Electronics Assembly Materials
Electronics Assembly Materials
2011 RECOMMENDED
2012 RECOMMENDED
Table of Contents
Table of Contents
Products
Solder Paste
Fluxes
Solder Wire
Bar Solder
Additional Flux Materials
TSF Products
Other products
Helpful Information
Pages
3-7
8-11
12-13
14-15
16
17
18
19
2
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Formula
Application
Alloy
Product
Characteristics
Coming Soon: NXG3 Zero Halogen Solder Paste
No-Clean Stencil Printing
Sn96.5Ag3.0Cu0.5
NXG3
NXG33
No-Clean Stencil Printing
Sn96.5Ag3.0Cu0.5
Formula
NXG3
manufacturing. NXG33 is engineered for the high thermal de
Zero halogen, lead-free, no-clean solder paste. NXG3 is engineered for
the high thermal demands of assembling with lead-free alloys. Joints are
cosmetically bright
Application
Prints down to 01005 pad sites.
as SnPb joints.
Designed to be reflowable in air as well as nitrogen.
Alloy
Designed to exceed customers' expectations for high yield lea
Residue Characteristics
Typical Metal Percentage and mesh size
Compliant Specifications
Suggested Packaging Style
Light colored
Product
Characteristics
of assembling with lead-free alloys. Joints are cosmetically br
SnPb joints. Prints down
Printing
pad sites. Designed to be r
No-Clean Stencil
to 01005
able in air as well as nitrogen. Post soldering, the NXG33 offe
Sn96.5Ag3.0Cu0.5
mized defects, including head-in-pillow and QFN/BGA voiding
88.5%, -400/+500 (Type 4)
Telcordia Issue 1 GR-78-CORE
IPC/J-STD-004B Flux Designator ROL0
Residue Characteristics
500g jar; 600 or1400g cartridges
Typical Metal Percentage and mesh size
Zero halogen, lead-free, no-clean solder paste. NXG3
Light colored
is engineered for the high thermal demands of as-
88.5%, -400/+500 (Type 4)
sembling with lead-free alloys. Joints are cosmetically
as bright as SnPb joints. Prints down to 01005 pad sites.
Telcordia Issue 1
in air as well
Designed to be reflowable
GR-78-CORE
as nitrogen.
IPC/J-STD-004B Flux Designator ROL0
Light colored
500g jar;
(Type 4)
88.5%, -400/+500
600 or1400g cartridges
Telcordia Issue 1 GR-78-COREIPC/J-STD-004B Flux
Designator ROL0
500g jar or 600g cartridges
Compliant Specifications
Suggested Packaging Style
STANDARD SOLDER PASTE
REFLOW PROFILE
STANDARD SOLDER PASTE
REFLOW PROFILE
FOR
FOR KESTER PASTE CONTAINING
KESTER PASTE CONTAINING
ALLOY: Sn96.5Ag3.0Cu0.5
ALLOYS: Sn96.5Ag3.0Cu0.5 or Sn96.5Ag3.5
Stage 1- Preheat Zone
(Rapid Heating Stage)
The purpose of this zone is to quickly bring the
Stage 1- Preheat Zone
assembly up to a temperature where solder pas
(Rapid Heating Stage)
can become highly chemically active.
The purpose of this zone is to quickly bring the
assembly up to a temperature where solder paste
Stage 2- Soak Zone
can become highly chemically active.
(Temperature Equalization Stage)
The purpose
Stage 2- Soak Zone
of this stage is for the thermal mas
the assembly to
Stage)
(Temperature Equalization
reach a uniform temperature
plateau so
is
there
thermal
small
The purpose of this stage
that
for the
is a very
mass
differentia
between the
uniform temperature
of the assembly to reach a
hottest and coldest soldering locatio
plateau so that there
assembly.
small differential
on the
is a very
between the hottest and coldest soldering loca-
tions on the assembly.
Reflow Zone
Stage 3-
(Rapid Heating and Cooling)
Stage 3- Reflow Zone
of this stage is to rapidly heat the
The purpose
(Rapid Heating and Cooling)
melting (liquidus) temperat
assembly above the
The purpose of this stage is to rapidly heat the as-
of the solder and subsequently cool the assemb
sembly above the melting (liquidus) temperature
down quickly to solidify the solder. Wetting of s
of the solder and subsequently cool the assembly
onto teh substrate and component metalizations
down quickly to solidify the solder. Wetting of
occurs in the reflow zone.
solder onto the substrate and component metal-
izations occurs in the reflow zone.
