About Laird
Laird is a global technology company focused on providing
systems, components and solutions that protect electronics from
electromagnetic interference and heat, and that enable connectivity
in mission-critical wireless applications and antenna systems.
We are a global leader in the field of radio frequency (RF) engineering
and in the design, development and supply of innovative technology
that allows people, organisations and applications to connect
efficiently.
Our aim is to be a trusted partner to our customers by delivering
problem-solving solutions through Innovation, Reliable Fulfilment,
and Speed.
Laird partners with its customers to design custom thermal solutions
for applications in many industries including:
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Medical Diagnostics
Medical Imaging
Battery Cooling
Industrial Laser Systems
Optoelectronics
Analytical Instrumentation
Semiconductor Fabrication
Aerospace Defense
Food & Beverage
Automotive
Thermoelectrics are ideal for applications that require active cooling
to below ambient and have cooling capacity requirements < 600
Watts. A design engineer should consider TEMs when the system
design criteria includes such factors as precise temperature control,
high reliability, compact geometry constraints, low weight and
environmental friendly requirements.
Benefits of Using
Thermoelectrics
TEMs have several advantages over alternate cooling technologies:
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They have no moving parts, so the solid state construction results
in high reliability and units can be mounted in any orientation.
TEMs can cool devices down to well below ambient. Colder
temperatures can be achieved, down to minus 100°C, by using
a multistage thermoelectric module in a vacuum environment.
Thermoelectrics are able to heat and cool by simply reversing the
polarity, which changes the direction of heat transfer. This allows
temperature control to be very precise, where up to ±0.01°C can
be maintained under steady-state conditions.
In heating mode, TEMs are much more efficient than
conventional resistant heaters because they generate heat
from input power supplied plus additional heat generated by
the heat pumping action.
Devices are environmentally friendly because they use no CFC’s
and electrical noise is minimal.
TEMs can be used as energy harvesters, turning waste heat into
usable output DC power.
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As an industry leader in high-performance Engineered Thermal
Systems that demand high system uptime, Laird provides the
knowledge, innovation, and resources to ensure exceptional
thermal performance and customer satisfaction for applications in
the medical, analytical, telecom, industrial, and consumer markets.
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A Brief Introduction to
Thermoelectrics
Solid state heat pumps have been in existence since the discovery of
the Peltier effect in 1834. The devices became commercially available
several decades ago with the development of advanced semiconductor
thermocouple materials in combination with ceramics substrates.
Thermoelectric modules (TEMs) are solid-state heat pumps that require
a heat exchanger to dissipate heat utilizing the Peltier Effect. During
operation, DC current flows through the TEM to create heat transfer
and a temperature differential across the ceramic substrates, causing
one side of the TEM to be cold, while the other side is hot. A standard
single-stage TEM can achieve temperature differentials of up to 70°C.
A typical TEM’s geometric footprint can vary from 2 x 2 mm’s to 62 x
62 mm’s and are light in weight. This makes thermoelectrics ideal for
applications with tight geometric space constraints and low weight
requirements when compared too much larger cooling technologies,
such as conventional compressor-based systems. TEMs can also be
used as a power generator to convert waste heat into usable output
DC power.
82-123°C
Thermoelectric Product Line
Laird designs and manufactures thermoelectric modules (TEMs)
which adhere to strict process control standards and pass/fail
criteria, assuring our customers receive the best possible modules.
Our extensive standard product portfolio covers a wide range
of cooling capacities, temperature differentials, input power
requirements and geometric footprints. Standard finishing options
are available to accommodate alternate lead lengths, lapping
thickness tolerances, and moisture protective sealants. Standard
pre-tinning and solder constructions are available to accommodate
solder-able mounting of the TEM to the heat exchanger, or
processing of TEM through a reflow oven to solder onto an
optoelectronic package.
