.3
p0.7
19.05
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
35.0 to 45.0
27.5
p0.8
0.8
–0.05
p
3.0 max.
0.7
p0.2
+0.08
cumulative pitch
error max.
1.0 mm/20 pitch
5.1
p0.5
6.35
p1.3
16.5
p0.3
18.5
p0.5
H+H
component
< H
1
32.25 max.
2.5
p0.5
0.4
p0.05
p
2.0 max.
0.7
p0.2
3.85
p0.7
6.35
p1.3
16.5
p0.3
18.5
p0.5
H+H
component
< H
1
32.25 max.
5.0
+0.8
–0.2
2.6
p0.7
6.35
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
24.5 to 31.5
7.5
p0.8
„
7.7
p0.7
12.7
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
25.0 to 31.5
10.0
p0.8
+0.06
„
5.2
p0.7
12.7
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
26.0 to 37.0
15
p0.8
+0,06
0.5
p0.05
p
2.0 max.
0.7
p0.2
ROLL/AMMO
0.5
p0.05
or
0.6
–0.05
0.5
p0.05
or
0.6
–0.05
0.8
–0.05
p
3.0 max.
0.7
p0.2
AMMO
+0,08
p
3.0 max.
0.7
p0.2
p
3.0 max.
0.7
p0.2
52
p2
B 58
p2
or
66
p2
REEL
P
360 max.
P
30
p1
B
52
p2
58
p2
depending on
comp. dimensions
REEL
P
360 max.
P
30
p1
REEL
P
500 max.
P
25
p1
see details page 147.
Please clarify customer-specific deviations with the manufacturer.
Diameter of pins see General Data.
04.16
*
PCM 10 and PCM 15 can be crimped to PCM 7.5.
Position of components according to PCM 7.5 (sketch 1). P
0
= 12.7 or 15.0 is possible
145
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