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3
Kester Lead-Free, Halogen-Free
Formula
Application
Alloy
Product
Characteristics
NXG33
No-Clean Stencil Printing
Sn96.5Ag3.0Cu0.5
Designed to exceed customers’ expectations for high yield lead-free manufacturing. NXG33 is
engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmeti-
cally as bright as SnPb joints. Prints down to 01005 pad sites. Designed to be reflow-able in air
as well as nitrogen. Post soldering, the NXG33 offers minimized defects, including head-in-pillow
and QFN/BGA voiding.
Light colored
88.5%, -400/+500 (Type 4)
Telcordia Issue 1 GR-78-COREIPC/J-STD-004B Flux Designator ROL0
500g jar or 600g cartridges
Residue Characteristics
Typical Metal Percentage and mesh size
Compliant Specifications
Suggested Packaging Style
4
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Kester Lead-Free
Formula
Application
Alloy
Product
Characteristics
Kester Lead-Free
NXG1
No-Clean Stencil Printing
Sn96.5Ag3.0Cu0.5
Designed to exceed customers’ expectations for high yield
lead-free manufacturing. NXG1 is engineered for the high
thermal demands of assembling with lead-free alloys. Joints
are cosmetically as bright as SnPb joints. Prints down to 0201
pad sites. Designed to be reflowable in air as well as nitrogen.
Light colored
88.5%, -325/+500 (Type 3)
Telcordia Issue 1 GR-78-CORE
IPC/J-STD-004B Flux Designator ROL1
500g jar or 600g cartridges
EnviroMark™ 907
Formula
No-Clean Stencil Printing
Sn96.5Ag3.0Cu0.5
NXG1
EM907 is a first generation solder paste engineered for the high
thermal demands of assembling with lead-free alloys. Joints are
cosmetically as bright as SnPb joints. Prints down to 0201 pad
sites. Designed to be reflowable in air as well as nitrogen.
Light colored
88.5%, -325/+500 (Type 3)
Telcordia Issue 1 GR-78-CORE
IPC/J-STD-004B Flux Designator ROL0
500g jar; 600 or 750g DEK cartridges
Residue Characteristics
Typical Metal Percentage
Compliant Specifications
Suggested Packaging Style
Formula
Application
Alloy
Product
Characteristics
EnviroMark™ 828
Water-Soluble Stencil Printing
Sn96.5Ag3.0Cu0.5
Kester EM828 provides excellent printability, activity, cleanability
and low-voiding behavior. EM828 is very robust and can tolerate a
wide variety of printing and reflow conditions. EM828 is a “state of
the art” water-soluble lead-free paste that combines superior activ-
ity, cleanability and low-voiding.
Cleanable in warm water
89.5%, -325/+500 (Type 3)
IPC/J-STD-004B Flux Designator ORH1
500g jar; 600 or 1400g cartridges
Formula
EnviroMark™ 828
Residue Characteristics
Typical Metal Percentage
Compliant Specifications
Suggested Packaging Style
Kester Part # Description
7032130810
7032130811
7006050810
7006050811
7006050819
7004030824
7004030810
7004030811
7035050910
7035050911
NXG1 No-Clean, Type 3, 88.5% metalsl
NXG1 No-Clean, Type 3, 88.5% metalsl
EM907 No-Clean, Type 3, 88.5% metal
EM907 No-Clean, Type 3, 88.5% metal
EM907 No-Clean, Type 3, 88.5% metal
EM828 Water-Soluble, Type 3, 89.5% metal
EM828 Water-Soluble, Type 3, 89.5% metal
EM828 Water-Soluble, Type 3, 89.5% metal
NXG-33 Type 4, 88.5% metal
NXG-33 Type 4, 88.5% metal
Alloy
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Packaging
500g jar
600g cartridge
500g jar
600g cartridge
750g DEK
cartridge
700g DEK
Cartridge
500g jar
600g cartridge
500g jar
600g cartridge
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