MS Series
0.3
–
40 W
Temperature
Differential (ΔT)
ZT Series
18
–
84 W
Standard
Operating
Temperature
< 80°C
UltraTEC Series
69
–
341 W
CP Series
2
–
120 W
Annular Series
3.7
–
67 W
OptoTEC
0.2
–
9 W
0
65-72°C
PolarTEC Series
18
–
72 W
Cooling Capacity (W)
340
ThermaTEC Series
16
–
72 W
100K+
No Thermal Cycles
PC Series
54
–
117 W
500K+
High Operating
Temperature
PC < 120°C
HT < 175°C
Laird offers several thermoelectric module product families that
can be classified by cooling capacity, temperature differential, form
factor or thermal cycling capability. Reference perceptual map as a
general guide as to where each product family fits with regards to these attributes.
Telecommunications
Optical components are used in backhaul communications to transmit data. Temperature stabilization of these devices is required to maintain
peak performance while ambient environment conditions fluctuate over time. Compact form factors are required to keep package size down
as well as no outgassing of thermal component.
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Laser Diodes
Pump Lasers
Photodiodes
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Optical Transceivers
Telecom Enclosures
Medical
Reagents are used in medical diagnostics to help analyze liquid samples obtained from patients to diagnose an illness. TEMs refrigerate the
reagents to extend their life and keep costs down. Molecular diagnostics use TEMs to thermal cycle DNA samples to create millions of strands
of DNA for analysis. Medical lasers use TEMs to keep temperature of laser stable and for patient comfort during treatment.
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Medical Imaging
Medical Diagnostics
Medical Lasers
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Analytical Instrumentation
Molecular Diagnostics
Industrial & Instrumentation
Operating IR detectors and CCD’s at low temperatures limits the noise they are exposed too. This expands the light spectrum they are able
to capture and increase resolution. Industrial lasers and metrology instrumentation use TEMs for temperature stabilization to maintain peak
performance. Digital printers use TEMs to control the humidity and optimize the ink drying process in high volume production runs.
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CCD Cameras
Thermal Imaging
Kiosks
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Metrology Instrumentation
Digital Color Printing
Industrial Laser Systems
TEM Rapid Prototyping Center
Since there are so many unique attributes that need to be ascertained for each application,
often a customized TEM will yield a more optimal thermal solution. Laird offers strong
engineering services with a global presence that supports onsite concept generation,
thermal modeling, thermal design and rapid prototyping. We also offer validation test
services to meet unique compliance standards for each industry, such as Telcordia,
MIL-STDs or standards specific to unique application. Minimum order quantity (MOQ)
applies for all custom TEM designs and validation testing.
Custom Thermoelectric Modules
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Patterning and Plating on Substrates
TE Semiconductor Processing
Tooling Fabrication
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TEM Assembly
Lapping, Wiring and Sealing
Test Validation
CP Series
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Designed for high
current, large heat
pumping applications
Wide product breadth
that covers many form
factors, input power
requirements and heat
pumping capacities
Ideal for medical diagnostics,
analytical instrumentation,
photonics laser systems and
battery cooling
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QMAX
(1)
(WATTS)
CP08,127,05,L1,W4.5
22.4
CP08,127,06,L1,W4.5
18.1
CP08,31,06,L1,W4.5
4.4
CP08,63,06,L1,W4.5
9
CP08,71,06,L,W4.5
10.1
CP085,127,06,L1,W4.5
20.2
CP10,127,05,L1,W4.5
33.4
CP10,127,06,L1,W4.5
25.7
CP10,127,08,L1,W4.5
21.4
CP10,131,04,L1,W4.5
54.1
CP10,254,06,L1,W4.5
51.4
CP10,31,05,L1,W4.5
8.2
CP10,31,06,L,W4.5
6.3
CP10,31,08,L1,W4.5
5.3
CP10,63,05,L1,W4.5
16.6
CP10,63,06,L1,W4.5
12.7
CP10,71,05,L,W4.4
18.7
CP10,71,06,L,W4.5
14.4
CP12,161,04,L1,W4.5
69.3
CP12,161,06,L1,W4.5
52.2
CP14,127,045,L1,W4.5
72
CP14,127,06,L1,W4.5
51.4
CP14,127,10,L1,W4.5
33.4
CP14,17,06,L,W4.5
6.9
CP14,17,10,L,W4.5
4.5
CP14,199,045,L1,W4.5 115.7
CP14,199,06,L1,W4.5
80.9
CP14,31,045,L,W4.5
20.4
CP14,31,10,L1,W4.5
8.2
CP14,35,045,L1,W4.5
19
CP14,63,045,L,W4.4
36.6
CP14,63,06,L,W4.5
25.4
CP14,63,10,L,W4.5
16.6
CP14,71,045,L1,W4.5
38.5
CP14,71,06,L1,W4.5
28.7
CP14,71,10,L1,W4.5
18.7
CP2,127,06,L1,W4.5
120
CP2,127,10,L1,W4.5
77.1
CP2,31,06,L1,W4.5
29.3
CP2,31,10,L1,W4.5
18.8
CP2,71,06,L1,W4.5
67
PART NO.
IMAX
VMAX
∆TMAX
(AMPS) (VOLTS)
(°C)
2.6
15.4
67
2.1
15.4
67
2.1
3.8
67
2.1
7.6
67
2.1
8.6
67
2.7
15.3
66
3.9
15.4
67
3
15.4
67
2.5
15.4
67
6.1
14.9
67
3.0/6.0 30.8/15.4
67
3.9
3.8
67
3
3.75
67
2.5
3.8
67
3.9
7.6
67
3
7.6
67
3.9
8.6
67
3
8.6
67
6.4
18.3
67
4.8
18.3
67
8.5
15.4
65
6
15.4
67
3.9
15.4
68
6
2.06
67
3.9
2.06
68
8.5
22.4
65
6
22.7
67
8.7
4.0
68
3.9
3.75
68
8.5
4.2
65
8.5
7.1
65
6
7.1
67
3.9
7.1
67
8.5
8.6
65
6
8.6
67
3.9
8.6
68
14
15.4
67
9
15.4
68
14
3.8
67
9
3.8
68
14
8.6
68
DIM A
(mm)
25
25
12
12
18
30
30
30
30
40
60
15
15
15
15
15
23
23
40
40
40
40
40
15
15
40
40
15
20
15
20
20
20
30
30
30
62
62
30
30
44
DIM B
(mm)
25
25
12
25
18
30
30
30
30
23
30
15
15
15
30
30
23
23
40
40
40
40
40
15
15
40
40
30
20
30
40
40
40
30
30
30
62
62
30
30
44
DIM C
(mm)
25
25
12
12
18
30
30
30
30
40
30
15
15
15
15
15
23
23
40
40
40
40
40
15
15
40
40
15
20
15
20
20
20
30
30
30
62
62
30
30
44
DIM D
(mm)
3.1
3.4
3.4
3.4
3.4
3.6
3.2
3.6
4
3
3.6
3.2
3.6
4
3.2
3.6
3.2
3.6
3.3
3.6
3.3
3.8
4.7
3.8
4.7
3.3
3.81
3.32
4.7
3.3
3.31
3.81
4.7
3.3
3.8
4.7
4.6
5.6
4.6
5.6
4.6
Wire
(AWG)
26
26
26
26
26
26
24
24
24
24
24
24
24
24
24
24
24
24
22
22
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
Annular Series
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Round or square hole
configurations available
Rapid prototyping available
to accommodate unique
shape requirements
PART NO.
RH14,14,045,L,W4.4
RH14,14,10,L,W4.5
RH14,14,06,L1,W4.5
RH14,32,06,L1,W4.5
SH10,23,06,L1,W4.5
SH08,28,05,L1,W4.5
SH10,125,05,L1,W4.5
SH14,125,10,L1,W4.5
SH14,125,06,L1,W4.5
SH14,125,045,L1,W4.5
Features center hole for
transmission of light, wires,
probes or mounting hardware
QMAX
(1)
(WATTS)
7.6
3.7
5.7
12.9
4.7
4.9
32.9
32.9
50.7
67.7
IMAX
(AMPS)
8.5
3.9
6
6
3
2.6
3.9
3.9
6
8.5
VMAX
(VOLTS)
1.7
1.7
1.7
3.9
2.8
3.9
15.2
15.2
15.2
15.2
∆TMAX
(°C)
65
68
67
67
67
67
67
68
67
65
DIM A
(mm)
26
26
26
44
15
14.7
30
40
40
40
DIM B
(mm)
26
26
26
55
15
10.3
30
40
40
40
DIM C
(mm)
26
26
26
55
15
14.7
30
40
40
40
DIM D
(mm)
3.3
4.7
3.8
3.8
3.6
3.1
3.2
4.7
3.8
3.3
DIM E
(mm)
14
14
14
27
7.2
4.4
3.6
4.7
4.7
4.7
SH Series
RH Series
Notes: 1) QMax rated value at ∆T = 0°C, Imax and Vmax,
Th = 25°C; 2) Thickness for non-metallized versions only.
All modules are lead-free. For wiring options contact Laird.
THERELECTRIC MODULES
OptoTEC
TM
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PART NO.
ET12,65,F2A,1312,11,W2.25
ET19,23,F1N,0608,11,W2.25
ET19,35,F1N,0612,11,W2.25
ET20,24,F2A,0709,11,W2.25
ET20,30,F2A,0610,11,W2.25
ET20,31,F1A,0909,11,W2.25
ET20,68,F1A,1313,11,W2.25
HOT12,18,F2A,0606,11,W2.26
HOT12,65,F2A,1312,11,W2.25
HOT15,30,F2A,0610,11,W2.25
HOT15,31,F2A,0909,11,W2.25
HOT15,65,F2A,1312,11,W2.25
HOT20,31,F2A,0909,11,W2.2.5
HOT20,65,F2A,1312,11,W2.25
OT08,04,F0,0203,11,W2.25
OT08,08,F0,0305,11,W2.25
OT08,11,F1,0305,11,W2.25
OT08,18,F0,0505,11,W2.25
OT08,18,F2,0505,11,W2.25
OT08,32,F2,0707,11,W2.25
OT08,66,F0,1009,11,W2.25
OT12,12,F0,0406,11,W2.25
OT12,18,F0,0606,11,W2.25
OT12,18,F2A,0606,11,W2.25
OT12,62,F3,1211,11,W2.25
OT12,66,F0,1211,11,W2.25
OT15,30,F2A,0610,11,W2.25
OT15,66,F0,1211,11,W2.25
OT15,68,F1A,1313,11,W2.25
OT16,18,F2,0606,11,W2.25
OT20,12,F0,0406,11,W2.25
OT20,31,F1,0808,11,W2.25
OT20,32,F0,0808,11,W2.25
OT20,66,F0,1211,11,W2.25
OT24,31,F1,1010,TA,W2.25
OT20,30,F2A,0610,11,W2.25
Miniature Form Factor
Pb-free solder construction
with three solder melt
temperatures
Alumina or Aluminum
Nitride Substrates Available
Designed for laser
diodes, infrared
detectors, pump lasers
and optical transceivers
Internal Solder Melt Temperature
OT
ET
HOT
138°C
232°C
271°C
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OptoTEC – F0
OptoTEC – F1
OptoTEC – F2
OptoTEC – F3
QMAX
(1)
IMAX VMAX
(WATTS) (AMPS) (VOLTS)
5.34
1.2
7.8
3.1
1.9
2.7
4.64
1.9
4.2
3.2
2
2.7
4
2
3.6
4.2
2
3.5
9.16
2
8.2
1.46
1.2
2.1
5.34
1.2
7.8
3.03
1.5
3.6
3.13
1.5
3.7
6.57
1.5
7.8
4.2
2
3.5
8.76
2
7.8
0.22
0.8
0.5
0.44
0.8
0.9
0.6
0.8
1.33
0.97
0.8
2.2
0.97
0.8
2.2
1.72
0.8
3.9
3.6
0.8
7.9
0.97
1.2
1.5
1.46
1.2
2.1
1.46
1.2
2.1
5.01
1.2
7.5
5.3
1.2
8
3.03
1.5
3.6
6.7
1.5
8
6.87
1.5
8.2
2
1.6
2
1.62
2
1.5
4.2
2
3.7
4.4
2
3.6
8.8
2
7.8
5.3
2.5
3.5
4
2
3.6
∆TMAX
(°C)
67
65
65
67
67
67
67
64
64
64
64
64
64
64
67
67
67
67
67
67
67
67
67
67
67
67
67
67
67
67
67
67
67
67
65
67
DIM A DIM B DIM C DIM D
(2)
DIM E
(mm) (mm) (mm)
(mm)
(mm)
13.2
12.1
13.2
2.7
-
6
8.2
6
1.65
-
6
12.2
6
1.65
-
6.6
8.8
10.8
2
-
6.2
10.3
12.3
1.8
-
8.8
8.8
8.8
2.2
-
13.2
13.2
13.2
2.2
-
6
6.2
7.2
2.7
-
13.2
12.1
13.2
2.7
-
6.2
10.3
12.3
2.1
-
8.8
8.8
11
2.4
-
13.2
12.1
13.2
2.4
-
8.8
8.8
11
2.2
-
13.2
12.1
13.2
2.2
-
1.8
3.4
3.4
2.4
-
3.3
3.3
4.9
2.4
-
3.4
5
3.4
2.4
-
4.9
4.9
6.6
2.4
-
5
5
6.7
2.4
-
6.6
6.6
8.3
2.4
-
9.8
8.9
11.4
2.4
-
4.2
6.2
6.2
2.7
-
6.2
6.2
8.3
2.7
-
6
6.2
7.2
2.7
-
12.2
11.2
13.2
2.7
2.0
12.3
11.3
14.4
2.7
-
6.2
10.3
12.3
2.1
-
12.3
11.3
14.4
2.4
-
13.2
13.2
13.2
2.4
-
6
7.6
6
2
-
4.2
6.2
6.2
2.2
-
8.1
8.1
8.1
2.2
-
8.3
8.3
10.3
2.2
-
12.1
11.1
14.2
2.5
-
10
10
10
2.5
-
6.2
10.3
12.3
1.8
-
Notes: 1) QMax rated value at ∆T = 0°C, Imax and Vmax, Th = 25°C; 2) Thickness for non-metallized versions only.
All modules are lead-free. For wiring options contact Laird.
PC Series
•
Designed for thermal
cycling between multiple
temperature set points
Ideal for applications in
molecular diagnostics a
large number of thermal
cycles are required
Specially constructed
to reduce the amount
of stress induced on
the TE elements during
operation
Tested to withstand
more than 500K cycles
without degradation
in performance
Typical eTEC
™
Module
•
QMAX
IMAX VMAX
(WATTS) (AMPS) (VOLTS)
PC4,12,F1,3030,TA,W6
33.4
3.9
14.4
PC5,16,F1,4040,TA,W6
53.2
4.8
18.3
PC7,16,F1,4040,TA,W6
76.3
7
18.3
PC6,12,F1,4040,TA,W6
54.1
6.1
14.9
PC8,12,F1,4040,TA,W6
72
8.5
14.5
PC12,139,F1,3550,TA,W6
117
12.3
15.5
PART NO.
∆TMAX
(°C)
67
67
67
67
67
67
DIM A DIM B DIM C DIM D DIM E
(mm) (mm) (mm) (mm) (mm)
30
30
30
3.2
-
40
40
40
3.7
20
40
40
40
3.3
20
40
40
40
3.0
20
40
40
40
3.3
20
35
50
35
3.0
20
Wire
(AWG)
20
20
20
20
20
20
•
•
PCB设计
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